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1. 发明申请

US20060290007A1 Flip Chip Die Assembly Using Thin Flexible Substrates 失效
标题翻译：使用薄柔性基板的倒装芯片组装
公开(公告)号：US20060290007A1
公开(公告)日：2006-12-28
申请号：US11464779
申请日：2006-08-15
申请人： Anthony Primavera , Vijesh Unnikrishnan , David Smith
发明人： Anthony Primavera , Vijesh Unnikrishnan , David Smith
IPC分类号： H01L23/48
CPC分类号： H01L21/4846 , H01L23/4985 , H01L23/5387 , H01L2924/0002 , H01L2924/00
摘要： Apparatus and methods for flattening thin substrate surfaces by stretching thin flexible substrates to which ICs can be bonded. Various embodiments beneficially maintain the substrate flatness during the assembly process through singulation. According to one embodiment, the use of a window frame type component carrier allows processing of thin laminates and flex films through various manufacturing processes. The flexible substrate is bonded to a rigid carrier. The carrier is placed into a specialized fixture comprising a bottom plate and a top plate. The bottom plate with raised regions is created that allows the windowed region of the flex film to be pressed flat. After aligning the top plate, the bottom plate, and the middle structure, the plates are pressed together causing the raised regions to push the flex film substrate upward and around the carrier. By pressing the thin substrate upward, the substrate is stretched like a drum head over the raised sections of the bottom plate, thereby flattening the substrate. The die assembly site is held flat overtop of the raised portion of the carrier to provide a stable vase for placement of the die.
摘要翻译：通过拉伸IC可以结合的薄柔性基板来平坦化薄基板表面的装置和方法。各种实施方案通过单分割有利地在组装过程中保持基材的平整度。根据一个实施例，使用窗框型组件载体允许通过各种制造工艺处理薄层压板和柔性膜。柔性基底结合到刚性载体上。载体被放置在包括底板和顶板的专用夹具中。产生具有凸起区域的底板，其允许柔性膜的窗口区域被压平。在对准顶板，底板和中间结构之后，将板压在一起，使得凸起区域将柔性薄膜基板向上和围绕载体推动。通过向上按压薄基板，基板在底板的凸起部分上像鼓头一样被拉伸，从而使基板变平。模具组装位置被保持在载体的凸起部分的顶部上，以提供用于放置模具的稳定的花瓶。

2. 发明授权

US07226821B2 Flip chip die assembly using thin flexible substrates 失效
标题翻译：使用薄柔性基板的倒装芯片组件
公开(公告)号：US07226821B2
公开(公告)日：2007-06-05
申请号：US11166461
申请日：2005-06-24
申请人： Anthony A. Primavera , Vijesh Unnikrishnan , David J. Smith
发明人： Anthony A. Primavera , Vijesh Unnikrishnan , David J. Smith
IPC分类号： H01L21/00
CPC分类号： H01L21/4846 , H01L23/4985 , H01L23/5387 , H01L2924/0002 , H01L2924/00
摘要： Apparatus and methods for flattening thin substrate surfaces by stretching thin flexible substrates to which ICs can be bonded. Various embodiments beneficially maintain the substrate flatness during the assembly process through singulation. According to one embodiment, the use of a window frame type component carrier allows processing of thin laminates and flex films through various manufacturing processes. The flexible substrate is bonded to a rigid carrier. The carrier is placed into a specialized fixture comprising a bottom plate and a top plate. The bottom plate with raised regions is created that allows the windowed region of the flex film to be pressed flat. After aligning the top plate, the bottom plate, and the middle structure, the plates are pressed together causing the raised regions to push the flex film substrate upward and around the carrier. By pressing the thin substrate upward, the substrate is stretched like a drum head over the raised sections of the bottom plate, thereby flattening the substrate. The die assembly site is held flat overtop of the raised portion of the carrier to provide a stable vase for placement of the die.
摘要翻译：通过拉伸IC可以结合的薄柔性基板来平坦化薄基板表面的装置和方法。各种实施方案通过单分割有利地在组装过程中保持基材的平整度。根据一个实施例，使用窗框型组件载体允许通过各种制造工艺处理薄层压板和柔性膜。柔性基底结合到刚性载体上。载体被放置在包括底板和顶板的专用夹具中。产生具有凸起区域的底板，其允许柔性膜的窗口区域被压平。在对准顶板，底板和中间结构之后，将板压在一起，使得凸起区域将柔性薄膜基板向上和围绕载体推动。通过向上按压薄基板，基板在底板的凸起部分上像鼓头一样被拉伸，从而使基板变平。模具组装位置被保持在载体的凸起部分的顶部上，以提供用于放置模具的稳定的花瓶。

3. 发明申请

US20060292756A1 FLIP CHIP DIE ASSEMBLY USING THIN FLEXIBLE SUBSTRATES 失效
标题翻译：使用薄柔性基板的切片芯片组件
公开(公告)号：US20060292756A1
公开(公告)日：2006-12-28
申请号：US11166461
申请日：2005-06-24
申请人： Anthony Primavera , Vijesh Unnikrishnan , David Smith
发明人： Anthony Primavera , Vijesh Unnikrishnan , David Smith
IPC分类号： H01L21/00 , H01L21/84 , H01L23/02
CPC分类号： H01L21/4846 , H01L23/4985 , H01L23/5387 , H01L2924/0002 , H01L2924/00
摘要： Apparatus and methods for flattening thin substrate surfaces by stretching thin flexible substrates to which ICs can be bonded. Various embodiments beneficially maintain the substrate flatness during the assembly process through singulation. According to one embodiment, the use of a window frame type component carrier allows processing of thin laminates and flex films through various manufacturing processes. The flexible substrate is bonded to a rigid carrier. The carrier is placed into a specialized fixture comprising a bottom plate and a top plate. The bottom plate with raised regions is created that allows the windowed region of the flex film to be pressed flat. After aligning the top plate, the bottom plate, and the middle structure, the plates are pressed together causing the raised regions to push the flex film substrate upward and around the carrier. By pressing the thin substrate upward, the substrate is stretched like a drum head over the raised sections of the bottom plate, thereby flattening the substrate. The die assembly site is held flat overtop of the raised portion of the carrier to provide a stable vase for placement of the die.
摘要翻译：通过拉伸IC可以结合的薄柔性基板来平坦化薄基板表面的装置和方法。各种实施方案通过单分割有利地在组装过程中保持基材的平整度。根据一个实施例，使用窗框型组件载体允许通过各种制造工艺处理薄层压板和柔性膜。柔性基底结合到刚性载体上。载体被放置在包括底板和顶板的专用夹具中。产生具有凸起区域的底板，其允许柔性膜的窗口区域被压平。在对准顶板，底板和中间结构之后，将板压在一起，使得凸起区域将柔性薄膜基板向上和围绕载体推动。通过向上按压薄基板，基板在底板的凸起部分上像鼓头一样被拉伸，从而使基板变平。模具组装位置被保持在载体的凸起部分的顶部上，以提供用于放置模具的稳定的花瓶。

4. 发明授权

US07497911B2 Flip chip die assembly using thin flexible substrates 失效
标题翻译：使用薄柔性基板的倒装芯片组件
公开(公告)号：US07497911B2
公开(公告)日：2009-03-03
申请号：US11464779
申请日：2006-08-15
申请人： Anthony A. Primavera , Vijesh Unnikrishnan , David J. Smith
发明人： Anthony A. Primavera , Vijesh Unnikrishnan , David J. Smith
IPC分类号： C23C13/00
CPC分类号： H01L21/4846 , H01L23/4985 , H01L23/5387 , H01L2924/0002 , H01L2924/00
摘要： Apparatus and methods for flattening thin substrate surfaces by stretching thin flexible substrates to which ICs can be bonded. Various embodiments beneficially maintain the substrate flatness during the assembly process through singulation. According to one embodiment, the use of a window frame type component carrier allows processing of thin laminates and flex films through various manufacturing processes. The flexible substrate is bonded to a rigid carrier. The carrier is placed into a specialized fixture comprising a bottom plate and a top plate. The bottom plate with raised regions is created that allows the windowed region of the flex film to be pressed flat. After aligning the top plate, the bottom plate, and the middle structure, the plates are pressed together causing the raised regions to push the flex film substrate upward and around the carrier. By pressing the thin substrate upward, the substrate is stretched like a drum head over the raised sections of the bottom plate, thereby flattening the substrate. The die assembly site is held flat overtop of the raised portion of the carrier to provide a stable vase for placement of the die.
摘要翻译：通过拉伸IC可以结合的薄柔性基板来平坦化薄基板表面的装置和方法。各种实施方案通过单分割有利地在组装过程中保持基材的平整度。根据一个实施例，使用窗框型组件载体允许通过各种制造工艺处理薄层压板和柔性膜。柔性基底结合到刚性载体上。载体被放置在包括底板和顶板的专用夹具中。产生具有凸起区域的底板，其允许柔性膜的窗口区域被压平。在对准顶板，底板和中间结构之后，将板压在一起，使得凸起区域将柔性薄膜基板向上和围绕载体推动。通过向上按压薄基板，基板在底板的凸起部分上像鼓头一样被拉伸，从而使基板变平。模具组装位置被保持在载体的凸起部分的顶部上，以提供用于放置模具的稳定的花瓶。

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