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    • 1. 发明申请
    • Transfer-ESC based on a wafer
    • 转移ESC基于晶圆
    • US20070014073A1
    • 2007-01-18
    • US11455208
    • 2006-06-19
    • Udo Retzlaff
    • Udo Retzlaff
    • H01T23/00
    • H01L21/6833
    • A mobile transportable electrostatic chuck for clamping thin wafers (12) without permanent connection to an external power supply unit is described. The mobile chuck allows a safe handling of thin substrates on existing production equipment because the size and thickness of the clamped substrate on the mobile chuck is similar to a standard wafer. The chuck is made from silicon wafers itself as base material (11) using an IC manufacturing processes. Bipolar electrode-unit-cells (10), combined into clusters (4) and linked to an integrated fuse (5), generate a non-uniform electric field with additional force components. Peak-electrodes (1) are introduced with the highest field density in the peak region and thus creating a three dimensional non-uniform electric field with each surrounding electrode (3). Quadratic or hexagonal electrode-unit-cells (10) enable the highest dense of unit cells, which effectively clamp wafers (12) in close proximity to the surface (8a) of the chuck at elevated temperatures.
    • 描述了用于夹紧薄晶片(12)而不与外部电源单元永久连接的移动式可运输静电卡盘。 移动卡盘允许在现有的生产设备上安全地处理薄的基板,因为可移动卡盘上夹持的基板的尺寸和厚度类似于标准晶片。 卡盘由硅晶片本身作为基底材料(11),使用IC制造工艺。 组合成簇(4)并连接到集成熔丝(5)的双极电极单元电池(10)产生具有附加力分量的不均匀电场。 峰值电极(1)在峰值区域中以最高的场密度被引入,从而与每个周围电极(3)产生三维不均匀的电场。 二次或六边形电极单元电池(10)能够实现最高密度的单元电池,其在高温下有效地将晶片(12)夹紧在卡盘的表面(8a)附近。