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    • 8. 发明授权
    • Controlling thickness uniformity and interfaces in stacks
    • 控制堆叠中的厚度均匀性和接口
    • US08741389B2
    • 2014-06-03
    • US12486354
    • 2009-06-17
    • Victor Boris SapozhnikovTaras Grigorievich PokhilKonstantin Nikolaev
    • Victor Boris SapozhnikovTaras Grigorievich PokhilKonstantin Nikolaev
    • B05D5/00
    • G11B5/3196G11B5/3163H01L43/12
    • A method of creating a stack having multiple layers of material deposited onto a substrate. The method includes controlling atom mobility to provide a uniform thickness for the deposited layers and increasing or decreasing a deposition temperature to control the atom mobility and/or roughness for the deposited layers. In an illustrated embodiment, the deposition temperature is increased to increase the atom mobility and the deposition temperature is decreased to decrease the atom mobility to control roughness and provide a uniform layer thickness. In another embodiment, the deposition temperature is increased or decreased for different portions of a layer. As described, a first amount of a material is deposited at a first deposition temperature to provide an optimum surface interface with a prior layer and a second amount of the material is deposited at a second deposition temperature to provide a uniform layer thickness.
    • 一种产生具有沉积在基底上的多层材料的堆叠的方法。 该方法包括控制原子迁移率以为沉积层提供均匀的厚度,并且增加或减少沉积温度以控制沉积层的原子迁移率和/或粗糙度。 在所示实施例中,增加沉积温度以增加原子迁移率并降低沉积温度以降低原子迁移率以控制粗糙度并提供均匀的层厚度。 在另一个实施方案中,对于层的不同部分,沉积温度增加或降低。 如上所述,第一量的材料在第一沉积温度下沉积以提供与现有层的最佳表面界面,并且第二量的材料在第二沉积温度下沉积以提供均匀的层厚度。