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1. 发明授权

US5049221A Process for producing a copper-clad laminate 失效
标题翻译：生产覆铜层压板的方法
公开(公告)号：US5049221A
公开(公告)日：1991-09-17
申请号：US345906
申请日：1989-05-01
申请人： Tatsuo Wada , Keizo Yamashita , Tasuku Touyama , Teruaki Yamamoto
发明人： Tatsuo Wada , Keizo Yamashita , Tasuku Touyama , Teruaki Yamamoto
IPC分类号： B32B15/08 , B32B37/10 , B32B38/00 , B32B38/10 , B32B43/00 , H05K3/02 , H05K3/38
CPC分类号： B32B38/10 , H05K3/025 , B32B2457/08 , H05K2203/0152 , H05K2203/0307 , H05K2203/0361 , H05K2203/0723 , H05K2203/0726 , H05K3/382
摘要： A process for producing a copper-clad laminate, which comprises a step (S2) of forming a copper foil of at least several micrometers on a planar conductive substrate by electrolysis, a step (S3) of roughening the surface of the copper foil, a step (S4) of laminating the copper foil together with the conductive substrate on an insulating substrate and tightly integrating the assembly by applying pressure and heat, and a step (S5) of separating only the conductive substrate. A metal film may exist between the conductive substrate and the copper foil. When the metal film has a thickness of 0.1 to 3 .mu.m, only the conductive substrate is separated with the metal film being firmly adhered to the copper foil surface and, when the metal film has a thickness of 70 to 250 .mu.m, it is separated together with the conductive substrate after the lamination. The copper foil formed by high-speed plating under the conditions of 6 to 12.0 m/sec in solution contact speed and 0.8 to 4.0 A/cm.sup.2 in current density has about the same flexibility as that of rolled and annealed copper. Thus, ultrathin copper-clad laminates with a copper foil of 10 .mu.m or less suited for flexible circuit boards can be produced in a short time using small equipment.

2. 发明授权

US4323441A Apparatus for electroplating strip material without current leakage 失效
标题翻译：无电流泄漏电镀带材的设备
公开(公告)号：US4323441A
公开(公告)日：1982-04-06
申请号：US223208
申请日：1981-01-07
申请人： Glenn R. Schaer , Tasuku Touyama , Teruaki Yamamoto , Keisuke Honda , Tatsuo Wada
发明人： Glenn R. Schaer , Tasuku Touyama , Teruaki Yamamoto , Keisuke Honda , Tatsuo Wada
IPC分类号： C25D5/08 , C25D7/06 , H05K3/20 , H05K3/24 , C25D5/02
CPC分类号： C25D5/08 , C25D7/0614 , H05K3/20 , H05K3/241
摘要： Apparatus for the production of metal foil or printed circuit patterns on a continuously advancing strip of electrically conductive material includes a cathode under which the conductive strip is fed in sliding contact therewith. An insoluble anode is disposed under the cathode, with an interelectrode gap between the anode and the cathodic conductive strip traveling under the cathode. Lying next to one end of the anode is a solution inlet block defining a solution inlet from which the electroplating solution containing the metal to be deposited is fed turbulently into the interelectrode gap to cause the electrodeposition of the metal on the downward-facing surface of the conductive strip. A shield block of electrically insulating material is mounted over the solution inlet block for shielding the conductive strip traveling thereover from premature metal deposition due to leaking current and hence for avoiding the development of pinholes in the metal foil or circuit patterns.
摘要翻译：用于在连续前进的导电材料带上生产金属箔或印刷电路图案的装置包括阴极，导电条在该阴极上与其滑动接触地供给。在阴极下方设置不溶性阳极，阳极和阴极导电带之间的电极间间隙在阴极下方行进。在阳极的一端附近是一个溶液入口块，其限定了一个溶液入口，含有待沉积金属的电镀溶液将从该溶液入口湍流地进入电极间间隙，以使金属电沉积在导电条。电绝缘材料的屏蔽块安装在溶液入口块上，用于屏蔽由于泄漏电流而导致的过早金属沉积而导致的导电带，从而避免金属箔或电路图案中的针孔的发展。

3. 发明授权

US4790902A Method of producing conductor circuit boards 失效
标题翻译：制造导体电路板的方法
公开(公告)号：US4790902A
公开(公告)日：1988-12-13
申请号：US131050
申请日：1987-10-16
申请人： Tatsuo Wada , Keizo Yamashita , Tasuku Touyama , Teruaki Yamamoto
发明人： Tatsuo Wada , Keizo Yamashita , Tasuku Touyama , Teruaki Yamamoto
IPC分类号： H05K3/42 , C25D7/00 , H05K3/18 , H05K3/20 , B44C1/22 , C03C15/00 , C03C25/06 , C23F1/00
CPC分类号： H05K3/205 , H05K2201/09881 , H05K2203/0152 , H05K2203/0726 , Y10T29/49158
摘要： A thin metal layer with a thickness of 1 to 5 .mu. is formed electrolytically (S2) on an electrically conductive single-plate substrate having a predetermined roughness, a resist mask is formed (S3) on the surface of the thin metal layer, and a conductor circuit is then electroformed thereon (S4) using copper. After the surface of the conductor circuit is roughened (S5), the conductor circuit, along with the single plate and the interposed thin metal layer, is stacked on an insulating substrate for lamination, and the individual layers are adhered integrally to one another by the application of heat and pressure (S7). Then, the single plate only is peeled off (S8), and the exposed thin metal layer is removed by etching (S9). The thin metal layer and the conductor circuit are electroplated under high-speed conditions including a solution contact speed of 2.6 to 20 m/sec and a current density of 0.15 to 4.0 A/cm.sup.2, so that a required adhesion force can be obtained between the thin metal layer and the resist mask, and the conductor circuit can be made as flexible as rolled annealed copper. Thus, very thin, high-density conductor circuits can be produced which, having a thickness of 10 .mu.m or less, are adapted not only for rigid printed wiring boards but also for flexible printed wiring boards.

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