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    • 3. 发明授权
    • Method of producing grain oriented silicon steel sheet having low iron
loss
    • 低铁损晶粒取向硅钢板的制造方法
    • US5342454A
    • 1994-08-30
    • US931682
    • 1992-08-18
    • Yasuyuki HayakawaUjihiro NishiikeBunjiro FukudaMasataka YamadaYoshiaki IidaFumihiko TakeuchiMichiro Komatsubara
    • Yasuyuki HayakawaUjihiro NishiikeBunjiro FukudaMasataka YamadaYoshiaki IidaFumihiko TakeuchiMichiro Komatsubara
    • C21D8/12C22C38/00C22C38/60H01F1/16H01F1/04
    • C21D8/1233C21D8/1227C21D8/1277
    • A method of producing a grain oriented silicon steel sheet is adapted to lower the iron loss. A silicon steel slab, containing about 2.0 to 4.0 weight % of Si and an inhibitor-forming amount of S, or Se, or both, is hot rolled. After the hot rolled steel sheet is annealed when necessary, the steel sheet is cold rolled into a cold rolled steel sheet having a final thickness by performing cold rolling either one time or a plurality of times with intermediate annealing therebetween, the cold rolled steel sheet then being subjected to decarburization, coating of the surface of the steel sheet with an annealing separation agent mainly comprising MgO, secondary recrystallization annealing, and purification annealing. In the cold rolling step, an oxide layer exists on the surface of the steel sheet. Specifically, in the cold rolling step, rolling oil is supplied only at the entrance of the rolling mill used, and an oxide layer having a thickness of about 0.05 to 5 .mu.m is generated. Or, an outer oxide layer of an oxide layer structure generated on the surface of the steel sheet after hot rolling or intermediate annealing, is removed, and an inner oxide layer of a thickness of about 0.05 to 5 .mu.m is maintained on the surface, the resultant steel sheet then being subjected to cold rolling.
    • 一种生产晶粒取向硅钢片的方法适用于降低铁损。 将含有约2.0〜4.0重量%的Si和抑制剂形成量的S或Se或两者的硅钢板热轧。 在必要时对热轧钢板进行退火后,通过进行一次或多次冷轧,中间退火,将钢板冷轧成具有最终厚度的冷轧钢板,然后将冷轧钢板 用主要包含MgO的退火分离剂,二次再结晶退火和纯化退火对钢板表面进行脱碳,涂覆。 在冷轧工序中,在钢板表面存在氧化层。 具体而言,在冷轧工序中,仅在所使用的轧机的入口处供给轧制油,生成厚度为0.05〜5μm左右的氧化物层。 或者,除去在热轧或中间退火之后在钢板表面产生的氧化物层结构的外部氧化物层,并且在表面上保持约0.05〜5μm的厚度的内部氧化物层, 然后将所得的钢板进行冷轧。
    • 4. 发明授权
    • Thermoelectric semiconductor material, thermoelectric semiconductor element using thermoelectric semiconductor material, thermoelectric module using thermoelectric semiconductor element and manufacturing method for same
    • 热电半导体材料,使用热电半导体材料的热电半导体元件,使用热电半导体元件的热电模块及其制造方法
    • US08692103B2
    • 2014-04-08
    • US13083666
    • 2011-04-11
    • Toshinori OtaHiroki YoshizawaKouiti FujitaIsao ImaiTsuyoshi ToshoUjihiro Nishiike
    • Toshinori OtaHiroki YoshizawaKouiti FujitaIsao ImaiTsuyoshi ToshoUjihiro Nishiike
    • H01L35/34
    • H01L35/34B22D11/0611H01L35/16
    • A metal mixture is prepared, in which an excess amount of Te is added to a (Bi—Sb)2Te3 based composition. After melting the metal mixture, the molten metal is solidified on a surface of a cooling roll of which the circumferential velocity is no higher than 5 m/sec, so as to have a thickness of no less than 30 μm. Thus, a plate shaped raw thermoelectric semiconductor materials 10 are manufactured, in which Te rich phases are microscopically dispersed in complex compound semiconductor phases, and extending directions of C face of most of crystal grains are uniformly oriented. The raw thermoelectric semiconductor materials 10 are layered in the direction of the plate thickness. And the layered body is solidified and formed to form a compact 12. After that, the compact 12 is plastically deformed in such a manner that a shear force is applied in a uniaxial direction that is approximately parallel to the main layering direction of the raw thermoelectric semiconductor materials 10. As a result, a thermoelectric semiconductor 17 having crystal orientation in which extending direction of C face and the direction of c-axis of the hexagonal structure are approximately aligned. As a result, the crystalline orientation is improved, and the thermoelectric Figure-of-Merit is increased.
    • 制备金属混合物,其中向(Bi-Sb)2Te3基组合物中加入过量的Te。 在熔融金属混合物之后,熔融金属在圆周速度不高于5m / sec的冷却辊的表面上固化,从而具有不小于30μm的厚度。 因此,制造了板状的原料热电半导体材料10,其中Te富相显微分散在复合化合物半导体相中,并且大部分晶粒的C面的延伸方向均匀取向。 原料热电半导体材料10在板厚方向上层叠。 并且层叠体被固化并形成以形成紧凑体12.此后,压块12塑性变形,使得剪切力沿大致平行于原料热电偶的主层叠方向的单轴方向施加 半导体材料10.结果,具有晶体取向的热电半导体17,其中C面的延伸方向和六边形结构的c轴的方向近似对准。 结果,晶体取向得到改善,并且热电式的品质提高。
    • 5. 发明申请
    • Thermoelectric semiconductor material, thermoelectric semiconductor element therefrom, thermoelectric module including thermoelectric semiconductor element and process for producing these
    • 热电半导体材料,其热电半导体元件,包括热电半导体元件的热电模块及其制造方法
    • US20060243314A1
    • 2006-11-02
    • US10555855
    • 2004-05-07
    • Toshinori OtaHiroki YoshizawaKouiti FujitaIsao ImaiTsuyoshi ToshoUjihiro Nishiike
    • Toshinori OtaHiroki YoshizawaKouiti FujitaIsao ImaiTsuyoshi ToshoUjihiro Nishiike
    • H01L35/00
    • H01L35/34B22D11/0611H01L35/16
    • A metal mixture is prepared, in which an excess amount of Te is added to a (Bi—Sb)2Te3 based composition. After melting the metal mixture, the molten metal is solidified on a surface of a cooling roll of which the circumferential velocity is no higher than 5 m/sec, so as to have a thickness of no less than 30 μm. Thus, a plate shaped raw thermoelectric semiconductor materials 10 are manufactured, in which Te rich phases are microscopically dispersed in complex compound semiconductor phases, and extending directions of C face of most of crystal grains are uniformly oriented. The raw thermoelectric semiconductor materials 10 are layered in the direction of the plate thickness. And the layered body is solidified and formed to form a compact 12. After that, the compact 12 is plastically deformed in such a manner that a shear force is applied in a uniaxial direction that is approximately parallel to the main layering direction of the raw thermoelectric semiconductor materials 10. As a result, a thermoelectric semiconductor 17 having crystal orientation in which extending direction of C face and the don of c-axis of the hexagonal structure are approximately aligned. As a result, the crystalline orientation is improved, and the thermoelectric Figure-of-Merit is increased.
    • 制备金属混合物,其中将过量的Te加入到基于(Bi-Sb)2 N 3基团的组合物中。 在熔融金属混合物之后,熔融金属在圆周速度不高于5m / sec的冷却辊的表面上固化,从而具有不小于30μm的厚度。 因此,制造了板状的原料热电半导体材料10,其中Te富相显微分散在复合化合物半导体相中,并且大部分晶粒的C面的延伸方向均匀取向。 原料热电半导体材料10在板厚方向上层叠。 并且层状体被固化并形成以形成紧凑的12。 之后,紧凑体12以这样的方式发生塑性变形,使得剪切力沿大致平行于原料热电半导体材料10的主层叠方向的单轴方向施加。 结果,具有晶面取向的热电半导体17,其中C面的延伸方向和六边形结构的c轴的大致对准。 结果,晶体取向得到改善,并且热电式的品质提高。
    • 9. 发明申请
    • THERMOELECTRIC SEMICONDUCTOR MATERIAL, THERMOELECTRIC SEMICONDUCTOR ELEMENT USING THERMOELECTRIC SEMICONDUCTOR MATERIAL, THERMOELECTRIC MODULE USING THERMOELECTRIC SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD FOR SAME
    • 热电半导体材料,使用热电半导体材料的热电半导体元件,使用热电半导体元件的热电模块及其制造方法
    • US20110180121A1
    • 2011-07-28
    • US13083666
    • 2011-04-11
    • Toshinori OtaHiroki YoshizawaKouiti FujitaIsao ImaiTsuyoshi ToshoUjihiro Nishiike
    • Toshinori OtaHiroki YoshizawaKouiti FujitaIsao ImaiTsuyoshi ToshoUjihiro Nishiike
    • H01L35/16
    • H01L35/34B22D11/0611H01L35/16
    • A metal mixture is prepared, in which an excess amount of Te is added to a (Bi—Sb)2Te3 based composition. After melting the metal mixture, the molten metal is solidified on a surface of a cooling roll of which the circumferential velocity is no higher than 5 m/sec, so as to have a thickness of no less than 30 μm. Thus, a plate shaped raw thermoelectric semiconductor materials 10 are manufactured, in which Te rich phases are microscopically dispersed in complex compound semiconductor phases, and extending directions of C face of most of crystal grains are uniformly oriented. The raw thermoelectric semiconductor materials 10 are layered in the direction of the plate thickness. And the layered body is solidified and formed to form a compact 12. After that, the compact 12 is plastically deformed in such a manner that a shear force is applied in a uniaxial direction that is approximately parallel to the main layering direction of the raw thermoelectric semiconductor materials 10. As a result, a thermoelectric semiconductor 17 having crystal orientation in which extending direction of C face and the direction of c-axis of the hexagonal structure are approximately aligned. As a result, the crystalline orientation is improved, and the thermoelectric Figure-of-Merit is increased.
    • 制备金属混合物,其中向(Bi-Sb)2Te3基组合物中加入过量的Te。 在熔融金属混合物之后,熔融金属在圆周速度不高于5m / sec的冷却辊的表面上固化,从而具有不小于30μm的厚度。 因此,制造了板状的原料热电半导体材料10,其中Te富相显微分散在复合化合物半导体相中,并且大部分晶粒的C面的延伸方向均匀取向。 原料热电半导体材料10在板厚方向上层叠。 并且层叠体被固化并形成以形成紧凑体12.之后,压块12塑性变形,使得剪切力沿大致平行于原料热电偶的主层叠方向的单轴方向施加 半导体材料10.结果,具有晶体取向的热电半导体17,其中C面的延伸方向和六边形结构的c轴的方向近似对准。 结果,晶体取向得到改善,并且热电式的品质提高。