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    • 4. 发明申请
    • Method and facility for the production of a layer-like part
    • 用于生产层状部件的方法和设备
    • US20070035062A1
    • 2007-02-15
    • US10572939
    • 2004-09-28
    • Christian HansenUrsus KrugerUwe Pyritz
    • Christian HansenUrsus KrugerUwe Pyritz
    • B29C41/34
    • C23C14/0005C23C14/562C25D1/04C25D1/20H01L39/2454
    • Disclosed is a method for producing an HTSC band on a substrate band, for example, a strong bond being created between the substrate band and the band as a result of the production process (e.g. PVD process or galvanic deposition). According to the invention, separation of the highly adhesive band from the substrate band is aided by the fact that the substrate band is made of a shape memory alloy, the shape memory of the band being activated in a separating device by heating and, possibly, cooling. Tension-related stress is generated in the joint on the boundary surface between the bands as a result of the substrate being deformed such that separation of the band from the substrate band is aided or even caused. Also disclosed is a production facility in which the substrate band is made of a shape memory alloy.
    • 公开了一种在衬底带上制造HTSC带的方法,例如,由于制造工艺(例如,PVD工艺或电镀沉积),在衬底带和带之间产生强键。 根据本发明,通过基片带由形状记忆合金制成,通过加热在分离装置中激活带的形状记忆,并且可能地, 冷却。 由于基板变形而导致带与基板带分离的结果,导致在带之间的边界面上的接头中产生张力相关的应力。 还公开了一种生产设备,其中衬底带由形状记忆合金制成。