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    • 1. 发明授权
    • High concentration silica slurry
    • 高浓度二氧化硅浆液
    • US07192461B2
    • 2007-03-20
    • US10718573
    • 2003-11-24
    • Toshio MoriiPaul Brandl
    • Toshio MoriiPaul Brandl
    • C09G1/02C09G1/04C09K3/14C09C1/68
    • C09G1/02C01B33/1417C09K3/1463
    • A high concentration silica slurry can be used for polishing of substrates, such as semiconductor materials. The slurry contains a silica powder dispersed in an solvent. The silica slurry has a silica concentration of more than 50% by weight and a viscosity of less than 1000 mPa·s, wherein the silica powder has a ratio DL/DT of less than 1.3, wherein DL is an average particle size of the silica powder measured by a laser diffraction particle size distribution method and DT is an average primary particle size of the silica powder measured by a TEM photography observation, and wherein the silica powder has an average primary particle size of from 0.08 μm to 0.8 μm.
    • 可以使用高浓度二氧化硅浆料来研磨半导体材料等基板。 浆料含有分散在溶剂中的二氧化硅粉末。 二氧化硅浆料的二氧化硅浓度大于50重量%,粘度小于1000mPa.s,其中二氧化硅粉末的DL / DT比小于1.3,其中DL是二氧化硅的平均粒度 通过激光衍射粒度分布法测定的粉末,DT是通过TEM摄影观察测定的二氧化硅粉末的平均一次粒径,其中,二氧化硅粉末的平均一次粒径为0.08〜0.8μm。