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1. 发明申请

US20080283387A1 METHODS AND APPARATUS FOR TRANSFERRING CONDUCTIVE PIECES DURING SEMICONDUCTOR DEVICE FABRICATION 审中-公开
标题翻译：用于在半导体器件制造期间传导导电片的方法和装置
公开(公告)号：US20080283387A1
公开(公告)日：2008-11-20
申请号：US12185772
申请日：2008-08-04
申请人： Michael R. Rice , Claes H. Bjorkman , Jun Zhao , Kenneth S. Collins , Thomas Miu
发明人： Michael R. Rice , Claes H. Bjorkman , Jun Zhao , Kenneth S. Collins , Thomas Miu
IPC分类号： C23C14/34
CPC分类号： H05K3/3478 , H01L21/4853 , H01L21/67144 , H01L21/6835 , H01L23/544 , H01L24/11 , H01L24/742 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01051 , H01L2924/01057 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1461 , H01L2924/19041 , H01L2924/30105 , H05K2201/10212 , H05K2203/0338 , H05K2203/041 , H01L2924/00 , H01L2224/05599
摘要： In a first aspect, a programmable transfer device is provided for transferring conductive pieces to electrode pads of a target substrate. The programmable transfer device includes (1) a transfer substrate; and (2) a plurality of individually addressable electrodes formed on the transfer substrate. Each electrode is adapted to selectively attract and hold a conductive piece during transfer of the conductive piece to an electrode pad of a target substrate. Numerous other aspects are provided.
摘要翻译：在第一方面，提供了一种用于将导电片传送到目标衬底的电极焊盘的可编程传送装置。可编程转移装置包括（1）转移基板; 和（2）形成在转印基板上的多个可单独寻址的电极。每个电极适于在将导电片传送到目标衬底的电极焊盘的过程中选择性地吸引和保持导电片。提供了许多其他方面。

2. 发明授权

US07407081B2 Methods and apparatus for transferring conductive pieces during semiconductor device fabrication 失效
标题翻译：用于在半导体器件制造期间传导导电片的方法和装置
公开(公告)号：US07407081B2
公开(公告)日：2008-08-05
申请号：US11095943
申请日：2005-03-31
申请人： Michael R. Rice , Claes H. Bjorkman , Jun Zhao , Kenneth S. Collins , Thomas Miu
发明人： Michael R. Rice , Claes H. Bjorkman , Jun Zhao , Kenneth S. Collins , Thomas Miu
IPC分类号： B23K1/00 , B23Q16/00
CPC分类号： H05K3/3478 , H01L21/4853 , H01L21/67144 , H01L21/6835 , H01L23/544 , H01L24/11 , H01L24/742 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01051 , H01L2924/01057 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1461 , H01L2924/19041 , H01L2924/30105 , H05K2201/10212 , H05K2203/0338 , H05K2203/041 , H01L2924/00 , H01L2224/05599
摘要： In a first aspect, a programmable transfer device is provided for transferring conductive pieces to electrode pads of a target substrate. The programmable transfer device includes (1) a transfer substrate; and (2) a plurality of individually addressable electrodes formed on the transfer substrate. Each electrode is adapted to selectively attract and hold a conductive piece during transfer of the conductive piece to an electrode pad of a target substrate. Numerous other aspects are provided.
摘要翻译：在第一方面，提供了一种用于将导电片传送到目标衬底的电极焊盘的可编程传送装置。可编程转移装置包括（1）转移基板; 和（2）形成在转印基板上的多个可单独寻址的电极。每个电极适于在将导电片传送到目标衬底的电极焊盘的过程中选择性地吸引和保持导电片。提供了许多其他方面。

3. 发明申请

US20050232728A1 Methods and apparatus for transferring conductive pieces during semiconductor device fabrication 失效
标题翻译：用于在半导体器件制造期间传导导电片的方法和装置
公开(公告)号：US20050232728A1
公开(公告)日：2005-10-20
申请号：US11095943
申请日：2005-03-31
申请人： Michael Rice , Claes Bjorkman , Jun Zhao , Kenneth Collins , Thomas Miu
发明人： Michael Rice , Claes Bjorkman , Jun Zhao , Kenneth Collins , Thomas Miu
IPC分类号： B23K3/06 , B65G1/00 , H01L21/00 , H01L21/48 , H01L21/60 , H01L21/68 , H05K3/34
CPC分类号： H05K3/3478 , H01L21/4853 , H01L21/67144 , H01L21/6835 , H01L23/544 , H01L24/11 , H01L24/742 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01051 , H01L2924/01057 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1461 , H01L2924/19041 , H01L2924/30105 , H05K2201/10212 , H05K2203/0338 , H05K2203/041 , H01L2924/00 , H01L2224/05599
摘要： In a first aspect, a programmable transfer device is provided for transferring conductive pieces to electrode pads of a target substrate. The programmable transfer device includes (1) a transfer substrate; and (2) a plurality of individually addressable electrodes formed on the transfer substrate. Each electrode is adapted to selectively attract and hold a conductive piece during transfer of the conductive piece to an electrode pad of a target substrate. Numerous other aspects are provided.
摘要翻译：在第一方面，提供了一种用于将导电片传送到目标衬底的电极焊盘的可编程传送装置。可编程转移装置包括（1）转移基板; 和（2）形成在转印基板上的多个可单独寻址的电极。每个电极适于在将导电片传送到目标衬底的电极焊盘的过程中选择性地吸引和保持导电片。提供了许多其他方面。

4. 发明授权

US5869401A Plasma-enhanced flash process 失效
标题翻译：等离子体增强闪光过程
公开(公告)号：US5869401A
公开(公告)日：1999-02-09
申请号：US780099
申请日：1996-12-20
申请人： Paul E. Brunemeier , Thomas Miu
发明人： Paul E. Brunemeier , Thomas Miu
IPC分类号： H01L21/00
CPC分类号： H01J37/32449 , H01J37/32862
摘要： A method in a plasma processing chamber, the chamber being employed for processing a substrate, for removing corrosive species from the plasma processing chamber after the substrate is processed. The method includes introducing a flash source gas comprising an oxidizing agent such as oxygen into the plasma processing chamber. The method further includes performing, a flash process, including striking a plasma in the plasma processing chamber with the flash source gas, thereby permitting oxygen species in the plasma to reduce a concentration of the corrosive species in the plasma processing chamber.
摘要翻译：等离子体处理室中的方法，该室用于处理基板，用于在处理基板之后从等离子体处理室中去除腐蚀物质。该方法包括将包含氧化剂如氧气的闪光源气体引入等离子体处理室。该方法还包括执行闪光处理，其包括用闪光源气体击打等离子体处理室中的等离子体，从而允许等离子体中的氧物质降低等离子体处理室中的腐蚀物质的浓度。

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