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1. 发明授权

US5848868A Wafer conveying apparatus 失效
标题翻译：晶圆输送设备
公开(公告)号：US5848868A
公开(公告)日：1998-12-15
申请号：US837892
申请日：1997-04-22
申请人： Yasunobu Suzuki , Hirofumi Moroe , Kazuhiro Imai , Tetsuya Kobaru
发明人： Yasunobu Suzuki , Hirofumi Moroe , Kazuhiro Imai , Tetsuya Kobaru
IPC分类号： B65G49/07 , H01L21/677 , H01L21/68 , B65G47/24
CPC分类号： H01L21/681 , H01L21/67778 , Y10S414/136 , Y10S414/137
摘要： An apparatus for conveying a wafer to wafer work suction-holding stage and then discharging a worked wafer from the wafer work suction-holding stage, including a loader side elevator device, a wafer position correcting stage, a wafer work suction-holding stage, a wafer carrying table and an unloader side elevator device which are successively disposed in this order; and the apparatus further including a conveyor which conveys a wafer inside a loader side magazine carried on the loader side elevator device to a point above the positional correction suction-holding stage, a stopper which positions the wafer conveyed by the conveyor to the wafer position correcting stage, and a feeding pawl moving device which operates after the wafer position correcting stage and wafer work suction-holding stage have been moved vertically so that the upper surface of the wafer position correcting stage is at substantially the same height as the upper surface of the stopper and so that the upper surface of the wafer work suction-holding stage is at the same height as the upper surfaces of the stopper and wafer carrying table.
摘要翻译：一种用于将晶片输送到晶片加工抽吸保持台，然后从晶片加工吸力保持台排出加工晶片的装置，包括装载机侧电梯装置，晶片位置校正台，晶片加工抽吸保持台，晶片承载台和卸载机侧电梯装置，其依次依次设置; 该装置还包括一个输送机，该输送机将装载机侧电梯装置上装载的装载机侧料仓内的晶片传送到位于位置修正抽吸保持台上方的一个位置，将由输送机输送的晶片定位到晶片位置校正并且在晶片位置校正级和晶片作业吸引保持台之后工作的进给爪移动装置已经垂直移动，使得晶片位置校正级的上表面处于与上述表面的上表面大致相同的高度使得晶片加工吸力保持台的上表面与止动器和晶片承载台的上表面处于相同的高度。

2. 发明授权

US5372292A Tape bonding apparatus 失效
标题翻译：胶带接合装置
公开(公告)号：US5372292A
公开(公告)日：1994-12-13
申请号：US31240
申请日：1993-03-12
申请人： Koji Sato , Tetsuya Kobaru
发明人： Koji Sato , Tetsuya Kobaru
IPC分类号： H01L21/60 , B23K20/02 , H01L21/603
CPC分类号： B23K20/02 , B23K2201/40
摘要： A tape bonding apparatus for bonding leads of a film carrier to bumps of a pellet including a linear cam that moves up and down a bonding stage which carries the pellet. A vertical movement adjustment assembly made up with an eccentric shaft, an adjustment lever and an adjusting screw adjusts the relative amount of vertical movement of the bonding stage with respect to the linear cam. A gap sensor detects the amount of the vertical movement of the bonding stage and shows the distance between the leads and the bumps in a numeric value. Thus, the distance or clearance between the leads and the bumps can be adjusted easily.
摘要翻译：一种胶带接合装置，用于将胶片载体的引线接合到包括在携带颗粒的接合台上上下移动的直线凸轮的颗粒的凸块。由偏心轴，调节杆和调节螺钉构成的垂直移动调节组件调节接合台相对于线性凸轮的垂直运动的相对量。间隙传感器检测接合台的垂直移动量，并以数值表示引线与凸块之间的距离。因此，可以容易地调整引线与凸块之间的距离或间隙。

3. 发明授权

US5951283A Substrate transporting device 失效
标题翻译：基板输送装置
公开(公告)号：US5951283A
公开(公告)日：1999-09-14
申请号：US116703
申请日：1998-07-16
申请人： Hiroshi Ushiki , Tetsuya Kobaru , Kazuo Sugiura
发明人： Hiroshi Ushiki , Tetsuya Kobaru , Kazuo Sugiura
IPC分类号： H01L21/60 , B65G25/08 , H01L21/50 , H01L21/677 , H05K13/02 , F27D3/12
CPC分类号： H01L21/67706 , H01L21/67721
摘要： A substrate transporting device used in the process of manufacturing, for instance, semiconductor chips including a substrate guide comprised of a substrate guide rail which guides one side of each substrate and a substrate supporting plate which supports another side of the substrate, feeding claws for feeding a substrate to, for instance, a bonding position, the feeding claws being provided on a feeding claw holder and extending in the direction perpendicular to the substrate supporting plate, a claw X-direction feeder which moves the feeding claw holder in a direction in which the substrate is conveyed along the substrate guide, and a claw Y-direction feeder which moves the feeding claw holder in a direction perpendicular to the direction in which the substrate is conveyed along the substrate guide; thus, the substrates are conveyed one pitch at a time by means of a rectangular motion of the feeding claws on a horizontal plane effected by the claw X-direction feeder and the claw Y-direction feeder.
摘要翻译：在制造例如包括引导每个基板的一侧的基板导轨以及支撑基板的另一侧的基板支撑板的基板引导件的半导体芯片的过程中使用的基板输送装置，用于进给的进给爪基板到例如接合位置，馈送爪设置在馈送爪保持器上并沿垂直于基板支撑板的方向延伸;爪X方向馈送器，其使馈送爪保持器沿其方向移动，沿着基板引导件输送基板，以及爪Y方向进给器，其沿着与基板被输送的方向垂直的方向沿着基板引导件移动进给爪保持器; 因此，通过由爪X方向进给器和爪Y方向进给器进行的水平平面上的馈送爪的矩形运动，一次一个地传送基板。

4. 发明授权

US5647740A Lead frame baking oven 失效
标题翻译：铅框烤箱
公开(公告)号：US5647740A
公开(公告)日：1997-07-15
申请号：US335045
申请日：1994-11-07
申请人： Tetsuya Kobaru
发明人： Tetsuya Kobaru
IPC分类号： H01L21/50 , F27D3/00 , H01L23/50 , F27B9/14 , F27B9/24
CPC分类号： F27D3/0084 , H01L2224/48091 , H01L2224/4826 , H01L2224/73215 , H01L2224/73265
摘要： A baking oven for heating lead frames used in the manufacturing of semiconductor devices including an oven main body having an entrance and an exit for lead frames, a heating device which creates a high-temperature atmosphere inside the oven main body, a lead frame magazine installed inside the oven main body so as to accommodate lead frames in a stacked fashion, a magazine mover which moves the lead frame magazine in a vertical direction, and a width adjustment device that changes the width of the lead frame magazine in a horizontal direction. The magazine mover and the width adjustment device are provided outside the oven main body for securing a high lead frame accommodation capacity and a longer heating time of the oven.
摘要翻译：一种用于加热用于制造半导体器件的引线框架的烘烤炉，包括：具有用于引线框架的入口和出口的炉主体;在炉主体内部产生高温气氛的加热装置，在炉主体内部，以堆叠方式容纳引线框架，使引线框架仓沿垂直方向移动的杂物动作机构，以及使水平方向改变引线框架仓的宽度的宽度调节装置。杂志移动器和宽度调节装置设置在烤箱主体的外部，用于确保高引线框架的容纳能力和烘箱的较长的加热时间。

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