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1. 发明授权

US06175644B1 Machine vision system for object feature analysis and validation based on multiple object images 失效
标题翻译：基于多物体图像的物体特征分析和验证的机器视觉系统
公开(公告)号：US06175644B1
公开(公告)日：2001-01-16
申请号：US09071722
申请日：1998-05-01
申请人： Joseph R. Scola , Vladimir N. Ruzhitsky , Lowell D. Jacobson
发明人： Joseph R. Scola , Vladimir N. Ruzhitsky , Lowell D. Jacobson
IPC分类号： G06K900
CPC分类号： G01N21/8851 , G06T7/0004 , Y10T117/1004
摘要： Provided is the ability to validate detected features in acquired images to thereby enhance the integrity of any analysis carried out on the detected and validated features. A sequence of images of, e.g., an object is acquired, each image in the sequence corresponding to a distinct orientation of the object about a selected object axis. Images in the sequence are inspected for feature points of the selected feature plane, as-projected into the images, at a first feature detection location and at a second feature detection location. The second feature detection location is configured at an image position at which a feature point detected in the first feature detection location in a first inspected image is expected to appear in a second inspected image. Valid object feature points are identified as being those feature points which are detected in both the first feature detection location in a first inspected image and in the second feature detection location in a second inspected image of the image sequence. Features that are validated are not likely to be time-dependent noise and are preserved for further feature analysis, while extraneous data is rendered transparent to feature analysis. Further, an object feature plane can be analyzed for a specified feature configuration even when only a subset of feature points is available in any one given image of the object, e.g., where a portion of a three-dimensional object obscures other portions of the object in a selected view of the object. Also provided is a method for detecting features of a semiconductor melt surface as a semiconductor ingot is pulled out of the melt.
摘要翻译：提供了在所获取的图像中验证检测到的特征的能力，从而增强对所检测和验证的特征进行的任何分析的完整性。获取例如对象的图像序列，序列中的每个图像对应于关于所选对象轴的对象的不同取向。在第一特征检测位置和第二特征检测位置，对所选特征平面中的投影到图像中的特征点的特征点进行序列中的图像的检查。第二特征检测位置被配置在预期在第一被检查图像中在第一特征检测位置中检测到的特征点出现在第二检查图像中的图像位置处。有效对象特征点被识别为在第一被检查图像中的第一特征检测位置和图像序列的第二检测图像中的第二特征检测位置中检测到的特征点。被验证的特征不太可能是时间依赖的噪声，并且被保留用于进一步的特征分析，而无关数据对特征分析变得透明。此外，即使当特征点的子集在对象的任何一个给定图像中可用时，也可以分析对象特征平面的特定特征结构，例如，三维对象的一部分遮盖对象的其他部分在对象的选定视图中。还提供了当半导体锭从熔体中拉出时用于检测半导体熔融表面的特征的方法。

2. 发明授权

US06175652B1 Machine vision system for analyzing features based on multiple object images 失效
标题翻译：基于多物体图像分析特征的机器视觉系统
公开(公告)号：US06175652B1
公开(公告)日：2001-01-16
申请号：US09002190
申请日：1997-12-31
申请人： Lowell D. Jacobson , Vladimir N. Ruzhitsky
发明人： Lowell D. Jacobson , Vladimir N. Ruzhitsky
IPC分类号： G06K946
CPC分类号： C30B15/26 , G01B11/24
摘要： Provided is the ability to produce an orthogonal-view representation of a selected feature plane of a three-dimensional object. A plurality of images of the object are acquired, each corresponding to a distinct orientation of the object about a selected object axis. In at least one acquired image, feature points are identified in the selected feature plane as-projected into that acquired image. Feature points are associated with an orthogonal-view representation of the selected feature plane, and feature points from at least one acquired image are correlated with physical orientations on the selected feature plane based on the object orientation corresponding to that acquired image. An orthogonal-view representation of the selected object feature plane can be analyzed for a specified feature configuration even when the acquired object images are perspective-view images. This can be accomplished even through only a subset of feature points may be available in any one given image of the object. Such may be the case, e.g., where portions of a complicated three-dimensional object obscure other portions of the object in a selected view of the object. Also provided is an ability to analyze an orthogonal-view representation of a circumferential object contour, e.g., a meniscus defined on a semiconductor melt surface from which a semiconductor crystal ingot is horizontally pulled to grow the crystal ingot. The invention enables monitoring of the crystal growth for faults occurring during the growth process.
摘要翻译：提供了产生三维物体的所选特征平面的正交视图表示的能力。获取对象的多个图像，每个图像对应于关于所选对象轴线的对象的不同取向。在至少一个获取的图像中，在被投影到所获取的图像中的所选特征平面中识别特征点。特征点与所选择的特征平面的正交视图表示相关联，并且来自至少一个获取的图像的特征点基于与所获取的图像相对应的对象取向与所选择的特征平面上的物理取向相关联。即使当所获取的对象图像是透视图图像时，也可以分析所选择的对象特征平面的正交视图表示特定的特征构造。即使只有特征点的一个子集可能在对象的任何一个给定图像中可用，也可以实现这一点。可能是这种情况，例如，复杂的三维物体的部分在物体的选定视图中遮蔽物体的其他部分。还提供了分析圆周对象轮廓（例如，限定在半导体熔体表面上的弯液面的正交视图表示的能力，半导体晶体晶锭从该水平方向被拉动以生长晶锭）。本发明能够监测在生长过程中发生的故障的晶体生长。

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