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    • 1. 发明授权
    • Thin-film magnetic head
    • 薄膜磁头
    • US07948709B2
    • 2011-05-24
    • US11898324
    • 2007-09-11
    • Tetsuya HirakiHirotaka GomiKazuhiko Maejima
    • Tetsuya HirakiHirotaka GomiKazuhiko Maejima
    • G11B5/17G11B5/31
    • G11B5/3123
    • The thin-film magnetic head comprises a lower magnetic pole layer, an upper magnetic pole layer and a first thin-film coil. A resist film made of an organic insulating material is interposed between turns adjacent to each other in the lead constituting the first thin-film coil. The first thin-film coil has a minimum width part and a maximum width part. The minimum width part is arranged closer to an air bearing surface than is a second upper magnetic pole part, while the whole upper face of the minimum width part is covered with the resist film. The maximum width part is arranged on the side farther from the air bearing surface than is the second upper magnetic pole part, while the upper face of the maximum width part is formed with a resist-uncoated area free of the resist film.
    • 薄膜磁头包括下磁极层,上磁极层和第一薄膜线圈。 在构成第一薄膜线圈的引线中,由有机绝缘材料制成的抗蚀剂膜插入彼此相邻的匝之间。 第一薄膜线圈具有最小宽度部分和最大宽度部分。 最小宽度部分比第二上磁极部更靠近空气轴承表面布置,而最小宽度部分的整个上表面被抗蚀剂膜覆盖。 最大宽度部分布置在比第二上磁极部分更远离空气轴承表面的一侧,而最大宽度部分的上表面形成有没有抗蚀剂膜的抗蚀剂未涂覆区域。
    • 2. 发明授权
    • Method of measuring dimension of pattern and method of forming pattern
    • 测量图案尺寸的方法和形成图案的方法
    • US07858271B2
    • 2010-12-28
    • US12191735
    • 2008-08-14
    • Tetsuya HirakiNaoki OhtaYoshiaki Tanaka
    • Tetsuya HirakiNaoki OhtaYoshiaki Tanaka
    • G03F1/00G03F1/14G03F7/20G01N23/04
    • G01B15/00G01B21/02G03F1/44G03F1/84
    • A method of measuring dimension of a first pattern with a narrow first width, and a second pattern with a second width wider than the first width of the first pattern and formed in a symmetrical appearance with respect to a center of the second pattern, the second pattern having edges opposed to each other defining the second width, includes a step of forming a pair of first dummy patterns each having a narrow width, the pair of first dummy patterns being spaced from the edges of the second pattern respectively by a distance approximate to the first width of the first pattern, a first measurement step of measuring, using a dimension measuring device, a spaced distance of one of the first dummy patterns from the edge of the second pattern and a width of the one of the first dummy patterns within the same field of view of the dimension measuring device, a second measurement step of measuring, using the dimension measuring device, a width of the first pattern under the same measurement condition as that of the first measurement step, and a calculation step of calculating a width of the second pattern from WB=2DA+WD+DC, where WB is the calculated width of the second pattern, DC is a design value of a distance between the centers of the pair of first dummy patterns, DA is a measured spaced distance of the one of the first dummy patterns from the edge of the second pattern, and WD is a measured width of the one of the first dummy patterns.
    • 一种测量具有窄的第一宽度的第一图案的尺寸的方法和具有比第一图案的第一宽度宽的第二宽度的第二图案并且相对于第二图案的中心形成为对称外观的方法,第二图案 具有彼此相对的限定第二宽度的边缘的图案包括形成每一个具有窄宽度的一对第一伪图案的步骤,所述一对第一伪图案分别与第二图案的边缘分开距离近似于 所述第一图案的第一宽度,第一测量步骤,使用尺寸测量装置测量所述第一伪图案之一与所述第二图案的边缘之间的间隔距离以及所述第一图案中的所述第一虚设图案之一的宽度 尺寸测量装置的相同视野,第二测量步骤,使用尺寸测量装置测量在相同测量公司下的第一图案的宽度 并且计算从WB = 2DA + WD + DC计算第二图案的宽度的计算步骤,其中WB是第二图案的计算宽度,DC是第二图案之间的距离的设计值 一对第一虚拟图形的中心DA是第一伪图案中的一个与第二图案的边缘的测量的间隔距离,并且WD是第一伪图案之一的测量宽度。
    • 3. 发明申请
    • METHOD OF MEASURING DIMENSION OF PATTERN AND METHOD OF FORMING PATTERN
    • 测量图形尺寸的方法和形成图案的方法
    • US20100040957A1
    • 2010-02-18
    • US12191735
    • 2008-08-14
    • Tetsuya HIRAKINaoki OHTAYoshiaki TANAKA
    • Tetsuya HIRAKINaoki OHTAYoshiaki TANAKA
    • G03F1/00G03F7/20G01B21/02G01N23/00
    • G01B15/00G01B21/02G03F1/44G03F1/84
    • A method of measuring dimension of a first pattern with a narrow first width, and a second pattern with a second width wider than the first width of the first pattern and formed in a symmetrical appearance with respect to the pattern center, the second pattern having edges opposed to each other defining the second width, includes a step of forming a pair of first dummy patterns each having a narrow width, the pair of first dummy patterns being spaced from the edges of the second pattern respectively by a distance approximate to the first width of the first pattern, a first measurement step of measuring, using a dimension measuring device, a spaced distance of one of the first dummy patterns from the edge of the second pattern and a width of the one of the first dummy patterns within the same field of view of the dimension measuring device, a second measurement step of measuring, using the dimension measuring device, a width of the first pattern under the same measurement condition as that of the first measurement step, and a calculation step of calculating a width of the second pattern from WB=2DA+WD+DC, where WB is the calculated width of the second pattern, DC is a design value of a distance between the centers of the pair of first dummy patterns, DA is a measured spaced distance of the one of the first dummy patterns, and WD is a measured width of the one of the first dummy patterns.
    • 一种测量具有窄的第一宽度的第一图案的尺寸的方法和具有比第一图案的第一宽度宽的第二宽度并且相对于图案中心形成为对称外观的第二图案的第二图案,第二图案具有边缘 包括限定第二宽度的彼此相对的步骤包括形成各自具有窄宽度的一对第一虚拟图案的步骤,所述一对第一虚设图案分别与第二图案的边缘间隔开近似于第一宽度的距离 第一模式的测量步骤,第一测量步骤,使用尺寸测量装置测量第一伪图案中的一个与第二图案的边缘的间隔距离,以及在相同字段内的第一虚设图案中的一个的宽度 在第二测量步骤中,使用尺寸测量装置在与t相同的测量条件下测量第一图案的宽度 第一测量步骤的帽子和从WB = 2DA + WD + DC计算第二图案的宽度的计算步骤,其中WB是第二图案的计算宽度,DC是中心之间的距离的设计值 所述一对第一虚拟图案中的DA是所述第一伪图案中的一个的测量间隔距离,并且WD是所述第一虚拟图案之一的测量宽度。
    • 4. 发明申请
    • WAFER AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT
    • 电子元件的制造和制造方法
    • US20100237345A1
    • 2010-09-23
    • US12406445
    • 2009-03-18
    • Osamu NAKAZAWANozomu HACHISUKATetsuya HIRAKI
    • Osamu NAKAZAWANozomu HACHISUKATetsuya HIRAKI
    • H01L23/00H01L43/12
    • G11B5/00817G11B5/3993H01L43/12Y10T428/24355
    • The present invention relates to a wafer formed with an evaluation element and capable of improving productivity and a manufacturing method of an electronic component using the same. In a wafer according to the present invention, a plurality of elements connected to electrode films through lead-out conductive films are arranged and a chip area is defined for cutting out the plurality of elements in a given number. In the wafer, at least one evaluation element is formed in an area outside the chip area. The lead-out conductive films extend to the outside area and are connected to the evaluation elements. With this wafer, since the lead-out conductor is shared between the element and the evaluation element, the electrode film connected therewith can be shared, too. Accordingly, evaluation can be performed by using the evaluation element without the need of providing the wafer with a lead-out conductor and an electrode film exclusively for the evaluation element, so that the chip area to be cut out from the wafer can be made larger than before.
    • 本发明涉及一种形成有评估元件并且能够提高生产率的晶片以及使用其的电子部件的制造方法。 在根据本发明的晶片中,布置了通过引出导电膜连接到电极膜的多个元件,并且限定了用于切割给定数量的多个元件的芯片面积。 在晶片中,在芯片区域外的区域中形成至少一个评估元件。 引出导电膜延伸到外部区域并连接到评估元件。 对于该晶片,由于引出导体在元件和评估元件之间共享,所以与其连接的电极膜也可以共享。 因此,可以通过使用评估元件进行评价,而不需要为评估元件专门提供引出导体和电极膜,从而可以使从晶片切出的芯片面积更大 比以前。
    • 5. 发明申请
    • MULTI-CHANNEL THIN-FILM MAGNETIC HEAD AND MAGNETIC TAPE DRIVE APPARATUS WITH THE MULTI-CHANNEL THIN-FILM MAGNETIC HEAD
    • 多通道薄膜磁头和磁带驱动装置与多通道薄膜磁头
    • US20080218900A1
    • 2008-09-11
    • US11684193
    • 2007-03-09
    • Nozomu HachisukaTetsuya Hiraki
    • Nozomu HachisukaTetsuya Hiraki
    • G11B5/008G11B5/127G11B5/33
    • G11B5/4893G11B5/00826G11B5/4853
    • A multi-channel thin-film magnetic head has magnetic read head elements, magnetic write head elements, servo magnetic head elements, a plurality of pairs of external connection pads for reading connected with magnetic read head elements, a plurality of pairs of external connection pads for writing connected with magnetic write head elements, a plurality of pairs of external connection pads for servo connected with servo magnetic head elements, and a plurality of connection pads for body grounding or other functions. The connection pads for reading, writing, servo and body grounding or other functions are arranged in lines on a surface of the multi-channel thin-film magnetic head, and lead conductors which are electrically connected with connection pads for reading, writing, servo and body grounding or other functions are different each other in terms of widths, shapes, connection points or existence of a connector among at least two types of connection pads.
    • 多通道薄膜磁头具有磁读头元件,磁写头元件,伺服磁头元件,多对用于读取的外部连接焊盘,用于读取磁读头元件,多对外部连接焊盘 用于与磁性写入头元件连接的写入,用于伺服与伺服磁头元件连接的多对外部连接焊盘对,以及用于体接地或其它功能的多个连接焊盘。 用于读取,写入,伺服和身体接地或其他功能的连接焊盘在多通道薄膜磁头的表面上排成一行,以及与连接焊盘电连接的读取,写入,伺服和 身体接地或其他功能在至少两种类型的连接垫中的宽度,形状,连接点或连接器的存在方面彼此不同。
    • 6. 发明申请
    • Thin-film magnetic head
    • 薄膜磁头
    • US20080158735A1
    • 2008-07-03
    • US11898324
    • 2007-09-11
    • Tetsuya HirakiHirotaka GomiKazuhiko Maejima
    • Tetsuya HirakiHirotaka GomiKazuhiko Maejima
    • G11B5/33
    • G11B5/3123
    • A thin-film magnetic head which can keep performances from fluctuating, while restraining an organic insulating material from peeling off is provided.The thin-film magnetic head comprises a lower magnetic pole layer, an upper magnetic pole layer and a first thin-film coil. A resist film made of an organic insulating material is interposed between turns adjacent to each other in the lead constituting the first thin-film coil. The first thin-film coil has a minimum width part and a maximum width part. The minimum width part is arranged closer to an air bearing surface than is a second upper magnetic pole part, while the whole upper face of the minimum width part is covered with the resist film. The maximum width part is arranged on the side farther from the air bearing surface than is the second upper magnetic pole part, while the upper face of the maximum width part is formed with a resist-uncoated area free of the resist film.
    • 提供了一种能够在抑制有机绝缘材料剥离的同时保持性能不变的薄膜磁头。 薄膜磁头包括下磁极层,上磁极层和第一薄膜线圈。 在构成第一薄膜线圈的引线中,由有机绝缘材料制成的抗蚀剂膜插入彼此相邻的匝之间。 第一薄膜线圈具有最小宽度部分和最大宽度部分。 最小宽度部分比第二上磁极部更靠近空气轴承表面布置,而最小宽度部分的整个上表面被抗蚀剂膜覆盖。 最大宽度部分布置在比第二上磁极部分更远离空气轴承表面的一侧,而最大宽度部分的上表面形成有没有抗蚀剂膜的抗蚀剂未涂覆区域。
    • 7. 发明授权
    • Manufacturing method of thin-film magnetic head, wafer for thin-film magnetic head and thin-film magnetic head
    • 薄膜磁头制造方法,薄膜磁头和薄膜磁头用晶片
    • US08098462B2
    • 2012-01-17
    • US12361877
    • 2009-01-29
    • Tetsuya HirakiYoshiaki TanakaYuji OtsuboSohei Horiuchi
    • Tetsuya HirakiYoshiaki TanakaYuji OtsuboSohei Horiuchi
    • G11B5/33
    • G11B5/3166G11B5/1278G11B5/3173G11B5/3967Y10T29/49032
    • A manufacturing method of a thin-film magnetic head, includes a step of forming many thin-film magnetic heads arranged along row and column directions on a wafer, each of the thin-film magnetic heads having a read head element, a write head element, and pairs of probe-use pads electrically connected with the read head element and the write head element, respectively, the pairs of probe-use pads being positioned so that at least part of each probe-use pad is removed by a cutting process along the row direction, a step of obtaining a plurality of row-bars by cutting the wafer along the row direction so that the at least part of each probe-use pad is removed, each of the obtained row-bars having the thin-film magnetic heads aligned in the row direction, a step of forming pairs of bonding pads electrically connected with the read head element and the write head element, respectively, on a surface opposite to an ABS of each thin-film magnetic head of each of the row-bars, and a step of cutting each row-bar along the column direction to separate into individual thin-film magnetic heads.
    • 一种薄膜磁头的制造方法,其特征在于,具有:在晶片上形成沿列,列方向配置的许多薄膜磁头的步骤,每个薄膜磁头具有读头元件,写头元件 以及分别与读取头元件和写入头元件电连接的探针用垫对,这些探针使用垫被定位成使得每个探针使用垫的至少一部分通过沿着切割过程被移除 行方向,通过沿着行方向切割晶片以获得多个行条,使得每个探针用垫的至少一部分被去除,获得的每个行具有薄膜磁性的步骤 在行方向上排列的头部分别形成与读头元件和写头元件电连接在与行列方向上的每个薄膜磁头的ABS相对的表面上的一对接合焊盘的步骤, 酒吧,和一个切割的步骤 沿着列方向将每个行条分隔成各个薄膜磁头。
    • 8. 发明授权
    • Wafer and manufacturing method of electronic component
    • 电子元件的晶圆和制造方法
    • US08021712B2
    • 2011-09-20
    • US12406445
    • 2009-03-18
    • Osamu NakazawaNozomu HachisukaTetsuya Hiraki
    • Osamu NakazawaNozomu HachisukaTetsuya Hiraki
    • H05K3/02H05K3/30H01L21/301
    • G11B5/00817G11B5/3993H01L43/12Y10T428/24355
    • The present invention relates to a wafer formed with an evaluation element and capable of improving productivity and a manufacturing method of an electronic component using the same. In a wafer according to the present invention, a plurality of elements connected to electrode films through lead-out conductive films are arranged and a chip area is defined for cutting out the plurality of elements in a given number. In the wafer, at least one evaluation element is formed in an area outside the chip area. The lead-out conductive films extend to the outside area and are connected to the evaluation elements. With this wafer, since the lead-out conductor is shared between the element and the evaluation element, the electrode film connected therewith can be shared, too. Accordingly, evaluation can be performed by using the evaluation element without the need of providing the wafer with a lead-out conductor and an electrode film exclusively for the evaluation element, so that the chip area to be cut out from the wafer can be made larger than before.
    • 本发明涉及一种形成有评估元件并且能够提高生产率的晶片以及使用其的电子部件的制造方法。 在根据本发明的晶片中,布置了通过引出导电膜连接到电极膜的多个元件,并且限定了用于切割给定数量的多个元件的芯片面积。 在晶片中,在芯片区域外的区域中形成至少一个评估元件。 引出导电膜延伸到外部区域并连接到评估元件。 对于该晶片,由于引出导体在元件和评估元件之间共享,所以与其连接的电极膜也可以共享。 因此,可以通过使用评估元件进行评估,而不需要为评估元件专门提供引出导体和电极膜,从而可以使从晶片切出的芯片面积更大 比以前。
    • 9. 发明申请
    • MANUFACTURING METHOD OF THIN-FILM MAGNETIC HEAD, WAFER FOR THIN-FILM MAGNETIC HEAD AND THIN-FILM MAGNETIC HEAD
    • 薄膜磁头的制造方法,薄膜磁头和薄膜磁头的保护
    • US20100321822A1
    • 2010-12-23
    • US12361877
    • 2009-06-19
    • Tetsuya HirakiYoshiaki TanakaYuji OtsuboSohei Horiuchi
    • Tetsuya HirakiYoshiaki TanakaYuji OtsuboSohei Horiuchi
    • G11B5/127
    • G11B5/3166G11B5/1278G11B5/3173G11B5/3967Y10T29/49032
    • A manufacturing method of a thin-film magnetic head, includes a step of forming many thin-film magnetic heads arranged along row and column directions on a wafer, each of the thin-film magnetic heads having a read head element, a write head element, and pairs of probe-use pads electrically connected with the read head element and the write head element, respectively, the pairs of probe-use pads being positioned so that at least part of each probe-use pad is removed by a cutting process along the row direction, a step of obtaining a plurality of row-bars by cutting the wafer along the row direction so that the at least part of each probe-use pad is removed, each of the obtained row-bars having the thin-film magnetic heads aligned in the row direction, a step of forming pairs of bonding pads electrically connected with the read head element and the write head element, respectively, on a surface opposite to an ABS of each thin-film magnetic head of each of the row-bars, and a step of cutting each row-bar along the column direction to separate into individual thin-film magnetic heads.
    • 一种薄膜磁头的制造方法,其特征在于,具有:在晶片上形成沿列,列方向配置的许多薄膜磁头的步骤,每个薄膜磁头具有读头元件,写头元件 以及分别与读取头元件和写入头元件电连接的探针用垫对,这些探针使用垫被定位成使得每个探针使用垫的至少一部分通过沿着切割过程被移除 行方向,通过沿着行方向切割晶片以获得多个行条,使得每个探针用垫的至少一部分被去除,获得的每个行具有薄膜磁性的步骤 在行方向上排列的头部分别形成与读头元件和写头元件电连接在与行列方向上的每个薄膜磁头的ABS相对的表面上的一对接合焊盘的步骤, 酒吧,和一个切割的步骤 沿着列方向将每个行条分隔成各个薄膜磁头。
    • 10. 发明申请
    • MANUFACTURING METHOD OF THIN-FILM MAGNETIC HEAD WITH DISHING SUPPRESSED DURING POLISHING
    • 在抛光过程中抑制的薄膜薄膜磁头的制造方法
    • US20090086381A1
    • 2009-04-02
    • US11865405
    • 2007-10-01
    • Tetsuya HIRAKISeiji YARIYasufumi UNOHideaki SATOTakahide MASUDAKazuhiro KOBAYASHI
    • Tetsuya HIRAKISeiji YARIYasufumi UNOHideaki SATOTakahide MASUDAKazuhiro KOBAYASHI
    • G11B5/33
    • G11B5/3163G11B5/00826G11B5/3169G11B5/3173
    • A manufacturing method of a thin-film magnetic head with a dishing suppressed in the case of planarizing a magnetic shield which a read head portion has or a magnetic pole which a write head portion has is provided. A manufacturing method of a thin-film magnetic head comprising a read head portion for data reading which has at least two magnetic layers functioning as a magnetic shield and a write head portion for data writing which has two magnetic layers functioning as a magnetic pole is provided, in a process forming at least the lowest magnetic layer in at least the two magnetic layers functioning as the magnetic shield and the two magnetic layers functioning as the magnetic pole in the case of forming a plurality of thin-film magnetic head patterns on an element formation surface of the wafer substrate, which comprises steps of: forming this magnetic layer so as to reach a position which becomes a medium opposed surface at a middle portion to a trick width direction in each thin-film magnetic head pattern, and forming a dishing prevention portion at a position farther than this magnetic layer from the position which becomes the medium opposed surface in both sides or either side along the track width direction of this magnetic layer; forming a nonmagnetic insulating layer so as to cover the magnetic layer and the dishing prevention portion; and planarizing and polishing the magnetic layer, the dishing prevention portion, and the nonmagnetic insulating layer thereafter.
    • 在平面化磁头部分所具有的磁屏蔽或者写入磁头部分所具有的磁极的情况下,具有凹陷抑制的薄膜磁头的制造方法。 一种薄膜磁头的制造方法,其特征在于,具备读取磁头部分,该读取头部分具有用作磁屏蔽的至少两个磁性层和用作磁极的两个磁性层的用于数据写入的写入头部分 在至少形成作为磁屏蔽的两个磁性层中形成至少最低磁性层的工艺中,并且在元件上形成多个薄膜磁头图案的情况下用作磁极的两个磁性层 所述晶片基板的形成面包括以下步骤:在每个薄膜磁头图案中形成该磁性层以达到在中间部分与特技宽度方向成为介质相对表面的位置,并形成凹陷 防止部分位于远离该磁性层的位置,该位置从成为两侧或两侧的介质相对表面的位置 该磁性层的宽度方向; 形成非磁性绝缘层以覆盖磁性层和凹陷防止部分; 此后对磁性层,凹陷防止部分和非磁性绝缘层进行平面化和抛光。