专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08652942B2 Method for manufacturing electronic parts 有权
标题翻译：电子零件制造方法
公开(公告)号：US08652942B2
公开(公告)日：2014-02-18
申请号：US13825673
申请日：2011-09-14
申请人： Takeshi Saito , Tomomichi Takatsu
发明人： Takeshi Saito , Tomomichi Takatsu
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , C08G18/6229 , C08G18/8029 , C08L2312/06 , C09D4/06 , C09D133/04 , C09J175/04 , H01L21/67132 , H01L23/293 , H01L23/295 , H01L23/296 , H01L2924/0002 , H01L2924/00
摘要： A method for manufacturing electronic parts, which is characteristic in that it permits reduction of contamination to the semi-cured adhesive layer formed on semiconductor wafer and the cohesive sheet used therein is superior in adhesiveness for example to the lead frame, the method comprising a semi-cured adhesive layer-forming step of forming a semi-cured adhesive layer by coating a pasty adhesive entirely over the rear face of a wafer and curing the pasty adhesive partially by radiation-ray irradiation or heating into the sheet shape, a fixing step of fixing the semi-cured adhesive layer formed on a wafer and a ring frame by bonding them to the cohesive layer of a cohesive sheet, a dicing step of dicing the wafer together with the semi-cured adhesive layer with a dicing blade into semiconductor chips, and a pick-up step of picking up the chips carrying the semi-cured adhesive layer from the cohesive layer of the cohesive sheet after radiation-ray irradiation, wherein the photopolymerization initiator in the cohesive layer of the cohesive sheet has a particular property.
摘要翻译：一种电子部件的制造方法，其特征在于，能够减少对形成在半导体晶片上的半固化粘合剂层的污染物，并且其中使用的粘合片材例如与引线框架的粘合性优异，该方法包括半固化粘合剂层形成步骤，通过将糊状粘合剂整体地涂覆在晶片的背面上并将糊状粘合剂部分地通过辐射线照射或加热固化成片状形成半固化粘合剂层，固定步骤通过将形成在晶片和环形框架上的半固化粘合剂层通过粘合到粘合片材的内聚层来固定半固化粘合剂层，将切割刀片与半固化粘合剂层一起切割成半导体芯片的切割步骤，以及拾取步骤，在放射线照射之后从粘合片的内聚层拾取携带半固化粘合剂层的芯片，其中光聚合粘合片的内聚层中的接合引发剂具有特定的性质。

2. 发明申请

US20110065261A1 DICING METHOD 有权
标题翻译：定义方法
公开(公告)号：US20110065261A1
公开(公告)日：2011-03-17
申请号：US12992616
申请日：2009-03-03
申请人： Takeshi Saito , Tomomichi Takatsu
发明人： Takeshi Saito , Tomomichi Takatsu
IPC分类号： H01L21/302
CPC分类号： H01L21/67132 , C08G18/10 , C08G18/6229 , C08G18/672 , C08G18/673 , C08G18/73 , C08G18/792 , C09D183/10 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/27436 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01015 , H01L2924/01019 , H01L2924/01025 , H01L2924/0103 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , C08G18/61 , H01L2924/00
摘要： With the invented dicing method, by increasing the cohesive strength while decreasing the adhesive strength of an ultraviolet-curing adhesive in advance, mixing of the ultraviolet-curing adhesive layer of an adhesive sheet with a die attach film on a dicing line can be decreased and pickup failures can be reduced, when picking up chips having a die attach film after dicing. The dicing method for a semiconductor wafer with a die-attach film comprises a first gluing step in which a die attach film is affixed to an adhesive sheet having an ultraviolet-curing adhesive laminated on a base material film, a second gluing step in which a semiconductor wafer is affixed to the opposite side of the die attach film affixed to the adhesive sheet, an ultraviolet irradiation step in which the ultraviolet-curing adhesive is irradiated with ultraviolet light, and a dicing step in which the semiconductor wafer and the die attach film affixed to the adhesive sheet are diced.
摘要翻译：利用本发明的切割方法，通过提高粘合强度同时降低紫外线固化型粘合剂的粘合强度，可以减少粘合片的紫外线固化粘合剂层与切割线上的芯片附着膜的混合，当切割后拾取带有贴片的芯片时，可以降低拾取故障。具有芯片附着膜的半导体晶片的切割方法包括第一胶合步骤，其中将芯片附着膜固定到具有层压在基材膜上的紫外线固化粘合剂的粘合片，第二胶合步骤，其中将半导体晶片固定在固定在粘合片上的管芯附着膜的相对侧，紫外线照射工序，紫外线固化型粘合剂被紫外线照射，切割工序，其中半导体晶片和芯片附着膜固定在粘合片上是切块的。

3. 发明申请

US20120052772A1 ADHESIVE SHEET AND METHOD OF BACKGRINDING SEMICONDUCTOR WAFER 有权
标题翻译：粘合片和半导体波片的分离方法
公开(公告)号：US20120052772A1
公开(公告)日：2012-03-01
申请号：US13318436
申请日：2010-05-31
申请人： Masashi Kume , Tomomichi Takatsu
发明人： Masashi Kume , Tomomichi Takatsu
IPC分类号： B24B1/00 , C09J7/02
CPC分类号： C09J7/0246 , C08F2220/1825 , C08K5/0025 , C08K5/54 , C08L83/00 , C09J7/22 , C09J7/38 , C09J133/06 , C09J2203/326 , C09J2205/102 , C09J2423/04 , C09J2431/00 , C09J2433/00 , H01L21/6836 , H01L2221/68327 , Y10T428/287 , Y10T428/2891 , C08F220/14 , C08F2220/281 , C08F220/06
摘要： After an adhesive sheet is pasted on a semiconductor wafer, an adhesive of the sheet increases tight attachment to the semiconductor wafer because wetting spreads over time. Due to this, at the time of peeling the adhesive sheet from the ground semiconductor wafer, the semiconductor wafer used to be damaged. This phenomenon is likely to occur for a thinner semiconductor wafer. The present invention resides in an adhesive sheet including a substrate and an adhesive layer disposed on the substrate. The substrate is formed of an ethylene/vinyl acetate copolymer having a vinyl acetate content of 10% by mass or less. The adhesive layer contains 100 parts by mass of a (meth)acrylate ester copolymer, 1 to 10 parts by mass of a cross-linker, 0.05 to 5 parts by mass of a silicone compound. The (meth)acrylate ester copolymer is formed of a copolymer produced by polymerizing a (meth)acrylate ester monomer and a functional-group-containing monomer.
摘要翻译：在将粘合片粘贴在半导体晶片上之后，片材的粘合剂会增加与半导体晶片的紧密连接，因为随着时间的推移，湿度会扩大。因此，在从接地半导体晶片剥离粘合片时，半导体晶片被损坏。对于更薄的半导体晶片，这种现象很可能发生。本发明涉及一种粘合片，其包括基底和设置在基底上的粘合剂层。基材由乙酸乙烯酯含量为10质量％以下的乙烯/乙酸乙烯酯共聚物形成。粘合剂层含有（甲基）丙烯酸酯共聚物100质量份，交联剂1〜10质量份，硅酮化合物0.05〜5质量份。（甲基）丙烯酸酯共聚物由通过聚合（甲基）丙烯酸酯单体和含官能团的单体制备的共聚物形成。

4. 发明申请

US20100248452A1 ADHESIVE, ADHESIVE SHEET, MULTI-LAYERED ADHESIVE SHEET, AND PRODUCTION METHOD FOR ELECTRONIC PART 有权
标题翻译：胶粘剂，粘合片，多层粘合片，电子部件生产方法
公开(公告)号：US20100248452A1
公开(公告)日：2010-09-30
申请号：US12738083
申请日：2007-10-16
申请人： Takeshi Saito , Tomomichi Takatsu
发明人： Takeshi Saito , Tomomichi Takatsu
IPC分类号： H01L21/302 , C09J133/08 , C09J133/10 , B32B27/40
CPC分类号： C09J183/10 , C08F230/08 , C08F2220/281 , C08G18/672 , C08G77/20 , C08G2170/40 , C08L33/08 , C08L51/085 , C08L75/04 , C08L75/16 , C08L83/10 , C09J7/38 , C09J133/066 , C09J175/04 , C09J175/16 , C09J2203/326 , C09J2433/00 , C09J2451/00 , C09J2475/00 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01025 , H01L2924/01027 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01082 , H01L2924/01088 , H01L2924/0665 , H01L2924/07802 , H01L2924/10329 , H01L2924/14 , Y10T428/31551 , Y10T428/31663 , C08G18/48 , C08F2220/1808 , C08F2220/1858 , C08F220/18 , H01L2924/07025 , H01L2924/00
摘要： A multi-layered adhesive sheet 100, includes: a substrate film 106, an adhesive layer 103 formed by coating an adhesive having a specific composition onto this substrate film 106, and a die attachment film 105 laminated on the adhesive layer 103. The multi-layered adhesive sheet 100 employing an adhesive having this specific composition has superior retention of die chip 108 during the dicing of silicon wafer 101, allows the die attachment film 105 and adhesive layer 103 to be easily peeled apart during a pick-up operation of the die chip 108, and prevents poor adhesion during the bonding of die chip 108 to lead frame 111.
摘要翻译：多层粘合片100包括：基材膜106，通过将具有特定组成的粘合剂涂布在该基材膜106上形成的粘合剂层103和层压在粘合剂层103上的模具附着膜105。使用具有这种特定组成的粘合剂的分层粘合片100在硅晶片101的切割期间具有优异的晶片芯片108的保持性，允许模具附着膜105和粘合剂层103在模具的拾取操作期间容易地剥离芯片108，并且防止在芯片108与引线框架111的接合期间的粘附性差。

5. 发明申请

US20090042035A1 ADHESIVE SHEET AND PROCESS FOR PRODUCING ELECTRIC COMPONENTS USING THE SHEET 有权
标题翻译：粘合片和使用该片生产电子元件的方法
公开(公告)号：US20090042035A1
公开(公告)日：2009-02-12
申请号：US12095019
申请日：2006-11-29
申请人： Satoru Kawata , Tomomichi Takatsu
发明人： Satoru Kawata , Tomomichi Takatsu
IPC分类号： B32B27/00 , B32B9/00 , B32B27/36
CPC分类号： H01L21/6836 , C09J7/29 , C09J2201/162 , C09J2451/006 , H01L2221/68327 , Y10T428/28 , Y10T428/31504 , Y10T428/31511 , Y10T428/31663 , Y10T428/31786
摘要： An adhesive sheet and a method for producing electronic components using the sheet are provided.An adhesive sheet comprising a substrate layer; an antistatic layer formed on one surface of the substrate layer and containing an organic binder, an antistatic agent, an antifriction agent and a curing agent; and an adhesive layer formed on the other surface of the substrate layer; and a method for producing electronic components using the adhesive sheet.
摘要翻译：提供了一种粘合片和使用该片的电子部件的制造方法。一种粘合片，包括基底层; 形成在基材层的一个表面上并含有有机粘合剂，抗静电剂，抗摩擦剂和固化剂的抗静电层; 以及形成在所述基材层的另一个表面上的粘合剂层; 以及使用该粘合片制造电子部件的方法。

6. 发明申请

US20120231266A1 ADHESIVE SHEET AND ELECTRONIC COMPONENT 审中-公开
标题翻译：粘合片和电子元件
公开(公告)号：US20120231266A1
公开(公告)日：2012-09-13
申请号：US13510821
申请日：2010-11-16
申请人： Takeshi Saitoh , Tomomichi Takatsu
发明人： Takeshi Saitoh , Tomomichi Takatsu
IPC分类号： B32B27/40
CPC分类号： H01L24/27 , C08K3/08 , C08K2003/0806 , C08K2003/0812 , C08K2003/085 , C08K2003/385 , C08L83/04 , C09J7/20 , C09J133/02 , C09J2201/36 , C09J2203/326 , C09J2205/102 , C09J2433/00 , H01L21/6836 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/27436 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29355 , H01L2224/29386 , H01L2224/83191 , H01L2224/8385 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , Y10T428/26 , Y10T428/2848 , Y10T428/31609 , H01L2924/00 , H01L2924/00014 , H01L2924/0493 , H01L2924/05432 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： Provided are an adhesive sheet having a conductive die attach film that is superior in semiconductor chip-holding efficiency and pick-up efficiency and an electronic component prepared by using the adhesive sheet.An adhesive sheet, including a base film, an adhesive layer laminated on one face of the base film and a die attach film containing a conductive filler laminated on the adhesive layer, wherein the adhesive layer is shaped from a bonding composition containing a multifunctional isocyanate curing agent: 0.5 to 20 parts by mass with respect to a (meth)acrylic ester copolymer having a carboxyl group-containing monomer's copolymerization rate of less than 0.5%:100 parts by mass.
摘要翻译：提供一种粘合片，其具有在半导体芯片保持效率和拾取效率方面优异的导电性芯片附着膜以及通过使用粘合片制备的电子部件。一种粘合片，包括基膜，层压在基膜的一个面上的粘合剂层和层压在粘合剂层上的含有导电填料的管芯附着膜，其中粘合剂层由含有多官能异氰酸酯固化的粘合组合物成形相对于含有羧基的单体的共聚合率小于0.5％的（甲基）丙烯酸酯共聚物，为0.5质量份〜20质量份：100质量份。

7. 发明申请

US20110223743A1 ELECTRONIC COMPONENT MANUFACTURING METHOD 有权
标题翻译：电子元件制造方法
公开(公告)号：US20110223743A1
公开(公告)日：2011-09-15
申请号：US13130076
申请日：2009-11-11
申请人： Takeshi Saito , Tomomichi Takatsu
发明人： Takeshi Saito , Tomomichi Takatsu
IPC分类号： H01L21/78
CPC分类号： H01L21/78 , B32B7/12 , B32B25/12 , B32B25/14 , B32B27/08 , B32B27/16 , B32B27/18 , B32B27/281 , B32B27/283 , B32B27/30 , B32B27/308 , B32B27/32 , B32B27/36 , B32B27/38 , B32B27/40 , B32B2270/00 , B32B2274/00 , B32B2307/21 , B32B2457/14 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68318 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/83856 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01019 , H01L2924/01025 , H01L2924/0103 , H01L2924/01033 , H01L2924/01058 , H01L2924/01075 , H01L2924/01082 , H01L2924/0665 , H01L2924/00
摘要： The objective is to limit pickup defects when chips with a semi-cured adhesive layer are picked up following dicing by lowering the adhesive strength of an ultraviolet curable adhesive beforehand while improving the cohesive force. Provided is a dicing method for semiconductor wafers with a semi-cured adhesive layer that comprises a process to coat the back surface of semiconductor wafers with a paste-like adhesive and semi-cure the paste-like adhesive in a sheet form using heating or ultraviolet irradiation to form a semi-cured adhesive layer, a gluing process to glue an adhesive sheet, wherein an ultraviolet curable adhesive is laminated on a base film, onto the semi-cured adhesive layer, an ultraviolet irradiation process to apply ultraviolet irradiation to the ultraviolet curable adhesive, and a dicing process to dice the semi-cured adhesive layer glued to the adhesive sheet and the semiconductor wafers.
摘要翻译：目的是通过在改善内聚力的同时降低紫外线固化性粘合剂的粘合强度，在切割后拾取具有半固化粘合剂层的芯片，以限制拾取缺陷。本发明提供一种具有半固化粘合剂层的半导体晶片的切割方法，其包括用糊状粘合剂涂覆半导体晶片的背面并使用加热或紫外线将片状粘合剂半固化的方法照射以形成半固化粘合剂层，将粘合片胶合的胶合工艺，其中将紫外线固化性粘合剂层压在基膜上，到半固化粘合剂层上，对紫外线照射紫外线照射过程以及切割工艺来切割粘合到粘合片和半导体晶片的半固化粘合剂层。

8. 发明授权

US09422462B2 Adhesive sheet 有权
标题翻译：粘合片
公开(公告)号：US09422462B2
公开(公告)日：2016-08-23
申请号：US14128493
申请日：2012-05-28
申请人： Takeshi Saito , Tomomichi Takatsu
发明人： Takeshi Saito , Tomomichi Takatsu
IPC分类号： B32B27/08 , B32B27/22 , B32B27/30 , C09J7/02 , C09J133/06 , C09J133/08 , H01L21/683 , C08L33/08 , C08K5/00 , C08K5/11 , C08K5/12
CPC分类号： C09J7/0278 , B32B27/08 , B32B27/22 , B32B27/30 , C08K5/0016 , C08K5/11 , C08K5/12 , C08L33/08 , C08L2205/02 , C09J7/22 , C09J7/245 , C09J7/38 , C09J133/062 , C09J133/08 , C09J2201/622 , C09J2203/326 , C09J2205/106 , C09J2427/006 , C09J2433/00 , H01L21/6836 , H01L2221/68327 , Y10T428/2891
摘要： An adhesive sheet of the invention includes a substrate and an adhesive composition laminated thereon, the substrate including polyvinyl chloride and a polyester-based plasticizer, wherein the adhesive composition includes two different (meth)acrylate copolymer components (A) and (B) in a mass ratio ranging from 10:90 to 90:10, wherein a content of a cross-linking agent which reacts with functional groups of the component (A) and the component (B) is in a range of 0.5 to 20 mass parts with respect to 100 mass parts of a sum of the component (A) and the component (B), and wherein 10 to 95 mass % of the monomer unit composing the component (A) is 2-ethylhexyl acrylate, and 10 to 95 mass % of the monomer unit composing the component (B) is butyl acrylate.
摘要翻译：本发明的粘合片包括基材和层压在其上的粘合剂组合物，所述基材包括聚氯乙烯和聚酯类增塑剂，其中粘合剂组合物包含两种不同的（甲基）丙烯酸酯共聚物组分（A）和（B）质量比范围为10:90〜90:10，其中与成分（A）和成分（B）的官能团反应的交联剂的含量相对于0.5〜20质量份的范围为至100质量份组分（A）和组分（B）的总和，其中构成组分（A）的单体单元的10至95质量％为丙烯酸2-乙基己酯，和10至95质量％的构成组分（B）的单体单元是丙烯酸丁酯。

9. 发明授权

US09267059B2 Adhesive sheet and method of backgrinding semiconductor wafer 有权
标题翻译：粘合片和背面研磨半导体晶片的方法
公开(公告)号：US09267059B2
公开(公告)日：2016-02-23
申请号：US13318436
申请日：2010-05-31
申请人： Masashi Kume , Tomomichi Takatsu
发明人： Masashi Kume , Tomomichi Takatsu
IPC分类号： C09J7/00 , B24B37/04 , C09J7/02 , C09J133/06 , H01L21/683 , C08K5/54 , C08L83/00 , C08K5/00 , C08F220/18
CPC分类号： C09J7/0246 , C08F2220/1825 , C08K5/0025 , C08K5/54 , C08L83/00 , C09J7/22 , C09J7/38 , C09J133/06 , C09J2203/326 , C09J2205/102 , C09J2423/04 , C09J2431/00 , C09J2433/00 , H01L21/6836 , H01L2221/68327 , Y10T428/287 , Y10T428/2891 , C08F220/14 , C08F2220/281 , C08F220/06
摘要： After an adhesive sheet is pasted on a semiconductor wafer, an adhesive of the sheet increases tight attachment to the semiconductor wafer because wetting spreads over time. Due to this, at the time of peeling the adhesive sheet from the ground semiconductor wafer, the semiconductor wafer used to be damaged. This phenomenon is likely to occur for a thinner semiconductor wafer. The present invention resides in an adhesive sheet including a substrate and an adhesive layer disposed on the substrate. The substrate is formed of an ethylene/vinyl acetate copolymer having a vinyl acetate content of 10% by mass or less. The adhesive layer contains 100 parts by mass of a (meth)acrylate ester copolymer, 1 to 10 parts by mass of a cross-linker, 0.05 to 5 parts by mass of a silicone compound. The (meth)acrylate ester copolymer is formed of a copolymer produced by polymerizing a (meth)acrylate ester monomer and a functional-group-containing monomer.
摘要翻译：在将粘合片粘贴在半导体晶片上之后，片材的粘合剂会增加与半导体晶片的紧密连接，因为随着时间的推移，湿度会扩大。因此，在从接地半导体晶片剥离粘合片时，半导体晶片被损坏。对于更薄的半导体晶片，这种现象很可能发生。本发明涉及一种粘合片，其包括基底和设置在基底上的粘合剂层。基材由乙酸乙烯酯含量为10质量％以下的乙烯/乙酸乙烯酯共聚物形成。粘合剂层含有（甲基）丙烯酸酯共聚物100质量份，交联剂1〜10质量份，硅酮化合物0.05〜5质量份。（甲基）丙烯酸酯共聚物由（甲基）丙烯酸酯单体和含官能团的单体聚合而成的共聚物形成。

10. 发明申请

US20130183812A1 METHOD FOR MANUFACTURING ELECTRONIC PARTS 有权
标题翻译：制造电子零件的方法
公开(公告)号：US20130183812A1
公开(公告)日：2013-07-18
申请号：US13825673
申请日：2011-09-14
申请人： Takeshi Saito , Tomomichi Takatsu
发明人： Takeshi Saito , Tomomichi Takatsu
IPC分类号： H01L21/78
CPC分类号： H01L21/78 , C08G18/6229 , C08G18/8029 , C08L2312/06 , C09D4/06 , C09D133/04 , C09J175/04 , H01L21/67132 , H01L23/293 , H01L23/295 , H01L23/296 , H01L2924/0002 , H01L2924/00
摘要： A method for manufacturing electronic parts, which is characteristic in that it permits reduction of contamination to the semi-cured adhesive layer formed on semiconductor wafer and the cohesive sheet used therein is superior in adhesiveness for example to the lead frame, the method comprising a semi-cured adhesive layer-forming step of forming a semi-cured adhesive layer by coating a pasty adhesive entirely over the rear face of a wafer and curing the pasty adhesive partially by radiation-ray irradiation or heating into the sheet shape, a fixing step of fixing the semi-cured adhesive layer formed on a wafer and a ring frame by bonding them to the cohesive layer of a cohesive sheet, a dicing step of dicing the wafer together with the semi-cured adhesive layer with a dicing blade into semiconductor chips, and a pick-up step of picking up the chips carrying the semi-cured adhesive layer from the cohesive layer of the cohesive sheet after radiation-ray irradiation, wherein the photopolymerization initiator in the cohesive layer of the cohesive sheet has a particular property.
摘要翻译：一种电子部件的制造方法，其特征在于，能够减少对形成在半导体晶片上的半固化粘合剂层的污染物，并且其中使用的粘合片材例如与引线框架的粘合性优异，该方法包括半固化粘合剂层形成步骤，通过将糊状粘合剂整体地涂覆在晶片的背面上并将糊状粘合剂部分地通过辐射线照射或加热固化成片状形成半固化粘合剂层，固定步骤通过将形成在晶片和环形框架上的半固化粘合剂层通过粘合到粘合片材的内聚层来固定半固化粘合剂层，将切割刀片与半固化粘合剂层一起切割成半导体芯片的切割步骤，以及拾取步骤，在放射线照射之后从粘合片的内聚层拾取携带半固化粘合剂层的芯片，其中光聚合粘合片的内聚层中的接合引发剂具有特定的性质。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式