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    • 3. 发明授权
    • Semiconductor integrated circuit, method of designing the same, and method of fabricating the same
    • 半导体集成电路及其设计方法及其制造方法
    • US09026975B2
    • 2015-05-05
    • US13800483
    • 2013-03-13
    • Tae-joong SongPil-un KoGyu-hong KimJong-hoon Jung
    • Tae-joong SongPil-un KoGyu-hong KimJong-hoon Jung
    • G06F17/50H01L27/092H01L27/02
    • G06F17/5072G06F17/50G06F17/5077G06F17/5081H01L27/0207H01L27/092H01L27/0924H01L29/6681
    • A semiconductor integrated circuit designing method capable of minimizing a parasitic capacitance generated by an overhead in conductive lines, especially a gate line, a semiconductor integrated circuit according to the designing method, and a fabricating method thereof are provided. A method of designing a semiconductor integrated circuit having a FinFET architecture, includes: performing a pre-simulation of the semiconductor integrated circuit to be designed; designing a layout of components of the semiconductor integrated circuit based on a result of the pre-simulation, the components comprising first and second device areas and a first conductive line extending across the first and second device areas; modifying a first cutting area, that is arranged between the first and second device areas and electrically cuts the first conductive line, according to at least one design rule to minimize an overhead of the first conductive line created by the first cutting area.
    • 提供了一种半导体集成电路设计方法及其制造方法,该方法能够最小化由导线,特别是栅极线,半导体集成电路中的开销产生的寄生电容及其制造方法。 一种设计具有FinFET架构的半导体集成电路的方法,包括:对要设计的半导体集成电路进行预仿真; 基于预仿真的结果设计半导体集成电路的部件的布局,所述部件包括第一和第二器件区域以及跨越第一和第二器件区域延伸的第一导电线; 根据至少一个设计规则修改布置在第一和第二设备区域之间并且电切割第一导电线的第一切割区域,以使由第一切割区域产生的第一导电线路的开销最小化。