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1. 发明申请

US20100272402A1 SEMICONDUCTOR DEVICE AND CONNECTOR 有权
标题翻译：半导体器件和连接器
公开(公告)号：US20100272402A1
公开(公告)日：2010-10-28
申请号：US12767960
申请日：2010-04-27
申请人： Yasuki Fukui , Kazuhito Nagura
发明人： Yasuki Fukui , Kazuhito Nagura
IPC分类号： G02B6/36
CPC分类号： G02B6/4292 , G02B6/4201 , G02B6/4249 , G02B6/4253 , G02B6/4255 , H01L33/54 , H01L2224/48227
摘要： A semiconductor device of the present invention includes: a circuit substrate; an optical semiconductor element provided on the circuit substrate; and a sealing resin provided on the circuit substrate, with which the optical semiconductor element is sealed, the sealing resin having a cuboid shape or a cubic shape, the sealing resin having an outer shape having at least one cutout part, in a case where a single cutout part is formed, the cutout part being provided in an area other than a center area of a top surface of the sealing resin, in a case where a plurality of cutout parts are provided, the cutout parts are formed so as not to be symmetric with respect to the central point on the top surface. With this arrangement, it is possible to provide a semiconductor device which can secure prevention of a sealing resin from being, in an erroneous direction, fitted into a connector.
摘要翻译：本发明的半导体器件包括：电路基板; 设置在所述电路基板上的光学半导体元件; 以及设置在所述电路基板上的密封树脂，所述光学半导体元件被密封，所述密封树脂具有长方体形状或立方体形状，所述密封树脂具有至少一个切口部分的外形，在设置有多个切口部的情况下，形成有单个切口部，切口部设置在密封树脂的上表面的中心区域以外的区域，切口部形成为不形成相对于顶表面上的中心点对称。利用这种布置，可以提供一种可以防止密封树脂在错误的方向上嵌入连接器中的半导体器件。

2. 发明申请

US20090220783A1 Adhesive Sheet for Dicing and Die Bonding 审中-公开
标题翻译：用于切割和模具粘合的粘合片
公开(公告)号：US20090220783A1
公开(公告)日：2009-09-03
申请号：US12464182
申请日：2009-05-12
申请人： Yasuki FUKUI , Osamu YAMAZAKI , Naoya SAIKI
发明人： Yasuki FUKUI , Osamu YAMAZAKI , Naoya SAIKI
IPC分类号： B32B9/00
CPC分类号： C08G59/08 , C08G59/3209 , C08G59/44 , C08G59/686 , C09J7/22 , C09J7/38 , C09J2203/326 , H01L21/67132 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/92247 , H01L2225/06575 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/181 , Y02P20/582 , Y10T428/14 , Y10T428/28 , H01L2924/00014 , H01L2924/00 , H01L2924/3512
摘要： An adhesive sheet for dicing and die bonding includes a base material and an adhesive layer releasably laminated on said base material, wherein said adhesive layer has a pressure sensitive adhering property at room temperature and a thermosetting property, the elastic modulus of the adhesive layer before thermosetting is 1.0×103 to 1.0×104 Pa, the melt viscosity at 120° C. of the adhesive layer before thermosetting is 100 to 200 Pa·s, and the time required for the melt viscosity to reach its minimum value is 60 sec or less when the adhesive layer before thermosetting is maintained at a constant temperature of 120° C.
摘要翻译：用于切割和芯片接合的粘合片包括基材和可剥离地层压在所述基材上的粘合剂层，其中所述粘合层在室温下具有压敏粘合性和热固性，热固性之前的粘合剂层的弹性模量为1.0×10 3〜1.0×10 4 Pa，热固化前的粘合剂层的120℃下的熔融粘度为100〜200Pa·s，熔融粘度达到最小值所需的时间为60秒以下热固化前的粘合剂层保持在120℃的恒定温度

3. 发明申请

US20060197211A1 Semiconductor device and method of stacking semiconductor chips 审中-公开
公开(公告)号：US20060197211A1
公开(公告)日：2006-09-07
申请号：US11398636
申请日：2006-04-06
申请人： Koji Miyata , Yasuki Fukui
发明人： Koji Miyata , Yasuki Fukui
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L24/73 , H01L29/0657 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/16145 , H01L2224/16225 , H01L2224/26145 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2224/48479 , H01L2224/73204 , H01L2224/73265 , H01L2224/83139 , H01L2224/85051 , H01L2224/85986 , H01L2224/92247 , H01L2225/0651 , H01L2225/06513 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01079 , H01L2924/10158 , H01L2924/15311 , H01L2224/85186 , H01L2924/10155 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/4554
摘要： In a semiconductor device, two or more semiconductor chips are stacked, a first semiconductor chip has electrical contact pads at such positions that form a mirror image of electrical contact pads provided on a second semiconductor chip; and the electrical contact pads on the first semiconductor chip are positioned opposite to and connected to the corresponding electrical contact pads on the second semiconductor chip. Thus, semiconductor chips can be stacked stably. The semiconductor device is reduced in thickness, and a method of stacking semiconductor chips is offered.

4. 发明授权

US6100594A Semiconductor device and method of manufacturing the same 有权
公开(公告)号：US6100594A
公开(公告)日：2000-08-08
申请号：US223272
申请日：1998-12-30
申请人： Yasuki Fukui , Yoshiki Sota , Yuji Matsune , Atsuya Narai
发明人： Yasuki Fukui , Yoshiki Sota , Yuji Matsune , Atsuya Narai
IPC分类号： H01L25/18 , H01L21/56 , H01L21/98 , H01L23/31 , H01L23/48 , H01L23/52 , H01L25/065 , H01L25/07 , H01L29/40
CPC分类号： H01L25/50 , H01L21/561 , H01L23/3121 , H01L24/49 , H01L24/97 , H01L25/0657 , H01L2224/05554 , H01L2224/16225 , H01L2224/16237 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/48499 , H01L2224/4911 , H01L2224/4945 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/85051 , H01L2224/85181 , H01L2224/85191 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2225/06555 , H01L2225/06558 , H01L2225/06582 , H01L2225/06586 , H01L2225/06593 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/12042 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/3025
摘要： A first semiconductor chip is produced by affixing a thermo-compression sheet to the back surface of a wafer having a circuit formed on its front surface. The first semiconductor chip is mounted on a circuit board including an insulating substrate and a wiring layer provided on the insulating substrate so that the back surface of the first semiconductor chip faces the circuit board. A second semiconductor chip produced in the same manner as the first semiconductor chip is mounted on the first semiconductor chip with its back surface facing the first semiconductor chip. Each of the first and second semiconductor chips is wire-bonded to the wiring layer with a wire. The first and second semiconductor chips and the wire are sealed with a sealing resin. The wiring layer is connected to external connection terminals through via holes provided in the insulating substrate.

5. 发明授权

US06352879B1 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US06352879B1
公开(公告)日：2002-03-05
申请号：US09604081
申请日：2000-06-27
申请人： Yasuki Fukui , Yoshiki Sota , Yuji Matsune , Atsuya Narai
发明人： Yasuki Fukui , Yoshiki Sota , Yuji Matsune , Atsuya Narai
IPC分类号： H01L2144
CPC分类号： H01L25/50 , H01L21/561 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/97 , H01L25/0657 , H01L2224/05554 , H01L2224/16225 , H01L2224/16237 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/48499 , H01L2224/4911 , H01L2224/4945 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/85051 , H01L2224/85181 , H01L2224/85191 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2225/06555 , H01L2225/06558 , H01L2225/06582 , H01L2225/06586 , H01L2225/06593 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/10161 , H01L2924/12042 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/3025 , H01L2224/83 , H01L2224/85 , H01L2224/81 , H01L2224/92247 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： A first semiconductor chip is produced by affixing a thermo-compression sheet to the back surface of a wafer having a circuit formed on its front surface. The first semiconductor chip is mounted on a circuit board including an insulating substrate and a wiring layer provided on the insulating substrate so that the back surface of the first semiconductor chip faces the circuit board. A second semiconductor chip produced in the same manner as the first semiconductor chip is mounted on the first semiconductor chip with its back surface facing the first semiconductor chip. Each of the first and second semiconductor chips is wire-bonded to the wiring layer with a wire. The first and second semiconductor chips and the wire are sealed with a sealing resin. The wiring layer is connected to external connection terminals through via holes provided in the insulating substrate.
摘要翻译：第一半导体芯片通过将热压片固定在其表面上形成有电路的晶片的背面而制造。第一半导体芯片安装在包括绝缘基板和设置在绝缘基板上的布线层的电路板上，使得第一半导体芯片的背面面向电路板。以与第一半导体芯片相同的方式制造的第二半导体芯片安装在第一半导体芯片上，其背面面向第一半导体芯片。第一和第二半导体芯片中的每一个用导线引线接合到布线层。第一和第二半导体芯片和线被密封树脂密封。布线层通过设置在绝缘基板上的通孔连接到外部连接端子。

6. 发明授权

US06198165B1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US06198165B1
公开(公告)日：2001-03-06
申请号：US09322925
申请日：1999-06-01
申请人： Yasuhisa Yamaji , Yoshiki Sota , Yasuki Fukui
发明人： Yasuhisa Yamaji , Yoshiki Sota , Yasuki Fukui
IPC分类号： H05K720
CPC分类号： H01L24/27 , H01L23/3128 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/274 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/451 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83385 , H01L2224/83885 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/13091 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/07025 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/05599
摘要： A semiconductor device includes a wiring substrate having wiring and a solder resist for protecting the wiring, which are provided on an insulating substrate, a semiconductor chip which is mounted via the wiring protective film on the wiring substrate on a surface on the other side of the surface on which a circuit is provided to face a side of the wiring substrate on which the wiring is formed, and a wire for electrically connecting the circuit provided on the surface of the semiconductor chip and the wiring of the wiring substrate, and the surface of the solder resist and the semiconductor chip are firmly adhered to each other. In this semiconductor device, because the solder resist and the semiconductor chip are firmly adhered to each other, there arise no bubbles due to a spacing at a portion where the solder resist and the semiconductor chip are bonded with each other. As a result, a crack generated when heating the semiconductor device when installing it in electrical devices can be prevented, and the percent defective can be significantly reduced in a reliability test after bonding is made.
摘要翻译：一种半导体器件包括具有布线的布线基板和用于保护布线的阻焊剂，其设置在绝缘基板上，半导体芯片经由布线保护膜安装在布线基板上的另一侧的表面上设置电路以面对其上形成布线的布线基板的一侧的表面，以及用于将设置在半导体芯片的表面上的电路与布线基板的布线电连接的导线，以及阻焊剂和半导体芯片彼此牢固地粘合。在该半导体器件中，由于阻焊剂和半导体芯片彼此牢固地粘合，所以由于阻焊剂和半导体芯片彼此接合的部分的间隔，不会产生气泡。结果，可以防止在将半导体器件安装在电气设备中时加热时产生的裂纹，并且在进行接合之后的可靠性测试中可以显着降低百分比不良。

7. 发明授权

US08608388B2 Semiconductor device and connector 有权
标题翻译：半导体器件和连接器
公开(公告)号：US08608388B2
公开(公告)日：2013-12-17
申请号：US12767960
申请日：2010-04-27
申请人： Yasuki Fukui , Kazuhito Nagura
发明人： Yasuki Fukui , Kazuhito Nagura
IPC分类号： G02B6/36
CPC分类号： G02B6/4292 , G02B6/4201 , G02B6/4249 , G02B6/4253 , G02B6/4255 , H01L33/54 , H01L2224/48227
摘要： A semiconductor device of the present invention includes: a circuit substrate; an optical semiconductor element provided on the circuit substrate; and a sealing resin provided on the circuit substrate, with which the optical semiconductor element is sealed, the sealing resin having a cuboid shape or a cubic shape, the sealing resin having an outer shape having at least one cutout part, in a case where a single cutout part is formed, the cutout part being provided in an area other than a center area of a top surface of the sealing resin, in a case where a plurality of cutout parts are provided, the cutout parts are formed so as not to be symmetric with respect to the central point on the top surface. With this arrangement, it is possible to provide a semiconductor device which can secure prevention of a sealing resin from being, in an erroneous direction, fitted into a connector.
摘要翻译：本发明的半导体器件包括：电路基板; 设置在所述电路基板上的光学半导体元件; 以及设置在所述电路基板上的密封树脂，所述光学半导体元件被密封，所述密封树脂具有长方体形状或立方体形状，所述密封树脂具有至少一个切口部分的外形，在在设置有多个切口部的情况下，形成有单个切口部，切口部设置在密封树脂的上表面的中心区域以外的区域，切口部形成为不形成相对于顶表面上的中心点对称。利用这种布置，可以提供一种可以防止密封树脂在错误的方向上嵌入连接器中的半导体器件。

8. 发明申请

US20080237898A1 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, HEAT SINK, SEMICONDUCTOR CHIP, INTERPOSER SUBSTRATE, AND GLASS PLATE 审中-公开
标题翻译：半导体器件，其制造方法，散热器，半导体芯片，插入器基板和玻璃板
公开(公告)号：US20080237898A1
公开(公告)日：2008-10-02
申请号：US12049728
申请日：2008-03-17
申请人： Yuji YANO , Yasuki Fukui , Koji Miyata
发明人： Yuji YANO , Yasuki Fukui , Koji Miyata
IPC分类号： H01L23/34 , H01L21/56
CPC分类号： H01L21/565 , H01L23/3128 , H01L23/4334 , H01L23/562 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/32245 , H01L2224/45139 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor device of the present invention includes: a laminate structure, including a semiconductor chip, partially sealed with a resin; and a stress relief section for relieving a stress during resin sealing, provided as a convex section including a plain top surface on an uppermost section of the laminate structure, the stress relief section being provided in an annular shape on a peripheral region of the uppermost section so as to come into contact with the sealing resin. This makes it possible to improve the manufacturing yield of the semiconductor device in which the member of the uppermost section is exposed.
摘要翻译：本发明的半导体器件包括：层叠结构，包括半导体芯片，部分地用树脂密封; 以及用于在树脂密封期间缓解应力的应力释放部分，其被设置为在所述层叠结构的最上部分上具有平坦顶面的凸部，所述应力消除部设置在所述最上部的周边区域上的环状以与密封树脂接触。由此，能够提高最上部的部件露出的半导体装置的制造成品率。

9. 发明授权

US07119426B2 Semiconductor device and manufacturing method of same 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US07119426B2
公开(公告)日：2006-10-10
申请号：US10698516
申请日：2003-11-03
申请人： Yasuki Fukui , Koji Miyata
发明人： Yasuki Fukui , Koji Miyata
IPC分类号： H01L23/02 , H01L23/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/83 , H01L24/32 , H01L25/0657 , H01L25/50 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/8314 , H01L2224/83191 , H01L2224/8385 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/00014 , H01L2924/00
摘要： In a semiconductor device in which a second semiconductor chip is layered on a first semiconductor chip mounted on a substrate, a mounting-use bonding layer being formed on a reverse surface of the second semiconductor chip with respect to a circuit formation thereof, the mounting-use bonding layer functions as a bonding agent and as a supporting member for supporting protruded part of the second semiconductor chip, which is protruded from an outer edge of the first semiconductor chip. In this semiconductor device, it is possible to bond the second semiconductor chip and the substrate stably by wire bonding.
摘要翻译：在其中第二半导体芯片层叠在安装在基板上的第一半导体芯片上的半导体器件中，在第二半导体芯片的与其电路形成相反的表面上形成安装用接合层，使用粘合层作为粘合剂，并且作为支撑部件，用于支撑从第一半导体芯片的外边缘突出的第二半导体芯片的突出部分。在该半导体装置中，可以通过引线接合来稳定地接合第二半导体芯片和基板。

10. 再颁专利

USRE38806E1 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：USRE38806E1
公开(公告)日：2005-10-04
申请号：US10428013
申请日：2003-05-02
申请人： Yasuki Fukui , Yoshiki Sota , Yuji Matsune , Atsuya Narai
发明人： Yasuki Fukui , Yoshiki Sota , Yuji Matsune , Atsuya Narai
IPC分类号： H01L25/18 , H01L21/56 , H01L21/98 , H01L23/31 , H01L23/48 , H01L23/52 , H01L25/065 , H01L25/07
CPC分类号： H01L25/50 , H01L21/561 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/97 , H01L25/0657 , H01L2224/05554 , H01L2224/16225 , H01L2224/16237 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/48499 , H01L2224/4911 , H01L2224/4945 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/85051 , H01L2224/85181 , H01L2224/85191 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2225/06555 , H01L2225/06558 , H01L2225/06582 , H01L2225/06586 , H01L2225/06593 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/10161 , H01L2924/12042 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/3025 , H01L2224/83 , H01L2224/85 , H01L2224/81 , H01L2224/92247 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： A first semiconductor chip is produced by affixing a thermo-compression sheet to the back surface of a wafer having a circuit formed on its front surface. The first semiconductor chip is mounted on a circuit board including an insulating substrate and a wiring layer provided on the insulating substrate so that the back surface of the first semiconductor chip faces the circuit board. A second semiconductor chip produced in the same manner as the first semiconductor chip is mounted on the first semiconductor chip with its back surface facing the first semiconductor chip. Each of the first and second semiconductor chips is wire-bonded to the wiring layer with a wire. The first and second semiconductor chips and the wire are sealed with a sealing resin. The wiring layer is connected to external connection terminals through via holes provided in the insulating substrate.
摘要翻译：第一半导体芯片通过将热压片固定在其表面上形成有电路的晶片的背面而制造。第一半导体芯片安装在包括绝缘基板和设置在绝缘基板上的布线层的电路板上，使得第一半导体芯片的背面面向电路板。以与第一半导体芯片相同的方式制造的第二半导体芯片安装在第一半导体芯片上，其背面面向第一半导体芯片。第一和第二半导体芯片中的每一个用导线引线接合到布线层。第一和第二半导体芯片和线被密封树脂密封。布线层通过设置在绝缘基板上的通孔连接到外部连接端子。

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