专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20130322039A1 CAP FOR A MICROELECTROMECHANICAL SYSTEM DEVICE WITH ELECTROMAGNETIC SHIELDING, AND METHOD OF MANUFACTURE 有权
标题翻译：具有电磁屏蔽的微电子电子系统装置的封装及其制造方法
公开(公告)号：US20130322039A1
公开(公告)日：2013-12-05
申请号：US13485631
申请日：2012-05-31
申请人： Jerome Teysseyre , Glenn de los Reyes , Wee Chin Judy Lim
发明人： Jerome Teysseyre , Glenn de los Reyes , Wee Chin Judy Lim
IPC分类号： H05K5/02 , B05D5/12 , B32B37/10 , H05K9/00 , B32B37/02
CPC分类号： H05K9/003
摘要： A cap for a microelectromechanical system device includes a first layer of, e.g., Bismaleimide Triazine (BT) resin material in which a through-aperture is formed, laminated to a second layer of BT resin material that closes the aperture in the first layer, forming a cavity. The first and second layers are laminated with a thermosetting adhesive that is sufficiently thick to encapsulate particles that may remain from a routing operation for forming the apertures. The interior of the cavity, including exposed portions of the adhesive, and the exposed face of the first layer are coated with an electrically conductive paint. The cap is adhered to a substrate over the MEMS device using an electrically conductive adhesive, which couples the conductive paint layer to a ground plane of the substrate. The layer of conductive paint serves as a shield to prevent or reduce electromagnetic interference acting on the MEMS device.
摘要翻译：用于微机电系统装置的盖子包括第一层，例如其中形成有通孔的双马来酰亚胺三嗪（BT）树脂材料，层压到封闭第一层中的孔的第二层BT树脂材料上，形成一个空腔。第一层和第二层与热固性粘合剂层压，该热固性粘合剂足够厚以封装可以从用于形成孔的路由操作保留的颗粒。空腔的内部，包括粘合剂的暴露部分和第一层的暴露表面涂覆有导电涂料。使用导电粘合剂将盖子粘附到MEMS装置上的基板上，导电粘合剂将导电涂料层耦合到基板的接地平面。导电涂料层用作屏蔽，以防止或减少作用在MEMS器件上的电磁干扰。

2. 发明申请

US20070221917A1 Method of preparing nanowire(s) and product(s) obtained therefrom 审中-公开
标题翻译：制备由其获得的纳米线和产物的方法
公开(公告)号：US20070221917A1
公开(公告)日：2007-09-27
申请号：US11727126
申请日：2007-03-23
申请人： Wee Chin , Chenmin Liu
发明人： Wee Chin , Chenmin Liu
IPC分类号： H01L51/00 , H01L29/08
CPC分类号： C30B29/60 , B82Y10/00 , C30B7/12
摘要： The present invention provides a method of preparing at least one nanowire comprising the steps of: (a) providing at least one nanotemplate and at least one electrically conductive element in contact with the nanotemplate; (b) providing at least one organic linker, the organic linker having a first end and a second end, such that the first end is in contact with the electrically conductive element; and (c) performing at least one electrochemical deposition for the formation of at least one nanowire. The present invention also provides nanowires prepared according to the method of the invention.
摘要翻译：本发明提供了制备至少一种纳米线的方法，包括以下步骤：（a）提供至少一个纳米模板和至少一个与纳米模板接触的导电元件; （b）提供至少一个有机接头，所述有机接头具有第一端和第二端，使得所述第一端与所述导电元件接触; 和（c）进行至少一个用于形成至少一个纳米线的电化学沉积。本发明还提供了根据本发明的方法制备的纳米线。

3. 发明申请

US20060127302A1 Method of preparing metal chalcogenide particles 失效
标题翻译：金属硫族化物颗粒的制备方法
公开(公告)号：US20060127302A1
公开(公告)日：2006-06-15
申请号：US10559199
申请日：2004-06-04
申请人： Wee Chin , Zhihua Zhang , Wen Lim
发明人： Wee Chin , Zhihua Zhang , Wen Lim
IPC分类号： C01B17/20
CPC分类号： B82Y30/00 , C01B17/20 , C01B19/007 , C01G1/12 , C01G5/00 , C01G11/02 , C01G21/21 , C01P2002/72 , C01P2004/03 , C01P2004/04 , C01P2004/10 , C01P2004/12 , C01P2004/20 , C01P2004/22 , C01P2004/30 , C01P2004/32 , C01P2004/38 , C01P2004/41 , C01P2004/61 , C01P2004/62 , C01P2004/64 , Y10S977/773 , Y10S977/775 , Y10S977/777 , Y10S977/811
摘要： A method of preparing metal chalcogenide particles. The method comprising the step of reacting an amine and metal complex precursors. The metal complex precursors comprising a chalcogenide and an electrophilic group. The reaction forming metal chalcogenide particles substantially free of the electrophilic group.
摘要翻译：制备金属硫族化物颗粒的方法。该方法包括使胺和金属络合物前体反应的步骤。包含硫族化物和亲电子基团的金属络合物前体。形成基本上不含亲电子基团的金属硫族化物颗粒的反应。

4. 发明授权

US08987871B2 Cap for a microelectromechanical system device with electromagnetic shielding, and method of manufacture 有权
标题翻译：用于具有电磁屏蔽的微机电系统装置及其制造方法
公开(公告)号：US08987871B2
公开(公告)日：2015-03-24
申请号：US13485631
申请日：2012-05-31
申请人： Jerome Teysseyre , Glenn de los Reyes , Wee Chin Judy Lim
发明人： Jerome Teysseyre , Glenn de los Reyes , Wee Chin Judy Lim
IPC分类号： H01L23/60 , H05K9/00
CPC分类号： H05K9/003
摘要： A cap for a microelectromechanical system device includes a first layer of, e.g., Bismaleimide Triazine (BT) resin material in which a through-aperture is formed, laminated to a second layer of BT resin material that closes the aperture in the first layer, forming a cavity. The first and second layers are laminated with a thermosetting adhesive that is sufficiently thick to encapsulate particles that may remain from a routing operation for forming the apertures. The interior of the cavity, including exposed portions of the adhesive, and the exposed face of the first layer are coated with an electrically conductive paint. The cap is adhered to a substrate over the MEMS device using an electrically conductive adhesive, which couples the conductive paint layer to a ground plane of the substrate. The layer of conductive paint serves as a shield to prevent or reduce electromagnetic interference acting on the MEMS device.
摘要翻译：用于微机电系统装置的盖子包括第一层，例如其中形成有通孔的双马来酰亚胺三嗪（BT）树脂材料，层压到封闭第一层中的孔的第二层BT树脂材料上，形成一个空腔。第一层和第二层与热固性粘合剂层压，该热固性粘合剂足够厚以封装可以从用于形成孔的路由操作保留的颗粒。空腔的内部，包括粘合剂的暴露部分和第一层的暴露表面涂覆有导电涂料。使用导电粘合剂将盖子粘附到MEMS装置上的基板上，导电粘合剂将导电涂料层耦合到基板的接地平面。导电涂料层用作屏蔽，以防止或减少作用在MEMS器件上的电磁干扰。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式