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1. 发明授权

US08933837B2 Imaging system and method using spatially separated radiated fields 有权
标题翻译：使用空间分离的辐射场的成像系统和方法
公开(公告)号：US08933837B2
公开(公告)日：2015-01-13
申请号：US13381525
申请日：2010-06-25
申请人： Vladimir Okhmatovski
发明人： Vladimir Okhmatovski
IPC分类号： G01S13/00 , G01S13/89 , A61B5/05
CPC分类号： G01S13/89 , A61B5/05 , A61B5/0507
摘要： Methods and systems for use in imaging an imaging domain that spatially separate a scattered field and reconstruct an image based on the spatially separated scattered field (e.g., for use in microwave imaging applications including tumor detection in human tissue, etc.).
摘要翻译：用于成像域成像的方法和系统，其在空间上分离散射场并且基于空间分离的散射场（例如，用于包括人体组织中的肿瘤检测的微波成像应用等）来重建图像。

2. 发明申请

US20110029295A1 Method and Apparatus for Broadband Modeling of Current Flow in Three-Dimensional Wires of Integrated Circuits 有权
标题翻译：用于集成电路三维电线中电流流动宽带建模的方法和装置
公开(公告)号：US20110029295A1
公开(公告)日：2011-02-03
申请号：US12936017
申请日：2009-04-01
申请人： Vladimir Okhmatovski , Mohammed A.I. Al-Qedra
发明人： Vladimir Okhmatovski , Mohammed A.I. Al-Qedra
IPC分类号： G06F17/10
CPC分类号： G06F17/5036 , G06F17/5018 , H01B1/00
摘要： A new surface impedance model for extraction in lossy two-dimensional (2D) interconnects of rectangular cross-section is presented. The model is derived directly from the volumetric electric field integral equation (EFiE) under the approximation of the unknown volumetric current density as a product of the exponential factor describing the skin-effect and the unknown surface current density on the conductor's periphery. By proper accounting for the coupling between the boundary elements situated on the top and bottom surfaces of conductor with the elements located on the side-walls, the model maintains accuracy from DC to multi-GHz frequencies as well as for conductors with both large and small thickness/width ratios. A generalization of the full-periphery surface impedance model to the three-dimensional electric field integral equation is also described.
摘要翻译：提出了一种用于在矩形横截面的有损二维（2D）互连中提取的新的表面阻抗模型。该模型直接来自体积电场积分方程（EFiE），其近似于未知体积电流密度，作为描述皮肤效应的指数因子与导体外围的未知表面电流密度的乘积。通过适当考虑位于导体的顶面和底面之间的边界元件与位于侧壁上的元件之间的耦合，该模型保持从DC到多GHz频率的精度以及具有大和小的导体的精度厚度/宽度比。还描述了全周边表面阻抗模型对三维电场积分方程的推广。

3. 发明授权

US08312402B1 Method and apparatus for broadband electromagnetic modeling of three-dimensional interconnects embedded in multilayered substrates 失效
标题翻译：嵌入多层基板的三维互连宽带电磁建模方法及装置
公开(公告)号：US08312402B1
公开(公告)日：2012-11-13
申请号：US12423714
申请日：2009-04-14
申请人： Vladimir Okhmatovski , Mengtao Yuan , Rodney Phelps
发明人： Vladimir Okhmatovski , Mengtao Yuan , Rodney Phelps
IPC分类号： G06F9/455 , G06F17/50
CPC分类号： G06F17/5018 , G06F17/5036 , G06F17/5068
摘要： Systems and methods for modeling a multilayer integrated circuit include three-dimensional interconnect models in multilayered substrates for greater accuracy. Mesh models are used to resolve effects of nearby elements and grid models are used to resolve effects of far-away elements. Sidewall mesh elements of three-dimensional interconnects are projected onto parallel (or substantially parallel) grids between the top and bottom walls of the interconnects so that grid models can be used to resolve three-dimensional effects of interconnects in multilayered substrates.
摘要翻译：用于建模多层集成电路的系统和方法包括用于更高精度的多层衬底中的三维互连模型。网格模型用于解决附近元素的影响，网格模型用于解决远端元素的影响。三维互连的侧壁网格元件投影到互连的顶壁和底壁之间的平行（或基本上平行的）网格上，使得网格模型可用于解决多层基板中的互连的三维效应。

4. 发明申请

US20050076317A1 Method and apparatus for determining interactive electromagnetic effects among conductors of a multi-layer circuit 有权
标题翻译：用于确定多层电路的导体之间的交互式电磁效应的方法和装置
公开(公告)号：US20050076317A1
公开(公告)日：2005-04-07
申请号：US10837293
申请日：2004-04-30
申请人： Feng Ling , Vladimir Okhmatovski , Enis Dengi
发明人： Feng Ling , Vladimir Okhmatovski , Enis Dengi
IPC分类号： G06F17/50
CPC分类号： G06F17/5018 , G06F17/5036 , G06F2217/78
摘要： To estimate a distribution of voltages or currents in the layers of a multi-layer circuit, an exemplary current flow in each layer is discretized into a number of current vector elements and at least one scalar charge element related to the charge associated with each current vector element. A first distribution of voltages induced in each circuit layer is determined from current vector elements in all of the circuit layers. A second distribution of voltages induced in each circuit layer is determined from the scalar charge elements in all of the circuit layers. For each circuit layer, the first and second distributions of voltages induced therein are combined to determine an actual distribution of voltages in the circuit layer.
摘要翻译：为了估计多层电路层中的电压或电流的分布，每层中的示例性电流流离散化为多个电流矢量元素，以及与每个电流矢量相关的电荷相关的至少一个标量电荷元素元件。在每个电路层中感应的电压的第一分布由所有电路层中的电流矢量元素确定。在每个电路层中感应的电压的第二分布由所有电路层中的标量电荷元素确定。对于每个电路层，其中感应的电压的第一和第二分布被组合以确定电路层中的电压的实际分布。

5. 发明授权

US08731877B2 Method and apparatus for broadband modeling of current flow in three-dimensional wires of integrated circuits 有权
标题翻译：用于集成电路三维电线中电流流动宽带建模的方法和装置
公开(公告)号：US08731877B2
公开(公告)日：2014-05-20
申请号：US12936017
申请日：2009-04-01
申请人： Vladimir Okhmatovski , Mohammed A. I. Al-Qedra
发明人： Vladimir Okhmatovski , Mohammed A. I. Al-Qedra
IPC分类号： G06F17/10 , G06F17/50 , H01B1/00
CPC分类号： G06F17/5036 , G06F17/5018 , H01B1/00
摘要： A new surface impedance model for extraction in lossy two-dimensional (2D) interconnects of rectangular cross-section is presented. The model is derived directly from the volumetric electric field integral equation (EFiE) under the approximation of the unknown volumetric current density as a product of the exponential factor describing the skin-effect and the unknown surface current density on the conductor's periphery. By proper accounting for the coupling between the boundary elements situated on the top and bottom surfaces of conductor with the elements located on the side-walls, the model maintains accuracy from DC to multi-GHz frequencies as well as for conductors with both large and small thickness/width ratios. A generalization of the full-periphery surface impedance model to the three-dimensional electric field integral equation is also described.
摘要翻译：提出了一种用于在矩形横截面的有损二维（2D）互连中提取的新的表面阻抗模型。该模型直接来自体积电场积分方程（EFiE），其近似于未知体积电流密度，作为描述皮肤效应的指数因子与导体外围的未知表面电流密度的乘积。通过适当考虑位于导体的顶面和底面之间的边界元件与位于侧壁上的元件之间的耦合，该模型保持从DC到多GHz频率的精度以及具有大和小的导体的精度厚度/宽度比。还描述了全周边表面阻抗模型对三维电场积分方程的推广。

6. 发明授权

US08255849B1 Solver for modeling a multilayered integrated circuit with three-dimensional interconnects 失效
标题翻译：求解器用于对具有三维互连的多层集成电路进行建模
公开(公告)号：US08255849B1
公开(公告)日：2012-08-28
申请号：US12423722
申请日：2009-04-14
申请人： Vladimir Okhmatovski , Mengtao Yuan , Rodney Phelps
发明人： Vladimir Okhmatovski , Mengtao Yuan , Rodney Phelps
IPC分类号： G06F17/50
CPC分类号： G06F17/5018 , G06F17/5036 , G06F17/5068
摘要： Systems and methods for modeling a multilayer integrated circuit include three-dimensional interconnect models in multilayered substrates for greater accuracy. Mesh models are used to resolve effects of nearby elements and grid models are used to resolve effects of far-away elements. Sidewall mesh elements of three-dimensional interconnects are projected onto parallel (or substantially parallel) grids between the top and bottom walls of the interconnects so that grid models can be used to resolve three-dimensional effects of interconnects in multilayered substrates.
摘要翻译：用于建模多层集成电路的系统和方法包括用于更高精度的多层衬底中的三维互连模型。网格模型用于解决附近元素的影响，网格模型用于解决远端元素的影响。三维互连的侧壁网格元件投影到互连的顶壁和底壁之间的平行（或基本上平行的）网格上，使得网格模型可用于解决多层基板中的互连的三维效应。

7. 发明申请

US20120168607A1 IMAGING SYSTEM AND METHOD USING SPATIALLY SEPARATED RADIATED FIELDS 有权
标题翻译：成像系统和使用空间分离雷达场的方法
公开(公告)号：US20120168607A1
公开(公告)日：2012-07-05
申请号：US13381525
申请日：2010-06-25
申请人： Vladimir Okhmatovski
发明人： Vladimir Okhmatovski
IPC分类号： H01J40/14
CPC分类号： G01S13/89 , A61B5/05 , A61B5/0507
摘要： Methods and systems for use in imaging an imaging domain that spatially separate a scattered field and reconstruct an image based on the spatially separated scattered field (e.g., for use in microwave imaging applications including tumor detection in human tissue, etc.).
摘要翻译：用于成像域成像的方法和系统，其在空间上分离散射场并基于空间分离的散射场（例如，用于包括人体组织中的肿瘤检测的微波成像应用等）来重建图像。

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