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1. 发明申请

US20090246715A1 PLATING METHOD AND METHOD OF FORMING MAGNETIC POLE 审中-公开
标题翻译：成形方法及其形成方法
公开(公告)号：US20090246715A1
公开(公告)日：2009-10-01
申请号：US12246252
申请日：2008-10-06
申请人： Yasunori Kouchi , Masaya Kato
发明人： Yasunori Kouchi , Masaya Kato
IPC分类号： G03F7/20
CPC分类号： G03F7/0751 , C25D5/022 , G11B5/1278 , G11B5/3116 , G11B5/3163
摘要： The plating method is capable of firmly adhering a resist pattern on a plating base in case that, for example, a main magnetic pole of a vertical recording magnetic head is formed by using the resist pattern and accurately configurating a sectional shape of a plated pattern. The plating method comprises the steps of: applying an alkoxylsilyl propyl amino triazine dithiol solution, which is formed by dissolving alkoxylsilyl propyl amino triazine dithiol acting as molecular glue in a solvent, onto the plating base; volatilizing the solvent to form a molecular glue layer; applying resist onto the plating base coated with the molecular glue layer; optically exposing and developing the resist to expose a part of the plating base; and plating the exposed part of the plating base coated with the molecular glue layer.
摘要翻译：在例如通过使用抗蚀剂图案形成垂直记录磁头的主磁极并精确地构造电镀图案的截面形状的情况下，电镀方法能够将抗蚀剂图案牢固地粘附在电镀基板上。电镀方法包括以下步骤：通过将作为分子胶的烷氧基甲硅烷基丙基氨基三嗪二硫醇溶解在溶剂中而形成的烷氧基甲硅烷基丙基氨基三嗪二硫醇溶液施加到电镀基体上; 挥发溶剂形成分子胶层; 将抗蚀剂涂布在涂布有分子胶层的镀覆基底上; 光刻曝光和显影抗蚀剂以暴露电镀基底的一部分; 并镀覆涂有分子胶层的电镀基底的露出部分。

2. 发明申请

US20080011610A1 Plating method 审中-公开
标题翻译：电镀方法
公开(公告)号：US20080011610A1
公开(公告)日：2008-01-17
申请号：US11585091
申请日：2006-10-24
申请人： Masaya Katou , Mutsuo Yoshinami , Yasunori Kouchi , Mamoru Tsuruta
发明人： Masaya Katou , Mutsuo Yoshinami , Yasunori Kouchi , Mamoru Tsuruta
IPC分类号： B05D3/04 , C25D5/02 , B05D3/10
CPC分类号： H05K3/4682 , C25D5/02 , G11B5/102 , G11B5/3163 , G11B5/3173 , H05K1/056 , H05K3/0052 , H05K3/108 , H05K3/242 , H05K2203/0152
摘要： Electrolytic plating can be carried out with a uniform thickness even when the resistance of a plating seed layer is comparatively high, thereby improving the formation precision of products and improving the yield of products. In a method of carrying out plating on a substrate, an insulating layer, which includes conductive parts that conduct electricity to the substrate, is formed on the substrate that is made of a resistor, a plating seed layer, which conducts electricity to the substrate via the conductive parts, is formed on the insulating layer, and a plating film is formed on the plating seed layer with the plating seed layer as a power supply layer.
摘要翻译：即使电镀种子层的电阻较高，电镀也可以均匀地进行，从而提高产品的成型精度，提高产品的成品率。在基板上进行电镀的方法中，在由电阻器，电镀种子层构成的基板上形成有导电部件的绝缘层，该导电部件对基板进行导电，该电镀种子层通过导电部分形成在绝缘层上，并且在电镀种子层上形成镀膜作为电源层。

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