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1. 发明授权

US09153971B2 Housing for accommodating an electronic circuit 有权
标题翻译：用于容纳电子电路的外壳
公开(公告)号：US09153971B2
公开(公告)日：2015-10-06
申请号：US14352234
申请日：2011-11-30
申请人： Thomas Sauer , Dieter Best , Walter Matter , Joachim Berberich
发明人： Thomas Sauer , Dieter Best , Walter Matter , Joachim Berberich
IPC分类号： H05K5/06 , H02K5/10 , H02J7/00 , H02J3/32 , H02J3/24
CPC分类号： H02J7/00 , H02J3/24 , H02J3/32 , H02J7/0013 , H02J7/007 , H02K5/10 , H05K5/068
摘要： A housing for receiving an electronic circuit (4) having a plurality of components (5) having a carrier plate (7) and a housing cover (8) including a circumferentially enclosing wall (9) on the carrier plate (7) and a cover part (10) on the wall (9), which cover part (10) lies opposite the carrier plate (7). A volume compensation element (11) is attached on the carrier plate (7) in an interior (12) of the housing cover (8) which is enclosed in a pressure-tight manner from an external atmosphere. The volume compensation element (11) is elastically formed providing a variable volume for compensation of pressure fluctuations in the interior (12), which variable volume occurs with a change in position of the volume compensation element (11) relative to the carrier plate (7). A gap between the volume compensation element (11) and the carrier plate (7) is connected to the external atmosphere.
摘要翻译：一种用于接收电子电路（4）的壳体，所述电子电路（4）具有多个具有承载板（7）的部件（5）和在所述承载板（7）上包括周向包围壁（9）的壳体盖子，所述壁（9）上的部分（10），所述盖（10）位于所述承载板（7）的对面。体积补偿元件（11）安装在壳体盖（8）的内部（12）的承载板（7）上，外壳盖（8）的内部（12）从外部气氛以压力方式封闭。体积补偿元件（11）被弹性地形成，提供用于补偿内部（12）中的压力波动的可变容积，该容积补偿元件（11）随着体积补偿元件（11）相对于承载板（7）的位置变化而发生）。体积补偿元件（11）和承载板（7）之间的间隙连接到外部气氛。

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