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1. 发明授权

US06499135B1 Computer aided design flow to locate grounded fill in a large scale integrated circuit 有权
标题翻译：计算机辅助设计流程来定位接地填充大规模集成电路
公开(公告)号：US06499135B1
公开(公告)日：2002-12-24
申请号：US09579109
申请日：2000-05-25
申请人： Mu-Jing Li , Ward Vercruysse , Pankaj Dixit , Timothy Horel
发明人： Mu-Jing Li , Ward Vercruysse , Pankaj Dixit , Timothy Horel
IPC分类号： G06F1750
CPC分类号： G06F17/5068
摘要： For an integrated circuit having multiple metal layers, a computer-aided design (CAD) method for designing grounded fill in the integrated circuit includes: (a) finding the eligible fill areas for each metal layer; (b) storing the eligible fill area data for each metal layer in an overflow memory; (c) finding ground contact areas for each metal layer; (d) storing the ground contact area data for each metal layer in an overflow memory; (e) temporarily storing the eligible fill area data for a selected metal layer and the ground contact area data for the metal layers adjacent to the selected metal layer in active memory; (f) fitting a fill pattern to an eligible fill area in the selected metal layer, where the fill pattern is composed of at least one element; (g) checking the adjacent metal layers for a ground contact where the element of the fill pattern may be grounded; (h) locating a conductive via between the element of the fill pattern and a ground contact in an adjacent layer; and (i) repeating steps (e) through (h) for each metal layer.
摘要翻译：对于具有多个金属层的集成电路，用于设计集成电路中的接地填充的计算机辅助设计（CAD）方法包括：（a）找到每个金属层的合格填充区域; （b）将每个金属层的合格填充区域数据存储在溢出存储器中; （c）找出每个金属层的接地面积; （d）将每个金属层的接地面积数据存储在溢出存储器中; （e）临时存储所选择的金属层的合格填充区域数据和与所选金属层相邻的金属层的有源存储器中的接地区域数据; （f）将填充图案拟合到所选择的金属层中的合格填充区域，其中填充图案由至少一个元素组成; （g）检查相邻的金属层以获得填充图案的元件可以接地的接地触点; （h）将填充图案的元件和相邻层中的接地触点之间的导电通孔定位; 和（i）对于每个金属层重复步骤（e）至（h）。

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