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1. 发明授权

US08999835B2 Method and structure of monolithically integrated ESD supperssion device 有权
标题翻译：单片集成ESD保护装置的方法和结构
公开(公告)号：US08999835B2
公开(公告)日：2015-04-07
申请号：US13410273
申请日：2012-03-01
申请人： Xiao (Charles) Yang
发明人： Xiao (Charles) Yang
IPC分类号： H01L27/02 , H01L23/60 , H01L23/00
CPC分类号： H01L27/0248 , H01L23/60 , H01L24/05 , H01L2924/14 , H01L2924/00
摘要： A method of fabricating ESD suppression device includes forming conductive pillars dispersed in a dielectric material. The gaps formed between each pillar in the device behave like spark gaps when a high voltage ESD pulse occurs. When the voltage of the pulse reaches the “trigger voltage” these gaps spark over, creating a very low resistance path. In normal operation, the leakage current and the capacitance is very low, due to the physical gaps between the conductive pillars. The proposed method for fabricating an ESD suppression device includes micromachining techniques to be on-chip with device ICs.
摘要翻译：制造ESD抑制装置的方法包括形成分散在电介质材料中的导电柱。当发生高电压ESD脉冲时，器件中每个支柱之间形成的间隙就像火花隙。当脉冲电压达到“触发电压”时，这些间隙发生火花，产生非常低的电阻路径。在正常工作中，由于导电柱之间的物理间隙，漏电流和电容非常低。所提出的用于制造ESD抑制器件的方法包括使用器件IC片上的微加工技术。

2. 发明授权

US08928696B1 Methods and apparatus for operating hysteresis on a hand held device 有权
标题翻译：在手持装置上操作滞后的方法和装置
公开(公告)号：US08928696B1
公开(公告)日：2015-01-06
申请号：US13069355
申请日：2011-03-22
申请人： Xiao “Charles” Yang
发明人： Xiao “Charles” Yang
IPC分类号： G09G5/00
CPC分类号： G09G5/00 , G01C21/20 , G01C25/00 , G09G2340/0492
摘要： A handheld device and methods of operation. The device includes a housing and a display. A device may include a MEMS inertial sensor disposed within the housing, wherein the MEMS inertial sensor is configured to sense a change in spatial orientation when the user reorients the handheld device. A system may include a processor disposed within the housing and coupled to the MEMS inertial sensor and to the display, wherein the processor is programmed to receive the change in spatial orientation of the handheld device, and wherein the processor is programmed output an indication of the change in spatial orientation on the display. A computer implemented method for a handheld computer system for determining spatial orientation is also disclosed.
摘要翻译：手持设备和操作方法。该装置包括壳体和显示器。设备可以包括设置在壳体内的MEMS惯性传感器，其中，MEMS惯性传感器被配置为当用户重新定向手持设备时感测空间取向的变化。系统可以包括设置在壳体内并耦合到MEMS惯性传感器和显示器的处理器，其中处理器被编程为接收手持设备的空间取向的变化，并且其中处理器被编程输出在显示器上改变空间方向。还公开了一种用于确定空间取向的手持式计算机系统的计算机实现方法。

3. 发明授权

US08637943B1 Multi-axis integrated MEMS devices with CMOS circuits and method therefor 有权
标题翻译：具有CMOS电路的多轴集成MEMS器件及其方法
公开(公告)号：US08637943B1
公开(公告)日：2014-01-28
申请号：US12983309
申请日：2011-01-02
申请人： Xiao “Charles” Yang
发明人： Xiao “Charles” Yang
IPC分类号： H01L27/14
CPC分类号： B81C1/0023 , B81B7/02 , B81C1/00246 , B81C2203/0771 , H01L27/0688 , H01L27/14603 , H01L2224/48091 , H01L2924/16235 , H01L2924/00014
摘要： An integrated multi-axis mechanical device and integrated circuit system. The integrated system can include a silicon substrate layer, a CMOS device region, four or more mechanical devices, and a wafer level packaging (WLP) layer. The CMOS layer can form an interface region, on which any number of CMOS and mechanical devices can be configured. The mechanical devices can include MEMS devices configured for multiple axes or for at least a first direction. The CMOS layer can be deposited on the silicon substrate and can include any number of metal layers and can be provided on any type of design rule. The integrated MEMS devices can include, but not exclusively, any combination of the following types of sensors: magnetic, pressure, humidity, temperature, chemical, biological, or inertial. Furthermore, the overlying WLP layer can be configured to hermetically seal any number of these integrated devices.
摘要翻译：集成多轴机械装置和集成电路系统。集成系统可以包括硅衬底层，CMOS器件区域，四个或更多个机械器件以及晶片级封装（WLP）层。 CMOS层可以形成接口区域，可以在其上配置任何数量的CMOS和机械装置。机械装置可以包括被配置用于多个轴或至少第一方向的MEMS装置。 CMOS层可以沉积在硅衬底上，并且可以包括任何数量的金属层，并且可以以任何类型的设计规则提供。集成MEMS器件可以包括但不限于以下类型的传感器的任何组合：磁性，压力，湿度，温度，化学，生物或惯性。此外，覆盖的WLP层可以被配置为密封任何数量的这些集成设备。

4. 发明授权

US08395252B1 Integrated MEMS and CMOS package and method 有权
标题翻译：集成MEMS和CMOS封装及方法
公开(公告)号：US08395252B1
公开(公告)日：2013-03-12
申请号：US12945087
申请日：2010-11-12
申请人： Xiao “Charles” Yang
发明人： Xiao “Charles” Yang
IPC分类号： H01L23/02
CPC分类号： H01L23/3114 , B81C1/0023 , H01L2224/48091 , H01L2924/12044 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： An apparatus for packaging MEMS and ICs can include a semiconductor substrate, one or more MEMS devices, an enclosure, and one or more bonding structures. The semiconductor substrate can be bonded to a portion of the surface region. The semiconductor substrate can include one or more integrated circuits. Also, the semiconductor substrate can have an upper surface region. The one or more MEMS devise can overlie an inner region of the upper surface region formed by the semiconductor substrate. The enclosure can house the one or more MEMS devices. The enclosure can overlie a first outer region of the upper surface region. Also, the enclosure can have an upper cover region. The one or more bonding structures can be provided within a second outer region of the supper surface region.
摘要翻译：用于封装MEMS和IC的装置可以包括半导体衬底，一个或多个MEMS器件，外壳和一个或多个结合结构。半导体衬底可以结合到表面区域的一部分。半导体衬底可以包括一个或多个集成电路。此外，半导体衬底可以具有上表面区域。一个或多个MEMS器件可以覆盖由半导体衬底形成的上表面区域的内部区域。外壳可容纳一个或多个MEMS器件。外壳可以覆盖在上表面区域的第一外部区域。此外，外壳可以具有上盖区域。一个或多个结合结构可以设置在超级表面区域的第二外部区域内。

5. 发明申请

US20120276677A1 METHOD AND STRUCTURE OF WAFER LEVEL ENCAPSULATION OF INTEGRATED CIRCUITS WITH CAVITY 有权
标题翻译：集成电路的水平覆盖方法与结构
公开(公告)号：US20120276677A1
公开(公告)日：2012-11-01
申请号：US13542637
申请日：2012-07-05
申请人： XIAO (CHARLES) YANG
发明人： XIAO (CHARLES) YANG
IPC分类号： H01L31/18 , H01L21/56
CPC分类号： H01L23/552 , H01L23/29 , H01L2924/0002 , H01L2924/00
摘要： The present invention is related shielding integrated devices using CMOS fabrication techniques to form an encapsulation with cavity. The integrated circuits are completed first using standard IC processes. A wafer-level hermetic encapsulation is applied to form a cavity above the sensitive portion of the circuits using IC-foundry compatible processes. The encapsulation and cavity provide a hermetic inert environment that shields the sensitive circuits from EM interference, noise, moisture, gas, and corrosion from the outside environment.
摘要翻译：本发明是使用CMOS制造技术来形成具有空腔的封装的相关的屏蔽集成器件。首先使用标准IC工艺完成集成电路。应用晶圆级密封封装，以在电路的敏感部分之上形成一个使用IC代工厂兼容工艺的空腔。封装和空腔提供了一个密封的惰性环境，可以使敏感电路屏蔽外部环境中的电磁干扰，噪声，水分，气体和腐蚀。

6. 发明申请

US20120248506A1 METHOD AND STRUCTURE OF MONOLITHETICALLY INTEGRATED INERTIAL SENSOR USING IC FOUNDRY-COMPATIBLE PROCESSES 有权
标题翻译：使用集成电路兼容过程的单一集成惯性传感器的方法和结构
公开(公告)号：US20120248506A1
公开(公告)日：2012-10-04
申请号：US13494986
申请日：2012-06-12
申请人： XIAO (CHARLES) YANG
发明人： XIAO (CHARLES) YANG
IPC分类号： H01L21/66 , H01L29/84 , H01L21/02
CPC分类号： H01L22/12 , B81B2201/025 , B81C1/0023 , B81C1/00246 , B81C2203/0145 , B81C2203/0735 , H01L22/26 , H01L27/0688
摘要： The present invention relates to integrating an inertial mechanical device on top of a CMOS substrate monolithically using IC-foundry compatible processes. The CMOS substrate is completed first using standard IC processes. A thick silicon layer is added on top of the CMOS. A subsequent patterning step defines a mechanical structure for inertial sensing. Finally, the mechanical device is encapsulated by a thick insulating layer at the wafer level.Comparing to the incumbent bulk or surface micromachined MEMS inertial sensors, the vertically monolithically integrated inertial sensors have smaller chip size, lower parasitics, higher sensitivity, lower power, and lower cost.
摘要翻译：本发明涉及使用IC代工厂兼容的工艺将一个惯性机械装置整体地集成在CMOS衬底之上。 CMOS基板首先使用标准IC工艺完成。在CMOS的顶部添加厚的硅层。随后的图案化步骤限定了用于惯性感测的机械结构。最后，机械装置由晶圆级的厚绝缘层封装。与现有的体积或表面微加工MEMS惯性传感器相比，垂直单片集成的惯性传感器具有更小的芯片尺寸，更低的寄生效应，更高的灵敏度，更低的功率和更低的成本。

7. 发明授权

US08071398B1 Method and structure of monolithically integrated IC-MEMS oscillator using IC foundry-compatible processes 有权
标题翻译：使用IC代工兼容工艺的单片IC-MEMS振荡器的方法和结构
公开(公告)号：US08071398B1
公开(公告)日：2011-12-06
申请号：US12634634
申请日：2009-12-09
申请人： Xiao (Charles) Yang
发明人： Xiao (Charles) Yang
IPC分类号： G01R31/26
CPC分类号： B81C1/00246
摘要： The present invention relates to integrating an inertial mechanical device on top of an IC substrate monolithically using IC-foundry compatible processes. The IC substrate is completed first using standard IC processes. A thick silicon layer is added on top of the IC substrate. A subsequent patterning step defines a mechanical structure for inertial sensing. Finally, the mechanical device is encapsulated by a thick insulating layer at the wafer level. Compared with the incumbent bulk or surface micromachined MEMS inertial sensors, vertically monolithically integrated inertial sensors provided by embodiments of the present invention have one or more of the following advantages: smaller chip size, lower parasitics, higher sensitivity, lower power, and lower cost.
摘要翻译：本发明涉及使用IC代工厂兼容的工艺将惯性机械装置整体集成在IC基板上。首先使用标准IC工艺完成IC基板。将厚硅层添加到IC基板的顶部。随后的图案化步骤限定了用于惯性感测的机械结构。最后，机械装置由晶圆级的厚绝缘层封装。与现有的本体或表面微加工MEMS惯性传感器相比，本发明实施例提供的垂直单片集成惯性传感器具有以下一个或多个优点：较小的芯片尺寸，较低的寄生效应，更高的灵敏度，更低的功率和更低的成本。

8. 发明申请

US20110291981A1 Analog Touchscreen Methods and Apparatus 有权
标题翻译：模拟触摸屏方法和设备
公开(公告)号：US20110291981A1
公开(公告)日：2011-12-01
申请号：US12787368
申请日：2010-05-25
申请人： Xiao "Charles" Yang
发明人： Xiao "Charles" Yang
IPC分类号： G06F3/045
CPC分类号： G06F3/0416 , G06F3/044 , G06F3/045 , G06F3/04883 , G06F2203/04105
摘要： A computer implemented method for determining an intensity of user input to a computer system, performed by the computer system that is programmed to perform the method includes determining by a display, an indication of a finger position a user in response to a change in finger position relative to the computer system, wherein change in fin position is also associated with a magnitude of change, determining by a physical sensor of the computer system, the magnitude of change in response to the change in finger position, determining by the computer system, a user selection of a function to perform in response to the indication of the finger position, determining by the computer system, an input parameter associated with the function in response to the magnitude of change, and initiating performance by the computer system, of the function in response to the input parameter.
摘要翻译：一种计算机实现的方法，用于确定由被编程为执行该方法的计算机系统执行的对计算机系统的用户输入的强度的方法包括：通过显示来确定用户响应于手指位置的变化的手指位置的指示相对于计算机系统，其中翅片位置的改变也与变化的大小相关联，由计算机系统的物理传感器确定响应于手指位置的变化的变化的大小，由计算机系统确定用户选择响应于手指位置的指示而执行的功能，响应于变化的大小，由计算机系统确定与功能相关联的输入参数，以及由计算机系统启动该功能的功能响应输入参数。

9. 发明申请

US20100007238A1 METHOD AND STRUCTURE FOR AN OUT-OF-PLANE COMPLIANT MICRO ACTUATOR 有权
标题翻译：非平面配合微致动器的方法和结构
公开(公告)号：US20100007238A1
公开(公告)日：2010-01-14
申请号：US12353969
申请日：2009-01-15
申请人： XIAO (CHARLES) YANG
发明人： XIAO (CHARLES) YANG
IPC分类号： H02N11/00
CPC分类号： H02N1/004
摘要： This present invention relates generally to manufacturing objects. More particularly, the invention relates to a method and structure for fabricating an out-of-plane compliant micro actuator. The compliant actuator has large actuation range in both vertical and horizontal planes without physical contact to the substrate. Due to fringe field actuation, the compliant actuator has no pull-in phenomenon and requires low voltage by a ‘zipping’ movement compared to conventional parallel plate electrostatic actuators. The method and device can be applied to micro actuators as well as other devices, for example, micro-electromechanical sensors, detectors, fluidic, and optical systems.
摘要翻译：本发明一般涉及制造物体。更具体地说，本发明涉及一种用于制造面外兼容微型致动器的方法和结构。柔性致动器在垂直和水平平面中具有大的致动范围，而不与基板物理接触。由于边缘场致动，顺应性致动器没有拉入现象，与传统的平行板静电致动器相比，通过“拉伸”运动需要低电压。该方法和装置可以应用于微致动器以及其他装置，例如微机电传感器，检测器，流体和光学系统。

10. 发明申请

US20070102035A1 Method and Structure for Integrated Solar Cell LCD Panel 审中-公开
标题翻译：集成太阳能电池液晶面板的方法与结构
公开(公告)号：US20070102035A1
公开(公告)日：2007-05-10
申请号：US11554496
申请日：2006-10-30
申请人： Xiao (Charles) Yang
发明人： Xiao (Charles) Yang
IPC分类号： H02N6/00
CPC分类号： H01L31/0749 , G02F1/133512 , G02F2001/13324 , G02F2001/133562 , G02F2001/133565 , H01L31/0296 , H01L31/03682 , H01L31/03762 , H01L31/0543 , Y02E10/52 , Y02E10/541 , Y02E10/546 , Y02E10/548
摘要： The present invention relates to a method and device for integrating solar cell on LCD panels for photovoltaic electricity generation for portable electronic devices. According to one embodiment of the present invention, the black matrix region on the color filter substrate in a LCD panel is replaced by a solar cell region. A lens array substrate is coupled between the light source layer and the TFT to focus the backlight to increase the solar cell layer area while maintaining high fill ratio of the LCD pixels. The solar cell material is selected from at least silicon, a single crystal silicon, poly-crystalline silicon, amorphous silicon, gallium arsenide, cadmium telluride, copper indium diselenide, organic/inorganic, or hybrid cells. The substrate material is selected from glass, metal, plastic or polymer.
摘要翻译：本发明涉及将太阳能电池集成在用于便携式电子设备的光伏发电的LCD面板上的方法和装置。根据本发明的一个实施例，LCD面板上的滤色器基板上的黑矩阵区域被太阳能电池区域代替。透镜阵列基板耦合在光源层和TFT之间以聚焦背光以增加太阳能电池层面积，同时保持LCD像素的高填充率。太阳能电池材料至少选自硅，单晶硅，多晶硅，非晶硅，砷化镓，碲化镉，二硒化铜铟，有机/无机或混合电池。基底材料选自玻璃，金属，塑料或聚合物。

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