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1. 发明授权

US06396156B1 Flip-chip bonding structure with stress-buffering property and method for making the same 有权
标题翻译：具有应力缓冲性能的倒装片结合结构及其制造方法
公开(公告)号：US06396156B1
公开(公告)日：2002-05-28
申请号：US09656572
申请日：2000-09-07
申请人： Wen-Sen Tang , Shih-Kuang Chiu
发明人： Wen-Sen Tang , Shih-Kuang Chiu
IPC分类号： H01L2352
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05026 , H01L2224/05572 , H01L2224/13099 , H01L2224/131 , H01L2224/81801 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/351 , H01L2924/00 , H01L2224/05005 , H01L2224/05541 , H01L2224/05647 , H01L2924/00014 , H01L2224/05124
摘要： A flip-chip bonding structure with stress-buffering property is proposed, which can help prevent cracking and warpage to the flip-chip construction due to thermal stress. The proposed flip-chip bonding structure used to bond a flip chip to a substrate, and is characterized in the provision of a first electrically-conductive stress-buffering layer over the chip-side bond pad and a second electrically-conductive stress-buffering layer over the substrate-side bond pad, so that under high-temperature conditions, the thermal stress from the flip chip can be buffered by the first electrically-conductive stress-buffering layer, while the thermal stress from the substrate can be buffered by the second electrically-conductive stress-buffering layer, thus preventing cracking and warpage to the flip-chip construction. As a result, the finished flip-chip package can be more assured in quality and reliability than the prior art.
摘要翻译：提出了一种具有应力缓冲性能的倒装键合结构，可以有效防止由于热应力引起的倒装芯片的开裂和翘曲。所提出的用于将倒装芯片接合到衬底的倒装芯片接合结构，其特征在于在芯片侧接合焊盘上设置第一导电应力缓冲层和第二导电应力缓冲层在高温条件下，来自倒装芯片的热应力可以被第一导电应力缓冲层缓冲，而来自衬底的热应力可以由第二导电应力缓冲层缓冲导电应力缓冲层，从而防止倒装芯片结构的开裂和翘曲。结果，与现有技术相比，完成的倒装芯片封装的质量和可靠性可以更加确保。

2. 发明申请

US20060048065A1 Event handling system 审中-公开
标题翻译：事件处理系统
公开(公告)号：US20060048065A1
公开(公告)日：2006-03-02
申请号：US10932118
申请日：2004-09-02
申请人： Wen-Sen Tang , Yu-Jen Chen
发明人： Wen-Sen Tang , Yu-Jen Chen
IPC分类号： G06F17/00
CPC分类号： G06F9/542 , G06F2209/543 , G06F2209/545
摘要： The present invention is an event handling system executed in a computer with a Windows operating system. Event setup codes are used to setup which system events and application events are needed to be monitored, and to setup to use one of colors of a full-color notifying light corresponding to the event when the events occur. A notifier manager is used to detect monitored system events and application events and to send a command to notifier interface codes. A notifier connected to the computer comprises: a full-color notifying light and a firmware. The notifier executes the firmware and makes a light emit light of a color corresponding to the event. The notifier interface codes are used as a device driver of the notifier which receives the command sent by the notifier manager and sends the command to the notifier.
摘要翻译：本发明是在具有Windows操作系统的计算机中执行的事件处理系统。事件设置代码用于设置需要监视哪些系统事件和应用程序事件，并设置为在事件发生时使用与事件相对应的全色通知灯中的一种。通知器管理器用于检测受监视的系统事件和应用程序事件，并向通知程序接口代码发送命令。连接到计算机的通知器包括：全色通知灯和固件。通知器执行固件并使光发出与事件相对应的颜色。通知器接口代码用作通知器的设备驱动程序，该通知程序接收通知程序管理器发送的命令，并将该命令发送给通知程序。

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