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1. 发明授权

US07477118B2 High frequency device mounting substrate and communications apparatus 有权
标题翻译：高频装置安装基板和通讯装置
公开(公告)号：US07477118B2
公开(公告)日：2009-01-13
申请号：US11335195
申请日：2006-01-19
申请人： Takanori Ikuta , Wataru Koga , Hiroki Kan , Yuuko Yokota
发明人： Takanori Ikuta , Wataru Koga , Hiroki Kan , Yuuko Yokota
IPC分类号： H01P3/08 , H03H9/00 , H01R12/14 , H01R12/30
CPC分类号： H05K1/0243 , H01L21/4853 , H01L2224/16225 , H05K1/0219 , H05K1/111 , H05K1/117 , H05K3/429 , H05K2201/09281 , H05K2201/09418 , H05K2201/09572 , H05K2201/09618 , H05K2201/0979 , H05K2201/09809 , H05K2201/10189 , Y02P70/611
摘要： Terminal electrodes 9 for carrying a high frequency device 3 are formed on a surface of a circuit board having its reverse surface covered with a reverse surface conductor layer 6, and a plurality of signal lines 2 for exchanging a signal between the high frequency device 3 and an external circuit are formed thereon. The terminal electrode 9 is arranged at the center of the circuit board, and the signal lines 2 radially extends from the terminal electrode 9. Electromagnetic interference between the signal lines 2 can be reduced, so that out-of-band attenuation characteristics and isolation characteristics can be satisfactorily exhibited in a case where the high frequency device 3 is a duplexer.
摘要翻译：用于承载高频器件3的端子电极9形成在电路板的表面，其表面覆盖有反面导体层6，并且多个信号线2用于在高频器件3和在其上形成外部电路。端子电极9布置在电路板的中心，并且信号线2从端子电极9径向延伸。可以减小信号线2之间的电磁干扰，使得带外衰减特性和隔离特性可以在高频装置3为双工器的情况下令人满意地展现。

2. 发明申请

US20060012450A1 Method for manufacturing surface acoustic wave device 有权
标题翻译：声表面波装置的制造方法
公开(公告)号：US20060012450A1
公开(公告)日：2006-01-19
申请号：US11169292
申请日：2005-06-28
申请人： Wataru Koga , Kiyohiro Iioka , Mitsutaka Shimada , Shinichiro Kitanishi
发明人： Wataru Koga , Kiyohiro Iioka , Mitsutaka Shimada , Shinichiro Kitanishi
IPC分类号： H03H9/64
CPC分类号： H03H9/1085 , H01L24/97 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15787 , H03H3/08 , H03H2009/0019 , Y10T29/42 , Y10T428/24083 , Y10T428/24099 , H01L2224/81 , H01L2924/00
摘要： A plurality of surface acoustic wave elements, with an IDT electrode 2 and a pad electrode 3 formed on the principal surface of a piezoelectric substrate 1, are formed to be flip-chip mounted on a circuit board 5 and sealed using sealing resin 7. The circuit board 5 is diced integrally with the sealing resin 7 applying a rotating dicing blade 8 from the bottom surface side thereof to produce a plurality of surface acoustic wave devices. The side surfaces of the surface acoustic wave devices can be formed perpendicularly with dimensional accuracy without rounding or chipping an edge portion of the sealing resin 7.
摘要翻译：形成在压电基板1的主面上形成有IDT电极2和焊盘电极3的多个声表面波元件被倒装安装在电路板5上，并使用密封树脂7密封。电路板5与密封树脂7一体地切割，从密封树脂7的底面侧施加旋转的切割刀片8，以产生多个表面声波装置。表面声波装置的侧面可以垂直于尺寸精度形成，而不会使密封树脂7的边缘部分变圆或碎裂。

3. 发明申请

US20050285475A1 Surface acoustic wave device manufacturing method, surface acoustic wave device, and communications equipment 有权
标题翻译：表面声波器件制造方法，表面声波器件和通讯设备
公开(公告)号：US20050285475A1
公开(公告)日：2005-12-29
申请号：US11169141
申请日：2005-06-27
申请人： Yuuko Yokota , Motoki Ito , Kiyohiro Iioka , Wataru Koga , Shigehiko Nagamine
发明人： Yuuko Yokota , Motoki Ito , Kiyohiro Iioka , Wataru Koga , Shigehiko Nagamine
IPC分类号： H01L41/04 , H03H3/08 , H03H9/02 , H03H9/72
CPC分类号： H03H9/02913 , H03H3/08 , H03H9/0576 , H03H9/72 , H03H9/725 , Y10T29/42 , Y10T29/49005 , Y10T29/4908 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155
摘要： After electrode patterning on an electrode forming surface of a piezoelectric substrate 2 (FIG. 1(b)), a conductor layer is formed on an electrode non-forming surface of the piezoelectric substrate 2 (FIG. 1(c)). After forming the conductor layer, the conductor layer formed on the other surface is removed (FIG. 1(f)) after at least one step (FIG. 1(e)), and thereafter, dicing for separation into elements and mounting on a mounting substrate are carried out. By removing all the conductor layer on the other surface of the piezoelectric substrate, the out-of-passband attenuation and isolation performance can be significantly improved.
摘要翻译：在压电基板2的电极形成表面上的电极图案化之后（图1（b）），在压电基板2的非电极形成表面上形成导体层（图1（c））。在形成导体层之后，在至少一个步骤（图1（e））之后，除去形成在另一个表面上的导体层（图1（f）），然后，分离成元件并安装在导体层上执行安装基板。通过去除压电基板的另一表面上的所有导体层，可以显着地提高通带衰减和隔离性能。

4. 外观设计

USD279303S Pasteboard for playing cards 失效
公开(公告)号：USD279303S
公开(公告)日：1985-06-18
申请号：US441344
申请日：1982-11-15
申请人： Wataru Koga
设计人： Wataru Koga

5. 发明授权

US08587389B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US08587389B2
公开(公告)日：2013-11-19
申请号：US12675110
申请日：2008-08-29
申请人： Wataru Koga , Yuuko Yokota , Motoki Itou , Yoshifumi Yamagata
发明人： Wataru Koga , Yuuko Yokota , Motoki Itou , Yoshifumi Yamagata
IPC分类号： H03H9/00 , H01L41/00
CPC分类号： H03H9/725 , H03H9/0576
摘要： The branching filter has the piezoelectric substrate having the main surface on which there are formed a transmission filter, which includes an input electrode and an antenna electrode, and a reception filter, which includes an output electrodes and the antenna electrode. The branching filter also has the mounting substrate having, on a first main surface, a first electrode group that is connected to the transmission filter and reception filter and that is formed symmetrical with respect to a line when viewed from the above, and also having, on a second main surface locating on the opposite side to the first main surface, a second electrode group that is connected to the circuit interconnects of an external circuit board and that is formed symmetrical with respect to a line when viewed from the above.
摘要翻译：分路滤波器具有主表面的压电基板，其上形成有包括输入电极和天线电极的透射滤光器，以及包括输出电极和天线电极的接收滤波器。分支滤波器还具有安装基板，其在第一主表面上具有连接到透射滤光器和接收滤光器的第一电极组，并且当从上方观察时相对于线对称地形成，在位于与第一主表面相反一侧的第二主表面上的第二电极组，连接到外部电路板的电路互连件并且当从上面观察时相对于线形成对称的第二电极组。

6. 发明申请

US20110109400A1 Electronic Device 有权
标题翻译：电子设备
公开(公告)号：US20110109400A1
公开(公告)日：2011-05-12
申请号：US12675110
申请日：2008-08-29
申请人： Wataru Koga , Yuuko Yokota , Motoki Itou , Yoshifumi Yamagata
发明人： Wataru Koga , Yuuko Yokota , Motoki Itou , Yoshifumi Yamagata
IPC分类号： H03H9/205 , H03H9/54 , H03H7/38
CPC分类号： H03H9/725 , H03H9/0576
摘要： To provide a branching filter enabling sharing of the same mounting substrate between the normal arrangement and the mirror arrangement that is symmetric to the normal arrangement of an electrode group formed on a main surface of a piezoelectric substrate and a method for manufacturing the same. The branching filter 1 has the piezoelectric substrate 20 having the main surface on which there are formed a transmission filter 26, which includes an input electrode 22 and an antenna electrode 23, and a reception filter 27, which includes an output electrodes 24, 25 and the antenna electrode 23. The branching filter 1 also has the mounting substrate 40 having, on a first main surface, a first electrode group that is connected to the transmission filter 26 and reception filter 27 and that is formed symmetrical with respect to a line when viewed from the above, and also having, on a second main surface locating on the opposite side to the first main surface, a second electrode group that is connected to the circuit interconnects of an external circuit board and that is formed symmetrical with respect to a line when viewed from the above.
摘要翻译：提供一种分支滤波器，其使得能够在与压电基板的主表面上形成的电极组的正常布置对称的正常布置和反射镜布置之间共享相同的安装基板及其制造方法。分路滤波器1具有主表面的压电基板20，其上形成有包括输入电极22和天线电极23的透射滤光器26和接收滤光器27，其包括输出电极24,25和分支滤波器1还具有安装基板40，其在第一主表面上具有连接到透射滤光器26和接收滤光器27的第一电极组，并且相对于线对称地形成并且在与第一主表面相对的一侧的第二主表面上还具有第二电极组，该第二电极组连接到外部电路板的电路互连件，并且相对于第一主表面对称地形成从上方观察时。

7. 发明授权

US07389570B2 Surface acoustic wave device manufacturing method, surface acoustic wave device, and communications equipment 有权
标题翻译：表面声波器件制造方法，表面声波器件和通讯设备
公开(公告)号：US07389570B2
公开(公告)日：2008-06-24
申请号：US11169141
申请日：2005-06-27
申请人： Yuuko Yokota , Motoki Ito , Kiyohiro Iioka , Wataru Koga , Shigehiko Nagamine
发明人： Yuuko Yokota , Motoki Ito , Kiyohiro Iioka , Wataru Koga , Shigehiko Nagamine
IPC分类号： H03H3/08
CPC分类号： H03H9/02913 , H03H3/08 , H03H9/0576 , H03H9/72 , H03H9/725 , Y10T29/42 , Y10T29/49005 , Y10T29/4908 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155
摘要： After electrode patterning on an electrode forming surface of a piezoelectric substrate 2 (FIG. 1(b)), a conductor layer is formed on an electrode non-forming surface of the piezoelectric substrate 2 (FIG. 1(c)). After forming the conductor layer, the conductor layer formed on the other surface is removed (FIG. 1(f)) after at least one step (FIG. 1(e)), and thereafter, dicing for separation into elements and mounting on a mounting substrate are carried out. By removing all the conductor layer on the other surface of the piezoelectric substrate, the out-of-passband attenuation and isolation performance can be significantly improved.
摘要翻译：在压电基板2的电极形成表面上的电极图案化之后（图1（b）），在压电基板2的非电极形成表面上形成导体层（图1（c））。在形成导体层之后，在至少一个步骤（图1（e））之后，除去形成在另一个表面上的导体层（图1（f）），然后，分离成元件并安装在导体层上执行安装基板。通过去除压电基板的另一表面上的所有导体层，可以显着地提高通带衰减和隔离性能。

8. 发明授权

US07248133B2 Method for manufacturing surface acoustic wave device 有权
标题翻译：声表面波装置的制造方法
公开(公告)号：US07248133B2
公开(公告)日：2007-07-24
申请号：US11169292
申请日：2005-06-28
申请人： Wataru Koga , Kiyohiro Iioka , Mitsutaka Shimada , Shinichiro Kitanishi
发明人： Wataru Koga , Kiyohiro Iioka , Mitsutaka Shimada , Shinichiro Kitanishi
IPC分类号： H03H3/08 , H03H9/64 , H03H9/72
CPC分类号： H03H9/1085 , H01L24/97 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15787 , H03H3/08 , H03H2009/0019 , Y10T29/42 , Y10T428/24083 , Y10T428/24099 , H01L2224/81 , H01L2924/00
摘要： A plurality of surface acoustic wave elements, with an IDT electrode 2 and a pad electrode 3 formed on the principal surface of a piezoelectric substrate 1, are formed to be flip-chip mounted on a circuit board 5 and sealed using sealing resin 7. The circuit board 5 is diced integrally with the sealing resin 7 applying a rotating dicing blade 8 from the bottom surface side thereof to produce a plurality of surface acoustic wave devices. The side surfaces of the surface acoustic wave devices can be formed perpendicularly with dimensional accuracy without rounding or chipping an edge portion of the sealing resin 7.
摘要翻译：形成在压电基板1的主面上形成有IDT电极2和焊盘电极3的多个声表面波元件被倒装安装在电路板5上，并使用密封树脂7密封。电路板5与密封树脂7一体地切割，从密封树脂7的底面侧施加旋转的切割刀片8，以产生多个表面声波装置。表面声波装置的侧面可以垂直于尺寸精度形成，而不会使密封树脂7的边缘部分变圆或碎裂。

9. 发明申请

US20090147707A1 DEMULTIPLEXER AND COMMUNICATION DEVICE 有权
标题翻译：解复用器和通信设备
公开(公告)号：US20090147707A1
公开(公告)日：2009-06-11
申请号：US12281975
申请日：2007-03-07
申请人： Wataru Koga , Takeshi Takenoshita , Takanori Ikuta
发明人： Wataru Koga , Takeshi Takenoshita , Takanori Ikuta
IPC分类号： H04B1/44
CPC分类号： H04B1/0057 , H01P1/213 , H03H9/725 , H04B1/52
摘要： Provided is a demultiplexer capable of improving attenuation characteristic and isolation characteristic of a filter having a lower transmission frequency band among two filters having different transmission frequency bands, outside the transmission frequency band of a high-frequency side. A communication device using the demultiplexer is also disclosed. A first spiral wiring portion (55) and a sixth wiring portion (56) are formed so that an angle defined by a direction of a part (L1) of the first spiral wiring portion (55) and a direction of a part (L2) of the sixth spiral wiring portion (56) on a predetermined virtual plane is, for >example, 0 degree and the direction of the current flowing in the part (L1) of the first spiral wiring portion (55) is opposite to the direction of the current flowing in the part (L2) if the sixth wiring portion (56).
摘要翻译：提供了一种能够在高频侧的发送频带之外的两个具有不同发送频带的滤波器中具有较低发送频带的滤波器的衰减特性和隔离特性的解复用器。还公开了使用解复用器的通信设备。第一螺旋布线部（55）和第六布线部（56）形成为由第一螺旋布线部（55）的一部分（L1）的方向和部分（L2）的方向限定的角度，例如为0度，并且在第一螺旋线路部（55）的部分（L1）中流动的电流的方向与第一螺旋线路部（56）的预定虚拟平面的方向相反，如果第六布线部分（56），则流入部分（L2）的电流。

10. 发明申请

US20070069834A1 High frequency device mounting substrate and communications apparatus 有权
标题翻译：高频装置安装基板和通讯装置
公开(公告)号：US20070069834A1
公开(公告)日：2007-03-29
申请号：US11335195
申请日：2006-01-19
申请人： Takanori Ikuta , Wataru Koga , Hiroki Kan , Yuuko Yokota
发明人： Takanori Ikuta , Wataru Koga , Hiroki Kan , Yuuko Yokota
IPC分类号： H03H9/70
CPC分类号： H05K1/0243 , H01L21/4853 , H01L2224/16225 , H05K1/0219 , H05K1/111 , H05K1/117 , H05K3/429 , H05K2201/09281 , H05K2201/09418 , H05K2201/09572 , H05K2201/09618 , H05K2201/0979 , H05K2201/09809 , H05K2201/10189 , Y02P70/611
摘要： Terminal electrodes 9 for carrying a high frequency device 3 are formed on a surface of a circuit board having its reverse surface covered with a reverse surface conductor layer 6, and a plurality of signal lines 2 for exchanging a signal between the high frequency device 3 and an external circuit are formed thereon. The terminal electrode 9 is arranged at the center of the circuit board, and the signal lines 2 radially extends from the terminal electrode 9. Electromagnetic interference between the signal lines 2 can be reduced, so that out-of-band attenuation characteristics and isolation characteristics can be satisfactorily exhibited in a case where the high frequency device 3 is a duplexer.
摘要翻译：用于承载高频器件3的端子电极9形成在电路板的表面，其表面覆盖有反面导体层6，并且多个信号线2用于在高频器件3和在其上形成外部电路。端子电极9布置在电路板的中心，信号线2从端子电极9径向延伸。可以减小信号线2之间的电磁干扰，从而在高频装置3为双工器的情况下，可以令人满意地表现出带外衰减特性和隔离特性。

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