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    • 3. 发明申请
    • FLUID FLOW PLATE ASSEMBLY HAVING PARALLEL FLOW CHANNELS
    • 具有平行流动通道的流体流通板组件
    • US20110132477A1
    • 2011-06-09
    • US12860421
    • 2010-08-20
    • Chi-Chang ChenHuan-Ruei ShiuWen-Chen ChangFanghei Tsau
    • Chi-Chang ChenHuan-Ruei ShiuWen-Chen ChangFanghei Tsau
    • F16L41/00
    • H01M8/0258H01M8/0263H01M8/241H01M8/2483H01M8/2485Y10T137/85938
    • A fluid flow plate assembly may include a first manifold, a second manifold, a first flow channel, and a second flow channel. The first manifold may have a fluid inlet for receiving an incoming fluid and may extend along a first direction to provide a channel for transporting the incoming fluid along the first direction. The first manifold may have at least two distribution outlets, each located in at least a portion of a sidewall region of the first manifold. The first manifold releases at least one portion of the incoming fluid as a released fluid through each distribution outlet. The second manifold may have a fluid outlet for discharging a discharged fluid, and the discharged fluid includes at least one portion of the incoming fluid. The second manifold may extend along a second direction to provide a channel for transporting the discharged fluid along the second direction. The second manifold receives the discharged fluid through at least two discharged fluid inlets on the second manifold. The first and second flow channels are coupled between the first manifold and the second manifold through distribution outlets and discharged fluid inlets. The second flow channel is parallel to the first flow channel with a dividing wall between the first and second flow channels.
    • 流体流动板组件可以包括第一歧管,第二歧管,第一流动通道和第二流动通道。 第一歧管可以具有用于接收进入流体的流体入口,并且可以沿着第一方向延伸以提供用于沿着第一方向输送进入的流体的通道。 第一歧管可以具有至少两个分配出口,每个分配出口位于第一歧管的侧壁区域的至少一部分中。 第一歧管将进入的流体的至少一部分作为释放的流体释放通过每个分配出口。 第二歧管可以具有用于排出排出的流体的流体出口,并且排出的流体包括进入流体的至少一部分。 第二歧管可以沿着第二方向延伸以提供用于沿着第二方向输送排出的流体的通道。 第二歧管通过第二歧管上的至少两个排出的流体入口接收排出的流体。 第一和第二流动通道通过分配出口和排出的流体入口联接在第一歧管和第二歧管之间。 第二流动通道平行于第一流动通道,在第一和第二流动通道之间具有分隔壁。
    • 6. 发明申请
    • FUEL CELL STACK
    • 燃料电池堆
    • US20100143765A1
    • 2010-06-10
    • US12497532
    • 2009-07-02
    • Chi-Chang ChenHuan-Ruei ShiuKuei-Han ChenFangHei TsauWen-Chen Chang
    • Chi-Chang ChenHuan-Ruei ShiuKuei-Han ChenFangHei TsauWen-Chen Chang
    • H01M8/04H01M2/02
    • H01M8/2475H01M2008/1095H01M2250/20Y02T90/32
    • A fuel cell stack including a first end plate, a second end plate, at least a fuel cell, a first current collector and a second current collector is provided. The first end plate includes a first end plate structure component, which is combined with a first end plate manifold component. The second end plate includes a second end plate structure component, which is combined with a second end plate manifold component. The first and the second end plate manifold components are placed between the first and the second end plate structure components, while the fuel cell is disposed between the first and the second end plate manifold components. The first current collector is disposed between the first end plate manifold component and the fuel cell. The second current collector is disposed between the second end plate manifold component and the fuel cell.
    • 提供了包括第一端板,第二端板,至少燃料电池,第一集电器和第二集电器的燃料电池堆。 第一端板包括与第一端板歧管部件组合的第一端板结构部件。 第二端板包括与第二端板歧管部件组合的第二端板结构部件。 第一和第二端板歧管部件被放置在第一和第二端板结构部件之间,而燃料电池设置在第一和第二端板歧管部件之间。 第一集电器设置在第一端板歧管部件和燃料电池之间。 第二集电器设置在第二端板歧管部件和燃料电池之间。
    • 9. 发明授权
    • Method and system for yield loss analysis by yield management system
    • 产量管理系统产量损失分析方法与系统
    • US06389323B1
    • 2002-05-14
    • US09426405
    • 1999-10-25
    • Jiunn-Der YangRenn-Shyan YehChao-Hsin ChangWen-Chen Chang
    • Jiunn-Der YangRenn-Shyan YehChao-Hsin ChangWen-Chen Chang
    • G06F1900
    • H01L22/20H01L22/12
    • A method and system provide for yield loss analysis for use in determining the killer stage in the manufacture of a semiconductor wafer at a plurality of manufacturing stages. The method comprising the following steps. Inspect semiconductor devices on the wafer visually to identify the location of visual defects on dies being manufactured on the wafer and to maintain a count of visual defects on the dies by location. Inspect the semiconductor dies on the wafer to determine the location and number defective dies on the wafer at each of the manufacturing stages. Calculate the defective die count for each stage for the wafer. Calculate the defective bad die count for each stage for the wafer. Determine the percentage of the defective bad die count divided by the defective die count. Plot the trend of the percentage of yield loss and the percentage of defective bad dies for each of the manufacturing stages. Compare the plots to determine the killer stage from analysis of the relative trends of matching between the plots of yield lost and the percentage of bad dies for the stage.
    • 一种方法和系统提供用于确定在多个制造阶段制造半导体晶片的杀手级的屈服损失分析。 该方法包括以下步骤。 目视检查晶片上的半导体器件,以识别在晶片上制造的裸片上的视觉缺陷的位置,并通过位置维持模具上的视觉缺陷的计数。 检查晶片上的半导体管芯是否确定在每个制造阶段晶片上的缺陷管芯的位置和数量。 计算晶片每个阶段的有缺陷的裸片数量。 计算晶片每个阶段的有缺陷的坏死数。 确定有缺陷的坏死计数除以有缺陷的死亡计数的百分比。 绘制每个制造阶段产量损失百分比和有缺陷坏死率的百分比趋势。 比较图,从分析产量损失曲线与该阶段不良模具百分比的相对趋势分析确定杀手阶段。