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1. 发明申请

US20100193469A1 METHOD FOR MANUFACTURING MICRO/NANO THREE-DIMENSIONAL STRUCTURE 审中-公开
标题翻译：制造微米/纳米三维结构的方法
公开(公告)号：US20100193469A1
公开(公告)日：2010-08-05
申请号：US12699892
申请日：2010-02-04
申请人： Yung-Chun LEE , Chun-Hung CHEN , Te-Hui YU
发明人： Yung-Chun LEE , Chun-Hung CHEN , Te-Hui YU
IPC分类号： B44C1/22
CPC分类号： B44C1/22 , B81C1/0046
摘要： A method for manufacturing a micro/nano three-dimensional structure including the following steps is described. A mold is provided, and a pattern structure including a plurality of convex portions and concave portions is set in the mold. A transfer material layer including a first portion on the convex portions and a second portion on the concave portions is formed. A flexible substrate is disposed on the mold and contacts with the first portion of the transfer material layer. A heating step is performed to partially heat the flexible substrate through the first portion. A pressure is applied on the flexible substrate to adhere or press the first portion to the flexible substrate. The mold is removed. An etching step is performed on the flexible substrate by using the first portion of the transfer material layer as a mask to form a micro/nano three-dimensional structure in the flexible substrate.
摘要翻译：描述了包括以下步骤的微/纳米三维结构的制造方法。设置模具，并且在模具中设置包括多个凸部和凹部的图案结构。形成包括在凸部上的第一部分和凹部上的第二部分的转印材料层。柔性基板设置在模具上并与转印材料层的第一部分接触。执行加热步骤以通过第一部分部分地加热柔性基板。在柔性基板上施加压力以将第一部分粘附或压到柔性基板上。去除模具。通过使用转印材料层的第一部分作为掩模在柔性基板上进行蚀刻步骤，以在柔性基板中形成微/纳米三维结构。

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