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1. 发明申请

US20140011309A1 Circuit for a Light Emitting Component and Method of Manufacturing the Same 有权
标题翻译：发光元件电路及其制造方法
公开(公告)号：US20140011309A1
公开(公告)日：2014-01-09
申请号：US13996643
申请日：2011-12-14
申请人： Francois Lechleiter , Pierre-Alois Welsch , Yannick De Maquille
发明人： Francois Lechleiter , Pierre-Alois Welsch , Yannick De Maquille
IPC分类号： H01L33/48
CPC分类号： H01L33/486 , H01L33/64 , H01L2224/48091 , H01L2224/73265 , H05K1/0393 , H05K1/183 , H05K1/184 , H05K1/189 , H05K2201/0355 , H05K2201/0394 , H05K2201/0397 , H05K2201/10106 , H01L2924/00014
摘要： The inventions relates to a method of manufacturing a circuit incorporating a solid state light emitting component, the method including providing an insulating layer, producing at least one through hole in the insulating layer, providing a conductive layer, bonding a main surface of the conductive layer to the insulating layer, and positioning at least one solid state light emitting component in the hole of the insulating layer and connecting this component to the conductive layer.
摘要翻译：本发明涉及一种制造包含固态发光元件的电路的方法，所述方法包括提供绝缘层，在绝缘层中产生至少一个通孔，提供导电层，将导电层的主表面并且将至少一个固态发光部件定位在绝缘层的孔中并将该部件连接到导电层。

2. 发明申请

US20050253228A1 Method for encapsulation of a chipcard and module obtained thus 有权
标题翻译：由此获得的芯片卡和模块的封装方法
公开(公告)号：US20050253228A1
公开(公告)日：2005-11-17
申请号：US10511792
申请日：2003-04-16
申请人： Jean-Pierre Radenne , Yannick De Maquille , Jean-Jacques Mischler , Christophe Mathieu
发明人： Jean-Pierre Radenne , Yannick De Maquille , Jean-Jacques Mischler , Christophe Mathieu
IPC分类号： G06K19/077 , H01L23/02 , H01L23/12
CPC分类号： G06K19/07747 , G06K19/07743 , G06K19/07745 , H01L2224/32225 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2924/0102 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , Y10T156/1056 , Y10T156/1057 , H01L2924/00
摘要： Method for conditioning of an electronic microcircuit designed for the production of an electronic module which can be glued by means of a simple glue or by soldering. For this purpose the microchip has a geometric shape compatible with a recess in a card provided to accommodate it and has a means serving as a mask compatible with the card. Ultimately this mask also serves to prevent an outflow of a resin coating used to protect a chip included in this type of module. The mask is glued to a support having, on a first face, the contact area, and on a second face the mask and the chip. The mask includes a window determining the placement of the chip.
摘要翻译：用于调节设计用于生产电子模块的电子微电路的方法，该电子模块可以通过简单的胶水或通过焊接胶合。为了这个目的，微芯片具有与设置成容纳它的卡中的凹部兼容的几何形状，并且具有用作与该卡兼容的掩模的装置。最终，该掩模还用于防止用于保护包括在这种类型的模块中的芯片的树脂涂层的流出。将掩模胶合到在第一面上具有接触区域并且在第二面上具有掩模和芯片的支撑件。掩模包括确定芯片布局的窗口。

3. 发明授权

US4287288A Lithographic plate of tin-plated steel and method of manufacture 失效
标题翻译：镀锡钢板及其制造方法
公开(公告)号：US4287288A
公开(公告)日：1981-09-01
申请号：US10398
申请日：1979-02-08
申请人： Marcel Pigeon , Yannick de Maquille
发明人： Marcel Pigeon , Yannick de Maquille
IPC分类号： B41N3/03 , G03F7/08 , B41N1/10 , G03C1/74 , G03F7/10
CPC分类号： B41N3/03 , Y10S205/917 , Y10S205/921
摘要： A method of making a presensitized lithographic plate is disclosed wherein a steel support having a tin-plated layer is depassivated and coated with a photosensitive product. Depassivation is accomplished by immersion of the support in an electrolytic bath of sodium carbonate. The electrolysis is performed with the support as a cathode and reversed so that the support is an anode of the bath. Preferably, the bath is an aqueous solution of 50 grams per liter of sodium carbonate at a temperature of 65.degree. C. with a current density of the bath being approximately 2.5 amperes per dm.sup.2. It is also contemplated that the depassivated tin-plated layer may be coated with copper before application of the photosensitive product. This can be accomplished by immersion in an electrolytic bath of copper cyanide. Preferably, the copper cyanide bath is at a temperature of 65.degree. C. with immersion occurring for approximately 3 minutes with the support in the cathode position and having a current density of 2.5 amperes per dm.sup.2. This results in a copper coating of approximately 3-4 microns in thickness. The copper coating may be passivated before the photosensitive product is added by a coating of aqueous benzotriazole solution.The photosensitive product may be a diazo resin of the orthoquinone diazide type condensed with a formophenolic resin. Over the diazo resin, after development a firing solution which is subsequently annealed may be added. Alternatively, the depassivation of the tin-plated layer may be accomplished by wet brushing in the presence of an aqueous pounce solution followed by impregnation with a hydrochloric acid and stannous chloride solution.Alternatively, a chromium layer may also be applied to the depassivated tin-plated layer before application of the photosensitive product. Such is accomplished in an electrolytic chromium bath containing chromic acid and sulfuric acid, the support being in a cathode position and the bath having a current density of approximately 20 amperes per dm.sup.2. It is also contemplated that the photosensitive product may be a photopolymer of a cellulose acetate layer coated with a photopolymer. This results in a lithographic plate comprising oleophilic zones of a photopolymer or copper and hydrophilic zones of chromium or tin.
摘要翻译：公开了一种制造预敏化平版印刷板的方法，其中具有镀锡层的钢支架被钝化并涂覆有感光产品。通过将载体浸入碳酸钠的电解浴中来实现钝化。电解是用载体作为阴极进行的并且反转，使得载体是浴的阳极。优选地，浴是在65℃的温度下为50克/升碳酸钠的水溶液，浴的电流密度为约2.5安培/ dm 2。还可以设想，在施加光敏产物之前，去钝化的镀锡层可以用铜涂覆。这可以通过浸入氰化铜电解槽来实现。优选地，氰化铜浴的温度为65℃，浸渍在阴极位置并且具有2.5安培/ dm 2的电流密度浸泡发生约3分钟。这导致厚度约3-4微米的铜涂层。在通过苯并三唑水溶液的涂层加入感光产品之前，可以将铜涂层钝化。感光产品可以是与苯酚酚醛树脂缩合的重氮二叉型重氮树脂。在重氮树脂上，在显影后，可以加入随后退火的焙烧溶液。或者，镀锡层的钝化可以通过在水溶液浸渍溶液的存在下进行湿法刷洗，然后用盐酸和氯化亚锡溶液浸渍来完成。

4. 发明授权

US09508905B2 Circuit for a light emitting component and method of manufacturing the same 有权
标题翻译：发光元件用电路及其制造方法
公开(公告)号：US09508905B2
公开(公告)日：2016-11-29
申请号：US13996643
申请日：2011-12-14
申请人： Francois Lechleiter , Pierre-Alois Welsch , Yannick de Maquille
发明人： Francois Lechleiter , Pierre-Alois Welsch , Yannick de Maquille
IPC分类号： H01L33/48 , H05K1/18 , H05K1/03 , H01L33/64
CPC分类号： H01L33/486 , H01L33/64 , H01L2224/48091 , H01L2224/73265 , H05K1/0393 , H05K1/183 , H05K1/184 , H05K1/189 , H05K2201/0355 , H05K2201/0394 , H05K2201/0397 , H05K2201/10106 , H01L2924/00014
摘要： The inventions relates to a method of manufacturing a circuit incorporating a solid state light emitting component, the method including providing an insulating layer, producing at least one through hole in the insulating layer, providing a conductive layer, bonding a main surface of the conductive layer to the insulating layer, and positioning at least one solid state light emitting component in the hole of the insulating layer and connecting this component to the conductive layer.
摘要翻译：本发明涉及一种制造包含固态发光元件的电路的方法，所述方法包括提供绝缘层，在绝缘层中产生至少一个通孔，提供导电层，将导电层的主表面并且将至少一个固态发光部件定位在绝缘层的孔中并将该部件连接到导电层。

5. 发明申请

US20130134227A1 Multi-Layered Flexible Printed Circuit and Method of Manufacture 审中-公开
标题翻译：多层柔性印刷电路及其制造方法
公开(公告)号：US20130134227A1
公开(公告)日：2013-05-30
申请号：US13703394
申请日：2011-06-14
申请人： Yannick De Maquille , Christophe Mathieu , Stephane Barlerin
发明人： Yannick De Maquille , Christophe Mathieu , Stephane Barlerin
IPC分类号： G06K19/07 , H01P11/00
CPC分类号： G06K19/0723 , G06K19/07722 , G06K19/07749 , G06K19/07779 , G06K19/07783 , G06K19/07784 , H01P11/00 , Y10T29/49018
摘要： A flexible printed circuit includes 2 insulating flexible layers, and 3 conductive layers each including electrical tracks, the conductive and the insulating layers are provided stacked in alternated fashion. Electrical tracks of 3 conductive layers are electrically connected together through respective layers of insulating substrate to form an RFID antenna.
摘要翻译：柔性印刷电路包括2个绝缘柔性层和3个导电层，每个导电层各自包括电迹线，导电层和绝缘层以交替的方式堆叠。 3个导电层的电迹线通过绝缘基板的各层电连接在一起形成RFID天线。

6. 发明授权

US07320738B2 Method for encapsulation of a chip card and module obtained thus 有权
标题翻译：芯片卡的封装方法和由此获得的模块
公开(公告)号：US07320738B2
公开(公告)日：2008-01-22
申请号：US10511792
申请日：2003-04-16
申请人： Jean-Pierre Radenne , Yannick De Maquille , Jean-Jacques Mischler , Christophe Mathieu
发明人： Jean-Pierre Radenne , Yannick De Maquille , Jean-Jacques Mischler , Christophe Mathieu
IPC分类号： B29C65/00 , B32B37/00
CPC分类号： G06K19/07747 , G06K19/07743 , G06K19/07745 , H01L2224/32225 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2924/0102 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , Y10T156/1056 , Y10T156/1057 , H01L2924/00
摘要： Method for conditioning of an electronic microcircuit designed for the production of an electronic module which can be glued by means of a simple glue or by soldering. For this purpose the microchip has a geometric shape compatible with a recess in a card provided to accommodate it and has a means serving as a mask compatible with the card. Ultimately this mask also serves to prevent an outflow of a resin coating used to protect a chip included in this type of module. The mask is glued to a support having, on a first face, the contact area, and on a second face the mask and the chip. The mask includes a window determining the placement of the chip.
摘要翻译：用于调节设计用于生产电子模块的电子微电路的方法，该电子模块可以通过简单的胶水或通过焊接胶合。为了这个目的，微芯片具有与设置成容纳它的卡中的凹部兼容的几何形状，并且具有用作与该卡兼容的掩模的装置。最终，该掩模还用于防止用于保护包括在这种类型的模块中的芯片的树脂涂层的流出。将掩模胶合到在第一面上具有接触区域并且在第二面上具有掩模和芯片的支撑件。掩模包括确定芯片布局的窗口。

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