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1. 发明授权

US5942041A Non-sticking semi-conductor wafer clamp and method of making same 失效
标题翻译：不粘半导体晶片夹及其制作方法
公开(公告)号：US5942041A
公开(公告)日：1999-08-24
申请号：US714217
申请日：1996-09-16
申请人： Yung-Tsun Lo , Tzu-Hsin Huang , Hua-Jen Tseng , Pei-Wei Tsai
发明人： Yung-Tsun Lo , Tzu-Hsin Huang , Hua-Jen Tseng , Pei-Wei Tsai
IPC分类号： C23C14/50 , C23C16/458 , H01L21/687 , C23C16/00
CPC分类号： H01L21/68721 , C23C14/50 , C23C16/4585 , H01L21/68757
摘要： A clamp used in clamping semi-conductor wafers during processing operations permits ready release of the wafer and avoids adherence of the clamp to materials deposited onto the wafer which otherwise tend to stick the wafer to the clamp. Adhesion of the deposited materials to the clamp is avoided by providing the clamping surfaces of the clamp with a minimum surface roughness achieved by machining, grinding, etching or other techniques.
摘要翻译：在处理操作期间用于夹紧半导体晶片的夹具允许晶片的准备释放，并避免夹具粘附到沉积到晶片上的材料，否则倾向于将晶片粘贴到夹具上。通过提供具有通过机械加工，研磨，蚀刻或其它技术实现的最小表面粗糙度的夹具的夹紧表面来避免将沉积的材料粘合到夹具上。

2. 发明授权

US08564954B2 Thermally enhanced electronic package 有权
标题翻译：热增强电子封装
公开(公告)号：US08564954B2
公开(公告)日：2013-10-22
申请号：US12948964
申请日：2010-11-18
申请人： Tzu Hsin Huang , Yu Ting Yang , Hung Hsin Liu , An Hong Liu , Geng Shin Shen , Wei David Wang , Shih Fu Lee
发明人： Tzu Hsin Huang , Yu Ting Yang , Hung Hsin Liu , An Hong Liu , Geng Shin Shen , Wei David Wang , Shih Fu Lee
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/205 , B82B1/005 , B82Y10/00 , B82Y30/00 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/525 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05569 , H01L2224/05572 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/29101 , H01L2224/2919 , H01L2224/29393 , H01L2224/32145 , H01L2224/32225 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/48471 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2224/92147 , H01L2224/92247 , H01L2225/0651 , H01L2225/06541 , H01L2225/06565 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K5/0213 , Y10S977/932 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/05647 , H01L2224/05124 , H01L2224/05147
摘要： A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.
摘要翻译：热增强型电子封装包括驱动器芯片，绝缘体，柔性载体和碳纳米胶囊。柔性载体包括柔性基板，形成在基板上的布线层和覆盖布线层的电阻。驱动器芯片连接到布线层。绝缘体填充在驱动器芯片和柔性载体之间的间隙中。碳纳米胶囊设置在驱动芯片上，电阻上，柔性载体上或绝缘体中，以增强电子封装的散热。

3. 发明申请

US20110315359A1 RADIATOR FAN MODULE 审中-公开
标题翻译：散热风扇模块
公开(公告)号：US20110315359A1
公开(公告)日：2011-12-29
申请号：US13117706
申请日：2011-05-27
申请人： Ming-Cyuan SHIH , Sin-Wei He , Jhong-Yan Chang , Tzu-Hsin Huang
发明人： Ming-Cyuan SHIH , Sin-Wei He , Jhong-Yan Chang , Tzu-Hsin Huang
IPC分类号： F28F13/00
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , F28D2021/0028 , F28F1/20 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A radiator fan module has a fan assembly, cooling fin and heat conductor. The fan assembly has a shell seat and fan blade, an air outlet is set at one side of the shell seat, the cooling fin is set correspondingly to the outlet, and the cooling end of the conductor is mated with the fin. The outlet forms an inward extended wall, an outward extended wall and an extended inner space set between the outlet and fan blade. The outlet has a width-reducing pattern. A notched space is formed externally between the inward extended wall and shell seat. An inward extended heat conductor is formed by the extension of the inner end of the cooling fin and is located within the range of the extended inner space, and provided with a blade corresponding side that is located correspondingly to a peripheral position of the blade.
摘要翻译：散热器风扇模块具有风扇组件，散热片和导热体。风扇组件具有壳座和风扇叶片，空气出口设置在壳座的一侧，冷却翅片对应于出口设置，导体的冷却端与翅片配合。出口形成向内延伸的壁，向外延伸的壁和设置在出口和风扇叶片之间的延伸的内部空间。出口具有宽度减小图案。在向内延伸的壁和壳座之间的外部形成有凹口的空间。内向延长的导热体由冷却翅片的内端延伸而形成，位于延伸的内部空间的范围内，并具有对应于叶片周边位置的叶片对应的侧面。

4. 发明申请

US20110304991A1 THERMALLY ENHANCED ELECTRONIC PACKAGE 有权
标题翻译：热增强型电子封装
公开(公告)号：US20110304991A1
公开(公告)日：2011-12-15
申请号：US12948964
申请日：2010-11-18
申请人： TZU HSIN HUANG , YU TING YANG , HUNG HSIN LIU , AN HONG LIU , GENG SHIN SHEN , DAVID WEI WANG , SHIH FU LEE
发明人： TZU HSIN HUANG , YU TING YANG , HUNG HSIN LIU , AN HONG LIU , GENG SHIN SHEN , DAVID WEI WANG , SHIH FU LEE
IPC分类号： H05K7/20 , H05K1/00 , B82Y30/00
CPC分类号： H05K7/205 , B82B1/005 , B82Y10/00 , B82Y30/00 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/525 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05569 , H01L2224/05572 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/29101 , H01L2224/2919 , H01L2224/29393 , H01L2224/32145 , H01L2224/32225 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/48471 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2224/92147 , H01L2224/92247 , H01L2225/0651 , H01L2225/06541 , H01L2225/06565 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K5/0213 , Y10S977/932 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/05647 , H01L2224/05124 , H01L2224/05147
摘要： A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.
摘要翻译：热增强型电子封装包括驱动器芯片，绝缘体，柔性载体和碳纳米胶囊。柔性载体包括柔性基板，形成在基板上的布线层和覆盖布线层的电阻。驱动器芯片连接到布线层。绝缘体填充在驱动器芯片和柔性载体之间的间隙中。碳纳米胶囊设置在驱动芯片上，电阻上，柔性载体上或绝缘体中，以增强电子封装的散热。

5. 发明授权

US5892232A Arc chamber for ion implanter 失效
标题翻译：离子注入机电弧室
公开(公告)号：US5892232A
公开(公告)日：1999-04-06
申请号：US735981
申请日：1996-10-25
申请人： Pei-Wei Tsai , Tzu-Hsin Huang , Hua-Jen Tseng , Min-Huei Lin
发明人： Pei-Wei Tsai , Tzu-Hsin Huang , Hua-Jen Tseng , Min-Huei Lin
IPC分类号： H01J27/08 , H01J27/00
CPC分类号： H01J27/08
摘要： An arc chamber including a reaction chamber, a filament element used to generate electrons, a first power supply means set for providing power to the filament element, a second power supply means utilized for creating a potential to increase the ionization efficiency, a plurality of gas injected openings set to inject suitable gas into the reaction chamber and be ionized in a gaseous plasma by impact from electrons, a first filament insulator, and three second filament insulators used for isolation. The first filament insulator includes a truncated corn portion and a ring portion. The truncated corn portion has a hole formed threrethrough itself. The ring portion is coaxially connected to the smaller surface of the truncated corn portion. The second filament insulator includes a truncated corn portion and two ring portions. Similarily, the truncated corn portion has a hole through formed therethrough. The ring portions are respectively coaxially connected to the two surfaces of the truncated corn portion. In the preferred embodiment, three first filament insulators and one second filament insulator are set on the filament element for isolation. The filament insulators are screwed into the filament element and exactly attached on the side wall of the reaction chamber.
摘要翻译：包括反应室，用于产生电子的灯丝元件的电弧室，用于向灯丝元件供电的第一电源装置，用于产生提高电离效率的电位的第二电源装置，多个气体注入的开口设置成将合适的气体注入反应室，并通过来自电子的冲击，第一细丝绝缘体和用于隔离的三个第二长丝绝缘体在气态等离子体中离子化。第一长丝绝缘体包括截顶玉米部分和环部分。截断的玉米部分具有自身形成的孔。环部分同轴连接到截顶玉米部分的较小表面。第二长丝绝缘体包括截顶玉米部分和两个环部分。类似地，截头玉米部分具有通过其形成的孔。环部分别同轴地连接到截顶玉米部分的两个表面。在优选实施例中，将三个第一灯丝绝缘体和一个第二灯丝绝缘体设置在灯丝元件上用于隔离。灯丝绝缘子拧入灯丝元件并精确地附着在反应室的侧壁上。

6. 发明授权

US06952053B2 Metal bond pad for integrated circuits allowing improved probing ability of small pads 失效
标题翻译：用于集成电路的金属焊盘允许改善小焊盘的探测能力
公开(公告)号：US06952053B2
公开(公告)日：2005-10-04
申请号：US10284350
申请日：2002-10-31
申请人： Tzu Hsin Huang , Liming Tsau , Vincent Chen
发明人： Tzu Hsin Huang , Liming Tsau , Vincent Chen
IPC分类号： H01L23/48 , H01L31/072
CPC分类号： H01L24/05 , H01L22/32 , H01L24/11 , H01L2224/0401 , H01L2224/05001 , H01L2224/05073 , H01L2224/05554 , H01L2224/05558 , H01L2224/05624 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/14 , H01L2924/00014
摘要： The present invention is a metal bond pad that provides electrical and mechanical connection to an integrated circuit (IC). The metal bond pad is configured to accommodate for probe travel during probing measurements, without modifying the size of the passivation opening of the bond pad. This enables higher density of active devices on the IC and therefore increases integration and lowers IC cost. The metal bond pad for the integrated circuit includes a substrate, a first metal layer, and a second metal layer. The substrate has the first metal layer disposed therein, having an opening from the top surface of the substrate. The second metal layer has a first-end portion, a second-end portion and a center portion disposed between the first-end portion and the second-end portion. The center portion of the second metal layer is aligned with the opening in the substrate and a bottom surface of the center portion is in contact with the top surface of the first metal layer. A top surface of the center portion has a recessed region that forms a first edge with said first-end portion and a second edge with said second-end portion. The first-end portion of the second metal layer is disposed on the top surface of the substrate and extends from the first edge of the recessed region. It has a length defined from the first edge of the opening. The second-end portion is also disposed on the top surface of the substrate and extends from the second edge of the recessed region. It has a length defined from the second edge of the recessed region, and it is longer than the length of the first-portion.
摘要翻译：本发明是提供与集成电路（IC）的电连接和机械连接的金属接合焊盘。金属接合焊盘被配置为在探测测量期间适应探头行程，而不改变接合焊盘的钝化开口的尺寸。这使得IC上的有源器件的密度更高，因此增加了集成度并降低了IC成本。用于集成电路的金属焊盘包括衬底，第一金属层和第二金属层。衬底具有设置在其中的第一金属层，具有从衬底的顶表面开口。第二金属层具有设置在第一端部和第二端部之间的第一端部，第二端部和中心部。第二金属层的中心部分与衬底中的开口对准，并且中心部分的底表面与第一金属层的顶表面接触。中心部分的顶表面具有与所述第一端部分形成第一边缘的凹陷区域和具有所述第二端部分的第二边缘。第二金属层的第一端部设置在基板的顶表面上并且从凹陷区域的第一边缘延伸。它具有从开口的第一边缘限定的长度。第二端部也设置在基板的顶表面上并且从凹陷区域的第二边缘延伸。它具有从凹陷区域的第二边缘限定的长度，并且其长度大于第一部分的长度。

7. 发明申请

US20090050305A1 HEAT PIPE STRUCTURE OF A HEAT RADIATOR 审中-公开
标题翻译：散热器的热管结构
公开(公告)号：US20090050305A1
公开(公告)日：2009-02-26
申请号：US11844946
申请日：2007-08-24
申请人： Sin-Wei He , Tzu-Hsin Huang , Yu-Chin Lin
发明人： Sin-Wei He , Tzu-Hsin Huang , Yu-Chin Lin
IPC分类号： F28F1/30
CPC分类号： F28D15/0233 , F28D15/0275 , H01L23/3672 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a heat pipe structure of a heat radiator, which includes two vertically protruded radiating portions and heat-absorbing portions at a bottom of the two radiating portions. The heat-absorbing portions are assembled onto the heat-conducting pedestal. Two turning portions are formed at the intersection of the heat-absorbing portions and two radiating portions. The heat-absorbing portion has a curved shape. The heat-absorbing portions of adjacent heat pipes are misaligned, such that the turning portion of the heat-absorbing portion of one heat pipe aligns with the recessed space of the other heat pipe. A minimum of heat pipe assembly space obtains a maximum heating area, thus greatly improving the heat-radiating effect and reducing the manufacturing cost with better applicability and economic efficiency.
摘要翻译：本发明提供一种散热器的热管结构，其包括在两个辐射部分的底部的两个垂直突出的辐射部分和吸热部分。吸热部分组装在导热基座上。两个转动部分形成在吸热部分和两个辐射部分的相交处。吸热部具有弯曲形状。相邻热管的吸热部不对准，使得一个热管的吸热部的转动部与另一个热管的凹部空间对准。最小热管组合空间可获得最大加热面积，从而大大提高散热效果，降低制造成本，具有更好的适用性和经济效益。

8. 发明申请

US20080308901A1 Integrated circuit having a thin passivation layer that facilitates laser programming, and applications thereof 审中-公开
标题翻译：具有促进激光编程的薄钝化层的集成电路及其应用
公开(公告)号：US20080308901A1
公开(公告)日：2008-12-18
申请号：US11808699
申请日：2007-06-12
申请人： Tzu-Hsin Huang , Ming Chung Chen
发明人： Tzu-Hsin Huang , Ming Chung Chen
IPC分类号： H01L29/00 , H01L21/44
CPC分类号： H01L23/5258 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit having a thin passivation layer that facilitates laser programming, and applications thereof. In an embodiment, the integrated circuit includes a metal layer that has at least one fuse. A passivation layer is deposited over the metal layer. The passivation layer has a thickness that is less than 4,500 angstroms in order to enable laser programming of the at least one fuse without having to etch the passivation layer in the area of the at least one fuse prior to laser programming. In embodiments, the passivation layer has a thickness that is in a range of about 2,000 angstroms to about 4,000 angstroms, and the metal layer includes copper metal conductors that are protected by a barrier metal such as, for example, titanium nitride (TiN) or silicon nitride (SiN).
摘要翻译：具有促进激光编程的薄钝化层的集成电路及其应用。在一个实施例中，集成电路包括具有至少一个熔丝的金属层。钝化层沉积在金属层上。钝化层具有小于4500埃的厚度，以便能够对激光编程之前的至少一个熔丝的区域中的钝化层进行蚀刻，从而能够对至少一个熔丝进行激光编程。在实施例中，钝化层具有在约2000埃至约4000埃范围内的厚度，并且金属层包括被诸如氮化钛（TiN）之类的阻挡金属保护的铜金属导体或氮化硅（SiN）。

9. 发明申请

US20110197950A1 PHOTOVOLTAIC MODULE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：光伏组件及其制造方法
公开(公告)号：US20110197950A1
公开(公告)日：2011-08-18
申请号：US13024650
申请日：2011-02-10
申请人： Ching Chieh Lin , Sin Wei Ho , Mei Hsiu Lin , Tzu Hsin Huang , Chun Hsien Chou , Yen Chen Chen
发明人： Ching Chieh Lin , Sin Wei Ho , Mei Hsiu Lin , Tzu Hsin Huang , Chun Hsien Chou , Yen Chen Chen
IPC分类号： H01L31/052 , H01L31/024
CPC分类号： H02S40/42
摘要： A photovoltaic module includes a solar module and a heat sink bonded with a solar unit in a vacuum heating pressing manner. The heat sink is used for dissipating thermal energy generated by the solar module. Through the structure, heat of the solar module can be dissipated more effectively, thereby increasing efficiency of photoelectric conversion. Besides, the structure of the photovoltaic module is simplified, a heat conduction interface material in the prior art is not required, and assembly can be performed in the vacuum heating pressing manner, thereby greatly simplifying the manufacturing procedure.
摘要翻译：光伏模块包括以真空加热压制方式与太阳能单元结合的太阳能模块和散热器。散热器用于消散太阳能模块产生的热能。通过这种结构，可以更有效地消散太阳能模块的热量，从而提高光电转换的效率。此外，光伏组件的结构简化，不需要现有技术中的导热界面材料，并且可以以真空加热加压方式进行组装，从而大大简化了制造程序。

10. 发明授权

US06406209B1 Upper lid alignment apparatus for hatchback reaction cabin 失效
标题翻译：用于掀背车厢的上盖对准装置
公开(公告)号：US06406209B1
公开(公告)日：2002-06-18
申请号：US09620566
申请日：2000-07-20
申请人： Chin-Kun Liu , Pang-Cheng Liu , Tzu-Hsin Huang , Bruse Lee
发明人： Chin-Kun Liu , Pang-Cheng Liu , Tzu-Hsin Huang , Bruse Lee
IPC分类号： F16B2100
CPC分类号： C23C14/56 , Y10T403/1616 , Y10T403/1624 , Y10T403/635
摘要： An upper lid alignment apparatus for hatchback reaction cabin includes at least three sets of mating members. Each mating member has a protruding active member located on a side wall of an upper lid and a receiving member located on a side wall of a table. The receiving member has a guide slope to guide the active member to slide and reset on an anchor spot on the receiving member. The upper lid hence may make closed contact with the table to form a sealed cabin for reaction process.
摘要翻译：用于掀背式反作用舱的上盖对准装置包括至少三组配合构件。每个配合构件具有位于上盖的侧壁上的突出的活动构件和位于桌子的侧壁上的容纳构件。接收构件具有引导斜面以引导活动构件在接收构件上的锚点上滑动和复位。因此，上盖可以与桌子紧密接触以形成用于反应过程的密封舱室。

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