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    • 1. 发明授权
    • Adhesive compositions
    • 粘合剂组合物
    • US5176852A
    • 1993-01-05
    • US353598
    • 1989-05-18
    • Tomonobu KondoMasao Okamura
    • Tomonobu KondoMasao Okamura
    • C08L23/26C08K3/02C08K3/04C08K3/08C08L51/06C09J151/00C09J151/06H01B1/24H05K3/32
    • H01B1/24C09J151/06C08L51/06H05K3/321Y10T442/2426Y10T442/2738
    • An adhesive composition comprising:(a) about 30 to about 95 parts by weight of a grafted linear low density polyethylene;(b) about 5 to about 70 parts by weight of a grafted (i) copolymer of ethylene and an unsaturated ester or (ii) a non-polar polyethylene having a crystallinity of no greater than about 38 percent by weight based on the weight of the non-polar polyethylene and a density of no greater than about 0.915 gram per cubic centimeter,wherein components (a) and (b) have been grafted with an unsaturated organic compound selected from the group consisting of acids, acid anhydrides, acyl halides, amides, imides, and epoxy esters, and parts by weight are based on 100 parts by weight of components (a) and (b) combined; and(c) about 5 to about 50 percent by weight of an electrically conductive material in the form of particles or fibers, the percent by weight being based on the total weight of components (a) and (b).
    • 一种粘合剂组合物,其包含:(a)约30至约95重量份的接枝线性低密度聚乙烯; (b)约5至约70重量份的乙烯和不饱和酯的接枝(i)共聚物或(ii)结晶度不大于约38重量%的非极性聚乙烯,基于 非极性聚乙烯和不大于约0.915克/立方厘米的密度,其中组分(a)和(b)已经用不饱和有机化合物接枝,所述不饱和有机化合物选自酸,酸酐,酰基卤, 酰胺,酰亚胺和环氧酯,重量份为100重量份组分(a)和(b)组合; 和(c)约5至约50重量%的颗粒或纤维形式的导电材料,其重量百分数以组分(a)和(b)的总重量计。