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1. 发明授权

US07827851B2 Packaging structure of gas detector and method for making the same 有权
标题翻译：气体探测器的包装结构及其制作方法
公开(公告)号：US07827851B2
公开(公告)日：2010-11-09
申请号：US11598657
申请日：2006-11-14
申请人： Tzong-Sheng Lee
发明人： Tzong-Sheng Lee
IPC分类号： G01N27/00
CPC分类号： G01N33/0009 , H01L2224/48091 , H01L2924/00014
摘要： The present invention provides a packaging structure of a gas detector and the method for making the same. The packaging structure of the gas detector includes a printed circuit board, a detection device and a ventilation cover. The detection device is attached to the printed circuit board by adhesive, and metallic wires are formed on the printed circuit board by wire-bonding process. The ventilation cover is positioned at the printed circuit board to cover the detection device. Signal terminals of the detection device are electrically connected with the contact terminals of the printed circuit board so as to test and check signals of the detection device. In this regard, the present invention is used to test and package a plurality of detection devices using one printed circuit board and without metallic terminals so that cost of the gas detector is significantly reduced.
摘要翻译：本发明提供一种气体检测器的包装结构及其制造方法。气体检测器的包装结构包括印刷电路板，检测装置和通气罩。检测装置通过粘合剂附接到印刷电路板，并且通过引线接合工艺在印刷电路板上形成金属线。通风盖位于印刷电路板上以覆盖检测装置。检测装置的信号端子与印刷电路板的接触端子电连接，以便检测和检查检测装置的信号。在这方面，本发明用于使用一个印刷电路板并且没有金属端子来测试和封装多个检测装置，使得气体检测器的成本显着降低。

2. 发明申请

US20070063858A1 Multi-function wireless detecting device 审中-公开
标题翻译：多功能无线检测装置
公开(公告)号：US20070063858A1
公开(公告)日：2007-03-22
申请号：US11229589
申请日：2005-09-20
申请人： Tzong-Sheng Lee , Yen-Chun Wang , Jeng-Long Ou
发明人： Tzong-Sheng Lee , Yen-Chun Wang , Jeng-Long Ou
IPC分类号： G08B17/10
CPC分类号： G08B21/12
摘要： A multi-function wireless detecting device is described. The multi-function wireless detecting device includes a monitoring pen and a wireless detector module to be carried conveniently and controlled easily. The wireless detector module includes at least one environmental parameter detector, and the monitoring pen utilizes wireless technology to control the wireless detector module and displays the data measured by the wireless detector module. The environmental parameter detector preferably includes a temperature detector and a gas concentration detector disposed on both sides of a baseboard of the wireless detector module. The gas concentration detector further includes an alcohol concentration detector, a CO concentration detector, a CO2 concentration detector, a fuel gas concentration detector, or a combination thereof. The environmental parameter detector may further include a humidity detector.
摘要翻译：描述了一种多功能无线检测装置。多功能无线检测装置包括监视笔和无线检测器模块，便于携带和方便地携带。无线检测器模块包括至少一个环境参数检测器，监测笔利用无线技术来控制无线检测器模块并显示由无线检测器模块测量的数据。环境参数检测器优选地包括设置在无线检测器模块的基板两侧的温度检测器和气体浓度检测器。气体浓度检测器还包括醇浓度检测器，CO浓度检测器，CO 2浓度检测器，燃料气体浓度检测器或其组合。环境参数检测器还可以包括湿度检测器。

3. 发明申请

US20060277989A1 Multi-function detecting pen 有权
标题翻译：多功能检测笔
公开(公告)号：US20060277989A1
公开(公告)日：2006-12-14
申请号：US11149294
申请日：2005-06-10
申请人： Tzong-Sheng Lee , Jeng-Long Ou
发明人： Tzong-Sheng Lee , Jeng-Long Ou
IPC分类号： B60C23/02
CPC分类号： G01L17/00 , G01K1/045 , G01K13/00
摘要： A multi-function detecting pen is described. The multi-function detecting pen includes a head module, a detecting chips module, a power module, a lighting module, and a control module. The head module is disposed at a front portion of the pen and the detecting chips module is followed. The detecting chips module may include at least one pressure detecting chip for measuring a pressure, e.g. tire pressure, and/or a gas detecting chip for measuring a gas concentration, e.g. alcohol concentration. The detecting chips module may further include a temperature detecting chip for measuring a temperature, e.g. ambient temperature or tympanum temperature. The head module may further include a switchable or a replaceable adapter for coupling to the corresponding object and keeping the head module clean.
摘要翻译：描述多功能检测笔。多功能检测笔包括头模块，检测芯片模块，电源模块，照明模块和控制模块。头模块设置在笔的前部，并且跟随检测芯片模块。检测芯片模块可以包括至少一个用于测量压力的压力检测芯片。轮胎压力和/或用于测量气体浓度的气体检测芯片，例如，酒精浓度检测芯片模块还可以包括用于测量温度的温度检测芯片，例如，环境温度或鼓膜温度。头模块还可以包括可切换或可替换的适配器，用于联接到相应的对象并保持头模块清洁。

4. 发明申请

US20060094150A1 Method of enhancing connection strength for suspended membrane leads and substrate contacts 失效
标题翻译：提高悬浮膜引线和基片触点连接强度的方法
公开(公告)号：US20060094150A1
公开(公告)日：2006-05-04
申请号：US10980226
申请日：2004-11-04
申请人： Tzong-Sheng Lee , Jing-Hung Chiou , Jeng-Long Ou
发明人： Tzong-Sheng Lee , Jing-Hung Chiou , Jeng-Long Ou
IPC分类号： H01L21/00
CPC分类号： B81C1/00126 , B81B2201/0292 , B81B2203/0118 , B81B2203/0127 , B81B2203/0307 , G01J5/10 , G01K17/003 , G01K17/006 , H01L21/4846 , H01L23/4822 , H01L2924/0002 , H01L2924/00
摘要： A method to enhance the connection strength of suspended membrane leads and substrate contacts is described. A reading circuit chip is provided and a sacrificial layer is formed thereon. Subsequently, an electrical contact window is created in the sacrificial layer to expose a conductive layer of the reading circuit chip. A metal layer is filled into the contact window and a conductive membrane is formed thereon to couple electrically to the metal layer. Afterward, an infrared measuring membrane and an upper dielectric layer are formed thereon.
摘要翻译：描述了提高悬浮膜引线和基板触点的连接强度的方法。提供读取电路芯片，并在其上形成牺牲层。随后，在牺牲层中形成电接触窗口以暴露读取电路芯片的导电层。将金属层填充到接触窗中，并且在其上形成导电膜以将其电耦合到金属层。之后，在其上形成红外测量膜和上介电层。

5. 发明申请

US20120049066A1 INFRARED SENSOR AND MANUFACTURING METHOD THEREOF 失效
标题翻译：红外传感器及其制造方法
公开(公告)号：US20120049066A1
公开(公告)日：2012-03-01
申请号：US12958556
申请日：2010-12-02
申请人： Tzong-Sheng Lee
发明人： Tzong-Sheng Lee
IPC分类号： G01J5/06 , H01L21/50
CPC分类号： G01J5/045 , G01J5/10 , H01L31/0203 , H01L2224/48091 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A manufacturing method for an infrared sensor includes the following steps: providing a wafer having several chips and a substrate; forming four soldering portions, a thermistor, and an infrared sensing layer on the bottom surface of each chip, wherein the soldering portions are connected electrically to the thermistor and the infrared sensing layer; disposing a soldering material onto at least one bonding location for each soldering portion; backside-etching each chip of the wafer to form a sensing film and a surrounding wall around the sensing film; bonding the wafer and the substrate; heating the soldering materials to connect the substrate and each chip of the wafer; disposing an infrared filter on the surrounding wall of each chip; cutting the wafer and the substrate to form a plurality of individual infrared sensors. The instant disclosure further provides an associated infrared sensor.
摘要翻译：一种用于红外线传感器的制造方法包括以下步骤：提供具有多个芯片和基板的晶片; 在每个芯片的底表面上形成四个焊接部分，热敏电阻和红外感测层，其中焊接部分电连接到热敏电阻和红外感测层; 将焊接材料设置在每个焊接部分的至少一个焊接位置上; 背面蚀刻晶片的每个芯片以在感测膜周围形成感测膜和周围壁; 接合晶片和基板; 加热焊接材料以连接基板和晶片的每个芯片; 在每个芯片的周围设置红外滤光片; 切割晶片和基板以形成多个单独的红外传感器。本公开进一步提供了相关的红外传感器。

6. 发明授权

US07601959B2 Thin type vacuum chamber device 有权
标题翻译：薄型真空室装置
公开(公告)号：US07601959B2
公开(公告)日：2009-10-13
申请号：US12007906
申请日：2008-01-17
申请人： Mang Ou-Yang , Tzong-Sheng Lee , Ming-Hua Chang
发明人： Mang Ou-Yang , Tzong-Sheng Lee , Ming-Hua Chang
IPC分类号： G01J5/02
CPC分类号： G01N21/03
摘要： The present invention is to provide a thin type vacuum chamber device, wherein two hollow slabs are fastened by a claw fastener to form a thin type simple structure that can maintain a high vacuum state, and wherein the air inside the chamber is pumped out to attain a vacuum state with a high pressure suction activity. The thin-chamber design of the present invention can decrease the number of the components and reduce the cost. The special assembly design of the vacuum chamber of the present invention can effectively decrease the length of the transmission cable and thus can reduce signal attenuation and noise interference. The present invention has the advantage of convenient operation and is very suitable to a two-dimensional infrared sensor.
摘要翻译：本发明提供一种薄型真空室装置，其中两个空心板通过爪紧固件紧固以形成能够保持高真空状态的薄型简单结构，并且其中腔室内的空气被泵出以达到具有高吸力活性的真空状态。本发明的薄室设计可以减少部件的数量并降低成本。本发明的真空室的特殊组装设计可以有效地减小传输电缆的长度，从而可以减少信号衰减和噪声干扰。本发明具有操作方便，非常适用于二维红外传感器的优点。

7. 发明授权

US06715689B1 Intelligent air-condition system 有权
标题翻译：智能空调系统
公开(公告)号：US06715689B1
公开(公告)日：2004-04-06
申请号：US10410290
申请日：2003-04-10
申请人： Tzong-Sheng Lee , Kuo-Hua Tseng , Long-Der Chen , Jimmy Yu
发明人： Tzong-Sheng Lee , Kuo-Hua Tseng , Long-Der Chen , Jimmy Yu
IPC分类号： F24F700
CPC分类号： F24F11/30 , F24F11/79 , F24F2120/10 , F24F2120/12
摘要： An intelligent air-condition system that detects the signals of the temperature distribution among the environment by using the infrared radiation, especially detects the location of the human-body temperature signals. Hence, according to the detected signals, the gas(es) for air-conditions can be firstly transmitted into the location where the human-body temperature signals exist, or be firstly transmitted into where the local temperature is urgent to be adjusted. Besides, the transitions of the gas(es) can be paused or stopped while there is no human-body temperature.
摘要翻译：智能空调系统通过使用红外线检测环境中温度分布信号，特别是检测人体温度信号的位置。因此，根据检测到的信号，可以首先将用于空调的气体传输到存在人体温度信号的位置，或者首先传输到当地温度被迫调整的地方。此外，气体的转变可以在没有人体温度的情况下暂停或停止。

8. 发明授权

US08153976B2 Infrared sensor and manufacturing method thereof 失效
标题翻译：红外线传感器及其制造方法
公开(公告)号：US08153976B2
公开(公告)日：2012-04-10
申请号：US12958556
申请日：2010-12-02
申请人： Tzong-Sheng Lee
发明人： Tzong-Sheng Lee
IPC分类号： G01J5/00
CPC分类号： G01J5/045 , G01J5/10 , H01L31/0203 , H01L2224/48091 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A manufacturing method for an infrared sensor includes the following steps: providing a wafer having several chips and a substrate; forming four soldering portions, a thermistor, and an infrared sensing layer on the bottom surface of each chip, wherein the soldering portions are connected electrically to the thermistor and the infrared sensing layer; disposing a soldering material onto at least one bonding location for each soldering portion; backside-etching each chip of the wafer to form a sensing film and a surrounding wall around the sensing film; bonding the wafer and the substrate; heating the soldering materials to connect the substrate and each chip of the wafer; disposing an infrared filter on the surrounding wall of each chip; cutting the wafer and the substrate to form a plurality of individual infrared sensors. The instant disclosure further provides an associated infrared sensor.
摘要翻译：一种用于红外线传感器的制造方法包括以下步骤：提供具有多个芯片和基板的晶片; 在每个芯片的底表面上形成四个焊接部分，热敏电阻和红外感测层，其中焊接部分电连接到热敏电阻和红外感测层; 将焊接材料设置在每个焊接部分的至少一个焊接位置上; 背面蚀刻晶片的每个芯片以在感测膜周围形成感测膜和周围壁; 接合晶片和基板; 加热焊接材料以连接基板和晶片的每个芯片; 在每个芯片的周围设置红外滤光片; 切割晶片和基板以形成多个单独的红外传感器。本公开进一步提供了相关的红外传感器。

9. 发明申请

US20070144903A1 Packaging structure of gas detector and method for making the same 有权
标题翻译：气体探测器的包装结构及其制作方法
公开(公告)号：US20070144903A1
公开(公告)日：2007-06-28
申请号：US11598657
申请日：2006-11-14
申请人： Tzong-Sheng Lee
发明人： Tzong-Sheng Lee
IPC分类号： G01N27/26
CPC分类号： G01N33/0009 , H01L2224/48091 , H01L2924/00014
摘要： The present invention provides a packaging structure of a gas detector and the method for making the same. The packaging structure of the gas detector includes a printed circuit board, a detection device and a ventilation cover. The detection device is attached to the printed circuit board by adhesive, and metallic wires are formed on the printed circuit board by wire-bonding process. The ventilation cover is positioned at the printed circuit board to cover the detection device. Signal terminals of the detection device are electrically connected with the contact terminals of the printed circuit board so as to test and check signals of the detection device. In this regard, the present invention is used to test and package a plurality of detection devices using one printed circuit board and without metallic terminals so that cost of the gas detector is significantly reduced.
摘要翻译：本发明提供一种气体检测器的包装结构及其制造方法。气体检测器的包装结构包括印刷电路板，检测装置和通气罩。检测装置通过粘合剂附接到印刷电路板，并且通过引线接合工艺在印刷电路板上形成金属线。通风盖位于印刷电路板上以覆盖检测装置。检测装置的信号端子与印刷电路板的接触端子电连接，以便检测和检查检测装置的信号。在这方面，本发明用于使用一个印刷电路板并且没有金属端子来测试和封装多个检测装置，使得气体检测器的成本显着降低。

10. 发明申请

US20060261271A1 Dual-band reflective infrared thermal imaging system 失效
标题翻译：双频反射红外热成像系统
公开(公告)号：US20060261271A1
公开(公告)日：2006-11-23
申请号：US11260400
申请日：2005-10-28
申请人： Tzong-Sheng Lee
发明人： Tzong-Sheng Lee
IPC分类号： G01J5/00
CPC分类号： G01J5/04 , G01J5/08 , G01J5/0846 , G01J2005/0077
摘要： A dual-band reflective infrared thermal imaging system is described. The dual-band reflective infrared thermal imaging system includes a reflective infrared thermal imager and a refractive visible light video camera. The refractive visible light video camera is configured at the central axis of the reflective infrared thermal imager so that the refractive visible light video camera and the reflective infrared thermal imager can synchronously and coaxially capture the images. The reflective infrared thermal imager further includes a reflective optical module and an infrared imaging sensor. The infrared images are focused on the infrared imaging sensor by way of the reflective optical module.
摘要翻译：描述了双波段反射红外热成像系统。双波段反射式红外热成像系统包括反射式红外热成像仪和折射可见光摄像机。折射可见光摄像机配置在反射式红外线热成像仪的中心轴处，使得折射可见光摄像机和反射式红外线热像仪可同步并同轴捕获图像。反射式红外热像仪还包括反射光学模块和红外成像传感器。红外图像通过反射光学模块聚焦在红外成像传感器上。

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