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    • 3. 发明申请
    • Tunable laser modules incorporating micromachined pellicle splitters
    • 可调谐激光模块结合微加工防护薄膜分离器
    • US20060082889A1
    • 2006-04-20
    • US11294965
    • 2005-12-06
    • William KozlovskyMark McDonald
    • William KozlovskyMark McDonald
    • G02B27/12
    • G02B27/1073G02B27/108G02B27/142
    • A micromachined pellicle beam splitter and method of manufacture thereof are disclosed. In one embodiment, the beam splitter includes a silicon frame with a silicon nitride membrane attached to the frame and covering an opening through the frame. Other materials may be utilized, however, the coefficient of thermal expansion (CTE) of the membrane should be greater than that of the frame. The beam splitter may be manufactured by coating a silicon substrate with a layer of silicon nitride, patterning an opposite side of the silicon substrate with a photoresist or a metallic layer to define an opening an etching an opening through the substrate to the silicon nitride with either a dry etch or wet etch technique. An improved tunable laser module incorporating the micromachined pellicle beam splitter and a method of tuning a laser diode are also disclosed.
    • 公开了一种微加工防护薄膜分束器及其制造方法。 在一个实施例中,分束器包括硅框架,其具有附接到框架并覆盖通过框架的开口的氮化硅膜。 可以使用其它材料,然而,膜的热膨胀系数(CTE)应该大于框架的热膨胀系数(CTE)。 分束器可以通过用氮化硅层涂覆硅衬底来制造,用光致抗蚀剂或金属层将硅衬底的相对侧图案化以限定开口,通过衬底蚀刻通过衬底到氮化硅的开口,或者 干蚀刻或湿蚀刻技术。 还公开了一种结合有微加工防护薄膜分束器的改进的可调激光器模块和调谐激光二极管的方法。
    • 5. 发明授权
    • Method and system for hybrid integration of an opto-electronic integrated circuit
    • 光电集成电路混合集成方法与系统
    • US08368995B2
    • 2013-02-05
    • US13076205
    • 2011-03-30
    • John DallesasseStephen B. KrasulickWilliam Kozlovsky
    • John DallesasseStephen B. KrasulickWilliam Kozlovsky
    • G02F1/01H04B10/12G02B6/26
    • H01S5/141H01S5/021H01S5/02248H01S5/02272H01S5/0261H01S5/06246H01S5/1032
    • An opto-electronic integrated circuit (OEIC) includes an SOI substrate, a set of composite optical transmitters, a set of composite optical receivers, and control electronics disposed in the substrate and electrically coupled to the set of composite optical transmitters and receivers. Each of the composite optical transmitters includes a gain medium including a compound semiconductor material and an optical modulator. Each of the composite optical receivers includes a waveguide disposed in the SOI substrate, an optical detector bonded to the SOI substrate, and a bonding region disposed between the SOI substrate and the optical detector. The bonding region includes a metal-assisted bond at a first portion of the bonding region and a direct semiconductor-semiconductor bond at a second portion of the bonding region. The OEIC also includes control electronics disposed in the SOI substrate and electrically coupled to the set of composite optical transmitters and the set of composite optical receivers.
    • 光电集成电路(OEIC)包括SOI衬底,一组复合光发射器,一组复合光接收器和设置在衬底中的电耦合到该组合的光发射器和接收器的控制电子器件。 每个复合光发射机包括包括化合物半导体材料和光调制器的增益介质。 每个复合光接收机包括布置在SOI衬底中的波导,接合到SOI衬底的光学检测器和设置在SOI衬底和光学检测器之间的接合区域。 接合区域包括在接合区域的第一部分处的金属辅助键和在接合区域的第二部分处的直接半导体 - 半导体结合。 OEIC还包括设置在SOI衬底中并且电耦合到该组复合光发射器和该组复合光接收器的控制电子装置。