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1. 发明授权

US5350436A Aluminum alloy composite material for brazing 失效
标题翻译：铝合金复合材料用于钎焊
公开(公告)号：US5350436A
公开(公告)日：1994-09-27
申请号：US156827
申请日：1993-11-24
申请人： Osamu Takezoe , Jun Takigawa , Tadashi Okamoto , Mituo Hashiura , Sunao Fukuda , Keizo Takeuchi , Yasuaki Isobe
发明人： Osamu Takezoe , Jun Takigawa , Tadashi Okamoto , Mituo Hashiura , Sunao Fukuda , Keizo Takeuchi , Yasuaki Isobe
IPC分类号： B23K35/02 , B23K35/28 , B32B15/01 , F28F13/12 , F28F21/08 , B32B15/20
CPC分类号： C22C21/00 , B23K35/286 , B32B15/016 , C22C21/02 , C22C21/06 , C22C21/10 , F28F13/12 , F28F21/084 , F28F21/089 , B23K35/0238 , Y10T428/12028 , Y10T428/12764
摘要： An aluminum alloy composite material for brazing has a core member, an Al--Si filler member clad on one surface of the core member and an aluminum alloy cladding member clad on the other side of the core member. The core member is made of an aluminum alloy containing 0.3 to 1.3 wt. % of Si, 0.3 to 1.5 wt. % of Mn, 0.02 to 0.3 wt. % of Ti, and, as required, 0.3 wt. % or less of Cr and 0.2 wt. % or less of Zr, the content of Mg being restricted to 0.2 wt. % or less and the content of the Cu being restricted to 0.2 wt. % or less as an impurity. The cladding member is made of an aluminum alloy containing 0.3 to 3 wt. % of Mg, 5 wt. % or less of Zn, 0.1 to 1.0 wt. % of Si. The thickness of the core member is preferably, 2.5 times or more greater than that of the filler member, falling within a range of 0.1 to 1 mm. With this, it is possible to obtain an aluminum alloy composite material which cannot degraded in brazability and corrosion resistance even when brazed by the brazing method with noncorrosive flux and which has enough high strength to be used for a material of a high-strength heat exchanger, highly improved corrosion resistance and excellent brazability.
摘要翻译：用于钎焊的铝合金复合材料具有芯构件，包覆在芯构件的一个表面上的Al-Si填充构件和在芯构件的另一侧上包覆的铝合金覆层构件。芯构件由含有0.3〜1.3重量％的铝合金制成。％的Si，0.3〜1.5wt。％的Mn，0.02〜0.3wt。％的Ti，根据需要，0.3重量％ Cr％以下，0.2重量％以下。％以下的Zr，Mg的含量限定为0.2重量％。％以下，Cu的含量限制在0.2重量％左右。％以下的杂质。包层部件由含有0.3〜3重量％的铝合金制成。％的Mg，5wt。％以下的Zn，0.1〜1.0wt。％的Si。芯构件的厚度优选为填充构件的厚度的2.5倍以上，落在0.1〜1mm的范围内。由此，可以获得即使用非腐蚀性焊剂钎焊法钎焊而且钎焊耐腐蚀性也不劣化的铝合金复合材料，其具有足够高的强度用于高强度热交换器的材料耐腐蚀性高，钎焊性优异。

2. 发明授权

US06403232B1 Aluminum brazing sheet 有权
标题翻译：铝钎焊板
公开(公告)号：US06403232B1
公开(公告)日：2002-06-11
申请号：US09911468
申请日：2001-07-25
申请人： Tadashi Okamoto , Osamu Takezoe , Takahiko Nagaya , Yasuaki Isobe , Taketoshi Toyama , Sunao Fukuda
发明人： Tadashi Okamoto , Osamu Takezoe , Takahiko Nagaya , Yasuaki Isobe , Taketoshi Toyama , Sunao Fukuda
IPC分类号： B32B1520
CPC分类号： C22C21/00 , B23K35/0238 , B23K35/286 , B32B15/016 , C22C21/08 , F28F21/084 , F28F21/089 , F28F2275/04 , Y10S428/933 , Y10T29/49108 , Y10T428/12764
摘要： A core material of an aluminum brazing sheet restricts Mg to less than 0.3 wt % and Fe to not more than 0.2 wt %, and contains more than 0.2 wt % and not more than 1.0 wt % of Cu, 0.3 to 1.3 wt % of Si, 0.3 to 1.5 wt % of Mn and the balance of Al and inevitable impurities. A brazing filler material is formed on one surface of the core material by Al—Si based aluminum alloy. Also, a cladding material is formed on the other surface of the core material, and contains less than 0.2 wt % of Si, 2.0 to 3.5 wt % of Mg, not less than 0.5 wt % and less than 2.0 wt % of Zn and the balance of Al and inevitable impurities. Further, the value (cladding material hardness)/(the core material hardness) that is a ratio of the hardness of the cladding material to the hardness of the core material is not more than 1.5.
摘要翻译：铝钎焊片的芯材将Mg抑制在0.3重量％以下，Fe：0.2重量％以下，含有0.2重量％以上且1.0重量％以下的Cu，0.3〜1.3重量％的Si ，Mn为0.3〜1.5重量％，余量由Al和不可避免的杂质构成。通过Al-Si基铝合金在芯材的一个表面上形成钎料。此外，在芯材的另一个表面上形成包覆材料，其含有少于0.2重量％的Si，2.0-3.5重量％的Mg，不小于0.5重量％且小于2.0重量％的Zn，平衡Al和不可避免的杂质。此外，包层材料的硬度与芯材的硬度的比值（包层材料硬度）/（芯材硬度）为1.5以下。

3. 发明授权

US5676203A Heat exchanger 失效
标题翻译：热交换器
公开(公告)号：US5676203A
公开(公告)日：1997-10-14
申请号：US491806
申请日：1995-06-19
申请人： Syunji Kajikawa , Munenori Yuasa , Yasuaki Isobe , Hiroshi Ikeda , Yuji Suzuki
发明人： Syunji Kajikawa , Munenori Yuasa , Yasuaki Isobe , Hiroshi Ikeda , Yuji Suzuki
IPC分类号： F28F3/08 , F28D9/00 , F28F19/00 , F28F21/08
CPC分类号： F28F21/084 , F28D9/0012 , F28F19/00 , F28D2021/0049 , Y10S165/916
摘要： A water-cooled oil cooler includes a laminated body formed by alternately piling up formed plates having cooling water passage openings and oil passage openings in the direction of plate thickness, and fin plates having cooling water passage openings and oil passage openings in the direction of plate thickness. A protrusion is projected from a passage wall of the cooling water passage opening of the fin plate into a cooling water passage. By setting the protrusion baser than the other part of the fin plate, the protrusion is made to serve as a sacrificial corrosion section to prevent the contact section from being precedently corroded.
摘要翻译：水冷油冷却器包括：层叠体，其通过在板厚方向上交替地堆积具有冷却水通道开口和油通道开口的成形板，以及在板的方向上具有冷却水通道开口和油通道开口的翅片板厚度。突起从翅片板的冷却水通道开口的通道壁突出到冷却水通道中。通过将突起底座设置成比翅片的另一部分，突起被用作牺牲腐蚀部分，以防止接触部分被先前腐蚀。

4. 发明授权

US5500288A Aluminum surface having chemical conversion coating and method of forming the coating 失效
标题翻译：具有化学转化涂层的铝表面和形成涂层的方法
公开(公告)号：US5500288A
公开(公告)日：1996-03-19
申请号：US88595
申请日：1993-07-09
申请人： Yasuaki Isobe , Hiroyoshi Mizuno
发明人： Yasuaki Isobe , Hiroyoshi Mizuno
IPC分类号： C23C22/56 , C23C22/66 , C23C22/68 , C23F11/08 , B32B15/04
CPC分类号： C23C22/68 , C23F11/08 , Y10T428/265
摘要： A chemical conversion coating formed on a surface of an aluminum substrate. The coating comprises a composite material formed by a reaction of a nitrate or sulfate of an alkali metal or alkaline earth metal and an organic compound that can form a compound with aluminum or exhibit a weak basicity an an aqueous aluminum treating liquid comprising the nitrate or sulfate of alkali metal or alkaline earth metal and the organic compound, with the aluminum substrate. The coating is corrosion-resistant, bacteria-proof or fungiproof, and the surface is of a heat exchanger, etc.
摘要翻译：在铝基板的表面上形成化学转化膜。涂层包括通过碱金属或碱土金属的硝酸盐或硫酸盐与可与铝形成化合物或显示弱碱性的有机化合物与含有硝酸盐或硫酸盐的铝水溶液反应形成的复合材料的碱金属或碱土金属和有机化合物，与铝基材。涂层具有耐腐蚀，防细菌或真菌，表面为热交换器等。

5. 发明授权

US06380620B1 Tape ball grid array semiconductor 失效
标题翻译：磁带阵列阵列半导体
公开(公告)号：US06380620B1
公开(公告)日：2002-04-30
申请号：US09373535
申请日：1999-08-13
申请人： Shinji Suminoe , Kenji Toyosawa , Yasuaki Isobe
发明人： Shinji Suminoe , Kenji Toyosawa , Yasuaki Isobe
IPC分类号： H01L2310
CPC分类号： H01L23/36 , H01L23/49816 , H01L23/4985 , H01L24/45 , H01L24/48 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/45144 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2224/83101 , H01L2224/83851 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00015 , H01L2224/05599 , H01L2924/00 , H01L2224/0401 , H01L2924/00012
摘要： An inner lead and an outer lead are formed only on an insulating tape. A semiconductor chip and the inner lead are connected by the flip chip method by providing an anisotropic conductive material therebetween. A radiating plate is bonded to the insulating tape with use of an adhesive so that the radiating plate covers all regions where solder balls connected with the outer leads are formed. Unlike the TAB type, the inner lead is not uncovered with the insulating tape, whereby deformation of the inner lead is suppressed as much as possible. With this arrangement, the following effect can be achieved. Namely, in a semiconductor device of the BGA type, heat generated during package manufacture can be efficiently emitted, and hence package defects caused by heat and stress during manufacture can be suppressed. As a result, smaller and thinner packages can be manufactured, while pitch narrowing and multiple-port structure can be achieved.
摘要翻译：内引线和外引线仅在绝缘带上形成。通过在其间提供各向异性导电材料，通过倒装芯片方法连接半导体芯片和内引线。使用粘合剂将辐射板粘合到绝缘带上，使得辐射板覆盖形成与外引线连接的焊球的所有区域。与TAB类型不同，内部引线不会被绝缘带覆盖，从而尽可能地抑制内部引线的变形。通过这种布置，可以实现以下效果。也就是说，在BGA型半导体器件中，可以有效地发出封装制造时产生的热量，能够抑制制造时的热和应力引起的封装缺陷。结果，可以制造更小和更薄的包装，同时可以实现节距变窄和多端口结构。

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