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    • 2. 发明申请
    • METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR LASER ELEMENT
    • 制造氮化物半导体激光元件的方法
    • US20120058585A1
    • 2012-03-08
    • US13225935
    • 2011-09-06
    • Hitoshi MAEGAWAMitsuhiro NONAKAYasunobu SUGIMOTO
    • Hitoshi MAEGAWAMitsuhiro NONAKAYasunobu SUGIMOTO
    • H01L33/26
    • H01S5/0425B82Y20/00H01S5/2201H01S5/222H01S5/3216H01S5/34333H01S2301/176H01S2304/04
    • A method for manufacturing a nitride semiconductor laser element has: (a) forming a nitride semiconductor layer on a substrate; (b) forming a ridge on a surface of the nitride semiconductor; (c) forming a first protective film on the nitride semiconductor layer including the ridge; (d) removing the first protective film from at least a top face of the ridge; (e) forming a conductive layer composed of a two or more of multilayer film with different compositions on the first protective film and the nitride semiconductor layer including the ridge, and introducing a gap at locations of at least at the uppermost conductive layer corresponding to the base portion from the ridge shoulders; and (f) removing part of the conductive layer through a gap to form a void defined the first protective film and the conductive layer at least on the ridge base portions.
    • 一种氮化物半导体激光元件的制造方法具有:(a)在基板上形成氮化物半导体层; (b)在氮化物半导体的表面上形成脊; (c)在包括所述脊的所述氮化物半导体层上形成第一保护膜; (d)从所述脊的至少顶面去除所述第一保护膜; (e)在第一保护膜和包括脊的氮化物半导体层上形成由两种或更多种具有不同组成的多层膜组成的导电层,并且在至少在与第二保护膜相对应的最上层的导电层的位置处引入间隙 从山脊的基部; 以及(f)通过间隙去除所述导电层的一部分,以至少在所述脊基部上形成限定所述第一保护膜和所述导电层的空隙。
    • 4. 发明授权
    • Method for manufacturing nitride semiconductor laser element
    • 氮化物半导体激光元件的制造方法
    • US08415188B2
    • 2013-04-09
    • US13225935
    • 2011-09-06
    • Hitoshi MaegawaMitsuhiro NonakaYasunobu Sugimoto
    • Hitoshi MaegawaMitsuhiro NonakaYasunobu Sugimoto
    • H01L33/26
    • H01S5/0425B82Y20/00H01S5/2201H01S5/222H01S5/3216H01S5/34333H01S2301/176H01S2304/04
    • A method for manufacturing a nitride semiconductor laser element has: (a) forming a nitride semiconductor layer on a substrate; (b) forming a ridge on a surface of the nitride semiconductor; (c) forming a first protective film on the nitride semiconductor layer including the ridge; (d) removing the first protective film from at least a top face of the ridge; (e) forming a conductive layer composed of a two or more of multilayer film with different compositions on the first protective film and the nitride semiconductor layer including the ridge, and introducing a gap at locations of at least at the uppermost conductive layer corresponding to the base portion from the ridge shoulders; and (f) removing part of the conductive layer through a gap to form a void defined by the first protective film and the conductive layer at least on the ridge base portions.
    • 一种氮化物半导体激光元件的制造方法具有:(a)在基板上形成氮化物半导体层; (b)在氮化物半导体的表面上形成脊; (c)在包括所述脊的所述氮化物半导体层上形成第一保护膜; (d)从所述脊的至少顶面去除所述第一保护膜; (e)在第一保护膜和包括脊的氮化物半导体层上形成由两种或更多种具有不同组成的多层膜组成的导电层,并且在至少在与第二保护膜相对应的最上层的导电层的位置处引入间隙 从山脊的基部; 和(f)通过间隙去除导电层的一部分,以至少在脊基部上形成由第一保护膜和导电层限定的空隙。