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    • 2. 发明申请
    • Semiconductor strain gauge array
    • 半导体应变计阵列
    • US20120031192A1
    • 2012-02-09
    • US13136572
    • 2011-08-04
    • Terrisa DuenasShiv JoshiCesar Del Solar
    • Terrisa DuenasShiv JoshiCesar Del Solar
    • G01B7/16H01L21/02
    • G01B7/18G01L1/2293H01L29/84
    • A strain monitoring system including an array of semiconductor strain gauges. Each strain gauge in the array of strain gauges includes a lithographically fabricated 4-resistor bridge for providing a voltage potential corresponding to the strain in the bridge and thin film transistors to provide addressability to each 4-resistor bridge in the array. After completion of the array of strain gauges, in preferred embodiments the array of strain gauges are transferred to polyimide film which is in turn bonded to a surface region of the component to be tested for strains. Each bridge provides voltage signals corresponding to the strain to which the material under the bridge is being subjected. In preferred embodiments control and data acquisition function are separated from the semiconductor strain gage array. Preferred embodiments the system are utilized to monitor strains on components of aircraft, especially light weight robotic aircraft.
    • 一种应变监测系统,包括半导体应变计阵列。 应变片阵列中的每个应变计包括光刻制造的4电阻桥,用于提供对应于桥和薄膜晶体管中的应变的电压电位,以向阵列中的每个4-电阻器桥提供寻址能力。 在应变计阵列完成之后,在优选实施例中,将应变计的阵列转移到聚酰亚胺膜,该聚酰亚胺膜又结合到要测试的部件的表面区域上。 每个桥梁提供对应于桥梁下的材料所经受的应变的电压信号。 在优选实施例中,控制和数据获取功能与半导体应变计阵列分离。 优选的实施例是该系统用于监测飞行器部件上的应变,特别是轻型机器人飞机。
    • 3. 发明授权
    • Semiconductor strain gauge array
    • 半导体应变计阵列
    • US08707796B2
    • 2014-04-29
    • US13136572
    • 2011-08-04
    • Terrisa DuenasShiv JoshiCesar Del Solar
    • Terrisa DuenasShiv JoshiCesar Del Solar
    • G01L1/00G01B7/16G01L1/22H01L21/00
    • G01B7/18G01L1/2293H01L29/84
    • A strain monitoring system including an array of semiconductor strain gauges. Each strain gauge in the array of strain gauges includes a lithographically fabricated 4-resistor bridge for providing a voltage potential corresponding to the strain in the bridge and thin film transistors to provide addressability to each 4-resistor bridge in the array. After completion of the array of strain gauges, in preferred embodiments the array of strain gauges are transferred to polyimide film which is in turn bonded to a surface region of the component to be tested for strains. Each bridge provides voltage signals corresponding to the strain to which the material under the bridge is being subjected. In preferred embodiments control and data acquisition function are separated from the semiconductor strain gage array. Preferred embodiments the system are utilized to monitor strains on components of aircraft, especially light weight robotic aircraft.
    • 一种应变监测系统,包括半导体应变计阵列。 应变片阵列中的每个应变计包括光刻制造的4电阻桥,用于提供对应于桥和薄膜晶体管中的应变的电压电位,以向阵列中的每个4-电阻器桥提供寻址能力。 在应变计阵列完成之后,在优选实施例中,将应变计的阵列转移到聚酰亚胺膜,该聚酰亚胺膜又结合到要测试的部件的表面区域上。 每个桥梁提供对应于桥梁下的材料所经受的应变的电压信号。 在优选实施例中,控制和数据获取功能与半导体应变计阵列分离。 优选的实施例是该系统用于监测飞行器部件上的应变,特别是轻型机器人飞机。