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    • 5. 发明授权
    • Nonvolatile memory devices and methods of fabricating the same
    • 非易失性存储器件及其制造方法
    • US08017477B2
    • 2011-09-13
    • US11704205
    • 2007-02-09
    • Won-joo KimSuk-pil KimYoon-dong Park
    • Won-joo KimSuk-pil KimYoon-dong Park
    • H01L21/336
    • H01L27/115H01L27/11521H01L27/11568H01L29/42332H01L29/42336H01L29/42352H01L29/66621H01L29/7881H01L29/792
    • A nonvolatile memory device includes a plurality of first control gate electrodes, second control gate electrodes, first storage node films, and second storage node films. The first control gate electrodes are recessed into a semiconductor substrate. Each second control gate electrode is disposed between two adjacent first control gate electrodes. The second control gate electrodes are disposed on the semiconductor substrate over the first control gate electrodes. The first storage node films are disposed between the semiconductor substrate and the first control gate electrodes. The second storage node films are disposed between the semiconductor substrate and the second control gate electrodes. A method of fabricating the nonvolatile memory device includes forming the first storage node films, forming the first control gate electrodes, forming the second storage node films, and forming the second control gate electrodes.
    • 非易失性存储器件包括多个第一控制栅电极,第二控制栅电极,第一存储节点膜和第二存储节点膜。 第一控制栅电极凹入半导体衬底。 每个第二控制栅电极设置在两个相邻的第一控制栅电极之间。 第二控制栅电极设置在第一控制栅电极上的半导体衬底上。 第一存储节点膜设置在半导体衬底和第一控制栅电极之间。 第二存储节点膜设置在半导体衬底和第二控制栅电极之间。 一种制造非易失性存储器件的方法包括形成第一存储节点膜,形成第一控制栅电极,形成第二存储节点膜,以及形成第二控制栅电极。
    • 9. 发明授权
    • Wire-type semiconductor devices and methods of fabricating the same
    • 线型半导体器件及其制造方法
    • US07663166B2
    • 2010-02-16
    • US11723074
    • 2007-03-16
    • Suk-Pil KimYoon-Dong ParkWon-Joo Kim
    • Suk-Pil KimYoon-Dong ParkWon-Joo Kim
    • H01L27/088
    • H01L29/0657H01L29/42392H01L29/78696
    • Provided are relatively higher-performance wire-type semiconductor devices and relatively economical methods of fabricating the same. A wire-type semiconductor device may include at least one pair of support pillars protruding above a semiconductor substrate, at least one fin protruding above the semiconductor substrate and having ends connected to the at least one pair of support pillars, at least one semiconductor wire having ends connected to the at least one pair of support pillars and being separated from the at least one fin, a common gate electrode surrounding the surface of the at least one semiconductor wire, and a gate insulating layer between the at least one semiconductor wire and the common gate electrode.
    • 提供了相对较高性能的线型半导体器件和相对经济的制造方法。 线型半导体器件可以包括突出在半导体衬底上方的至少一对支撑柱,至少一个突出于半导体衬底之上并具有连接到至少一对支撑柱的端子的鳍片,至少一个半导体线材具有 连接到所述至少一对支撑柱并且与所述至少一个鳍分离的端部,围绕所述至少一个半导体线的表面的公共栅电极以及所述至少一个半导体线和所述至少一个半导体线之间的栅极绝缘层 共栅电极。