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1. 发明授权

US07622243B2 Photosensitive element, resist pattern formation method and printed wiring board production method 有权
标题翻译：感光元件，抗蚀剂图案形成方法和印刷线路板制造方法
公开(公告)号：US07622243B2
公开(公告)日：2009-11-24
申请号：US10572859
申请日：2004-09-17
申请人： Takashi Kumaki , Masahiro Miyasaka , Yasuhisa Ichihashi , Toshiki Ito , Makoto Kaji
发明人： Takashi Kumaki , Masahiro Miyasaka , Yasuhisa Ichihashi , Toshiki Ito , Makoto Kaji
IPC分类号： G03F7/00 , G03F7/04
CPC分类号： G03F7/029 , C08F2/50 , G03F7/031 , Y10S430/106 , Y10S430/114 , Y10S430/115
摘要： The present invention is a photosensitive element including a support and a photosensitive resin composition layer composed of a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound, and (C) a photopolymerization initiator, wherein, the photosensitive resin composition contains a thioxanthone-based compound represented by the following general formula (I) as the component (C), and when the parts by weight of the thioxanthone-based compound relative to 100 parts by weight for the total weight of the component (A) and the component (B) is taken to be P, and the film thickness of the photosensitive resin composition layer is taken to be Q (μm), then R, which is the product of P and Q, satisfies the condition of the following formula (1). In the following general formula (I), R1to R8 represent a hydrogen atom, halogen atom or hydrocarbon group. 25.5≦R≦79.0 (1) [Chemical Formula I]
摘要翻译：本发明是一种感光性元件，其特征在于，包含支持体和感光性树脂组合物层，所述感光性树脂组合物含有（A）粘合剂聚合物，（B）光聚合性化合物和（C）光聚合引发剂，组合物含有作为组分（C）的由以下通式（I）表示的噻吨酮基化合物，并且当相对于组分（A）的总重量相对于100重量份的噻吨酮系化合物的重量份），成分（B）为P，感光性树脂组合物层的膜厚取为Q（母体），则P和Q的乘积R满足以下条件公式1）。在下列通式（I）中，R 1至R 8表示氢原子，卤素原子或烃基。 25.5 [化学式I]

2. 发明申请

US20070105036A1 Photosensitive element, resist pattern formation method and printed wiring board production method 有权
标题翻译：感光元件，抗蚀剂图案形成方法和印刷线路板制造方法
公开(公告)号：US20070105036A1
公开(公告)日：2007-05-10
申请号：US10572859
申请日：2004-09-17
申请人： Takashi Kumaki , Masahiro Miyasaka , Yasuhisa Ichihashi , Toshiki Ito , Makoto Kaji
发明人： Takashi Kumaki , Masahiro Miyasaka , Yasuhisa Ichihashi , Toshiki Ito , Makoto Kaji
IPC分类号： G03C1/00
CPC分类号： G03F7/029 , C08F2/50 , G03F7/031 , Y10S430/106 , Y10S430/114 , Y10S430/115
摘要： The present invention is a photosensitive element including a support and a photosensitive resin composition layer composed of a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound, and (C) a photopolymerization initiator, wherein, the photosensitive resin composition contains a thioxanthone-based compound represented by the following general formula (I) as the component (C), and when the parts by weight of the thioxanthone-based compound relative to 100 parts by weight for the total weight of the component (A) and the component (B) is taken to be P, and the film thickness of the photosensitive resin composition layer is taken to be Q (μm), then R, which is the product of P and Q, satisfies the condition of the following formula (1). In the following general formula (I), R1 to R8 represent a hydrogen atom, halogen atom or hydrocarbon group. 25.5≦R≦79.0 (1) [Chemical Formula I]
摘要翻译：本发明是一种感光性元件，其特征在于，包含支持体和感光性树脂组合物层，所述感光性树脂组合物含有（A）粘合剂聚合物，（B）光聚合性化合物和（C）光聚合引发剂，组合物含有作为组分（C）的由以下通式（I）表示的噻吨酮基化合物，并且当相对于组分（A）的总重量相对于100重量份的噻吨酮系化合物的重量份），成分（B）为P，感光性树脂组合物层的膜厚取为Q（母体），则P和Q的乘积R满足以下条件公式1）。在下列通式（I）中，R 1至R 8表示氢原子，卤素原子或烃基。 <？in-line-formula description =“In-line Formulas”end =“lead”？> 25.5 <= R <= 79.0（1）<？in-line-formula description =“In-line Formulas”end = 尾“？> [化学式I]

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