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1. 发明授权

US09070494B2 Fixation structure of superconducting cable and fixation structure of superconducting cable line 有权
标题翻译：超导电缆固定结构及超导电缆线固定结构
公开(公告)号：US09070494B2
公开(公告)日：2015-06-30
申请号：US13816883
申请日：2012-03-16
申请人： Jun Teng , Masashi Yagi , Taro Matsuoka , Shinichi Mukoyama , Shuka Yonemura
发明人： Jun Teng , Masashi Yagi , Taro Matsuoka , Tokui Yonemura , Shinichi Mukoyama
IPC分类号： H01R4/68 , H01B12/02 , H02G15/34 , H01B12/16
CPC分类号： H01B12/02 , H01B12/16 , H02G15/34 , Y02E40/647 , Y02E40/648
摘要： A fixation structure for fixing a superconducting cable including a cable core and a thermal insulation tube. The fixation structure includes a fixation box connected to the thermal insulation tube, including a hollow thermal insulation structure, and through which the cable core is passed, a fixation body for fixing the cable core on the inner wall of the fixation box, and a diameter-expanded reinforcement layer that is an electrical insulation layer that has a diameter decreasing toward both ends and is formed on the cable core. A refrigerant flows through the inside of the inner wall of the fixation box. The cable core is fixed on the inner wall with the fixation body through the diameter-expanded reinforcement layer. The structure implements a simple and low-cost fixation structure appropriate for an electric field design.
摘要翻译：一种用于固定包括电缆芯和绝热管的超导电缆的固定结构。固定结构包括连接到绝热管的固定盒，包括中空保温结构，电缆芯通过该固定盒，用于将电缆芯固定在固定盒的内壁上的固定体，膨胀加强层，其是直径朝向两端减小并形成在电缆芯上的电绝缘层。制冷剂流过固定盒内壁的内部。电缆芯通过直径扩展加强层固定在内壁上，固定体固定在内壁上。该结构实现了适用于电场设计的简单且低成本的固定结构。

2. 发明授权

US6135344A Reflow soldering method and a reflow soldering furnace 失效
标题翻译：回流焊接方法和回流焊炉
公开(公告)号：US6135344A
公开(公告)日：2000-10-24
申请号：US123869
申请日：1998-07-28
申请人： Seiki Sakuyama , Taro Matsuoka
发明人： Seiki Sakuyama , Taro Matsuoka
IPC分类号： B23K1/008 , B23K1/012 , F27B9/06 , F27B9/10 , F27B9/24 , F27D7/04 , H05K3/34 , B23K31/02 , B23K1/00 , B23K5/00 , D06E75/24 , F27B14/00
CPC分类号： F27B9/243 , B23K1/012 , F27B9/10 , B23K2201/40 , F27B9/066 , F27D7/04 , H05K3/3494
摘要： A reflow soldering furnace in which a printed board and a plurality of electronic parts mounted thereon are subjected to reflow soldering. The furnace comprises a reflow soldering furnace body including a plurality of heating zones defined by furnace walls, a hot-gas applier, and a radiant-heat applier. The hot-gas applier includes a heat source and a fan for blowing a hot gas of a temperature lower than a target temperature for each zone against a printed board. The radiant-heat applier includes a heater for applying radiant heat of a temperature higher than the target temperature to the printed board. The printed board and electronic parts thereon are heated to the target temperature, the melting point of solder, by means of the radiant heat from the heater. Among these electronic parts, small-sized ones with a relatively small heat capacity are restrained from overheating by the low-temperature hot gas from the hot-gas applier.
摘要翻译：将印刷基板和安装在其上的多个电子部件进行回流焊接的回流焊炉。该炉包括回流焊炉体，其包括由炉壁限定的多个加热区，热气施加器和辐射加热器。热气体施加器包括热源和用于将每个区域的温度低于目标温度的热气体相对于印刷板吹送的风扇。辐射加热器包括用于将高于目标温度的温度的辐射热施加到印刷板的加热器。借助于来自加热器的辐射热将印刷电路板和其上的电子部件加热到目标温度，焊料的熔点。在这些电子部件中，通过来自热气体加热器的低温热气，能够抑制热容量相对较小的小型化部件的过热。

3. 发明授权

US08946125B2 Connection structure for superconductive cables, method for laying the same, and method for vacuuming connection structure for superconductive cables 有权
标题翻译：超导电缆的连接结构，铺设方法以及超导电缆连接结构的真空吸尘方法
公开(公告)号：US08946125B2
公开(公告)日：2015-02-03
申请号：US13816621
申请日：2012-01-26
申请人： Masashi Yagi , Takaharu Mitsuhashi , Tomoya Nomura , Taro Matsuoka
发明人： Masashi Yagi , Takaharu Mitsuhashi , Tomoya Nomura , Taro Matsuoka
IPC分类号： H01L39/24 , H01B12/14 , H01R4/68 , H02G15/34 , H02G15/18
CPC分类号： H01B12/14 , H01R4/68 , H02G15/18 , H02G15/34 , Y02E40/648
摘要： A thermal insulation tube has a double-structure including a thermal insulation internal tube and a thermal insulation external tube, an intermediate connecting part has a double-structure including an outer container and an inner container, the internal tube and the external tube penetrate through a wall surface of the outer container and are introduced at least up to a wall surface of the inner container, a region between the internal tube and the external tube is sealed by joining an end to be introduced of the internal tube and an end to be introduced of the external tube, at an introduction portion of the external tube to be positioned on an inner side of a wall surface of the outer container, and a corrugated tubular part has a tube wall thinner than the external tube outside of the wall surface.
摘要翻译：绝热管具有包括绝热内管和绝热外管的双重结构，中间连接部具有包括外容器和内容器的双重结构，内管和外管穿透一个外部容器的壁面至少被引入内容器的壁面，内管和外管之间的区域通过将内管的引入端和待引入的端部接合而被密封外管的导入部位于外容器的壁面的内侧，波纹管状部的管壁比壁外侧的外管薄。

4. 发明申请

US20130157867A1 CONNECTION STRUCTURE FOR SUPERCONDUCTING CABLES, METHOD FOR LAYING THE SAME, AND METHOD FOR VACUUMING CONNECTION STRUCTURE FOR SUPERCONDUCTING CABLES 有权
标题翻译：用于超导电缆的连接结构，用于覆盖电缆的方法和用于超导连接电缆的连接结构的方法
公开(公告)号：US20130157867A1
公开(公告)日：2013-06-20
申请号：US13816621
申请日：2012-01-26
申请人： Masashi Yagi , Takaharu Mitsuhashi , Tomoya Nomura , Taro Matsuoka
发明人： Masashi Yagi , Takaharu Mitsuhashi , Tomoya Nomura , Taro Matsuoka
IPC分类号： H01B12/14 , H02G15/18
CPC分类号： H01B12/14 , H01R4/68 , H02G15/18 , H02G15/34 , Y02E40/648
摘要： A thermal insulation tube has a double-structure including a thermal insulation internal tube and a thermal insulation external tube, an intermediate connecting part has a double-structure including an outer container and an inner container, the internal tube and the external tube penetrate through a wall surface of the outer container and are introduced at least up to a wall surface of the inner container, a region between the internal tube and the external tube is sealed by joining an end to be introduced of the internal tube and an end to be introduced of the external tube, at an introduction portion of the external tube to be positioned on an inner side of a wall surface of the outer container, and a corrugated tubular part has a tube wall thinner than the external tube outside of the wall surface.
摘要翻译：绝热管具有包括绝热内管和绝热外管的双重结构，中间连接部具有包括外容器和内容器的双重结构，内管和外管穿透一个外部容器的壁面至少被引入内容器的壁面，内管和外管之间的区域通过将内管的引入端和待引入的端部接合而被密封外管的导入部位于外容器的壁面的内侧，波纹管状部的管壁比壁外侧的外管薄。

5. 发明申请

US20130199821A1 FIXATION STRUCTURE OF SUPERCONDUCTING CABLE AND FIXATION STRUCTURE OF SUPERCONDUCTING CABLE LINE 有权
标题翻译：超导电缆线的固定结构和超导电缆线的固定结构
公开(公告)号：US20130199821A1
公开(公告)日：2013-08-08
申请号：US13816883
申请日：2012-03-16
申请人： Jun Teng , Masashi Yagi , Taro Matsuoka , Shinichi Mukoyama , Shuka Yonemura
发明人： Jun Teng , Masashi Yagi , Taro Matsuoka , Tokui Yonemura , Shinichi Mukoyama
IPC分类号： H01B12/02
CPC分类号： H01B12/02 , H01B12/16 , H02G15/34 , Y02E40/647 , Y02E40/648
摘要： A fixation structure for fixing a superconducting cable including a cable core and a thermal insulation tube. The fixation structure includes a fixation box connected to the thermal insulation tube, including a hollow thermal insulation structure, and through which the cable core is passed, a fixation body for fixing the cable core on the inner wall of the fixation box, and a diameter-expanded reinforcement layer that is an electrical insulation layer that has a diameter decreasing toward both ends and is formed on the cable core. A refrigerant flows through the inside of the inner wall of the fixation box. The cable core is fixed on the inner wall with the fixation body through the diameter-expanded reinforcement layer. The structure implements a simple and low-cost fixation structure appropriate for an electric field design.
摘要翻译：一种用于固定包括电缆芯和绝热管的超导电缆的固定结构。固定结构包括连接到绝热管的固定盒，包括中空保温结构，电缆芯通过该固定盒，用于将电缆芯固定在固定盒的内壁上的固定体，膨胀加强层，其是直径朝向两端减小并形成在电缆芯上的电绝缘层。制冷剂流过固定盒内壁的内部。电缆芯通过直径扩展加强层固定在内壁上，固定体固定在内壁上。该结构实现了适用于电场设计的简单且低成本的固定结构。

6. 发明授权

US06345757B1 Reflow soldering method 失效
标题翻译：回流焊接方法
公开(公告)号：US06345757B1
公开(公告)日：2002-02-12
申请号：US09615089
申请日：2000-07-12
申请人： Seiki Sakuyama , Taro Matsuoka
发明人： Seiki Sakuyama , Taro Matsuoka
IPC分类号： B23K100
CPC分类号： F27B9/243 , B23K1/012 , B23K2101/40 , F27B9/066 , F27B9/10 , F27D7/04 , H05K3/3494
摘要： A reflow soldering furnace in which a printed board and a plurality of electronic parts mounted thereon are subjected to reflow soldering. The furnace comprises a reflow soldering furnace body including a plurality of heating zones defined by furnace walls, a hot-gas applier, and a radiant-heat applier. The hot-gas applier includes a heat source and a fan for blowing a hot gas of a temperature lower than a target temperature for each zone against a printed board. The radiant-heat applier includes a heater for applying radiant heat of a temperature higher than the target temperature to the printed board. The printed board and electronic parts thereon are heated to the target temperature, the melting point of solder, by means of the radiant heat from the heater. Among these electronic parts, small-sized ones with a relatively small heat capacity are restrained from overheating by the low-temperature hot gas from the hot-gas applier.
摘要翻译：将印刷基板和安装在其上的多个电子部件进行回流焊接的回流焊炉。该炉包括回流焊炉体，其包括由炉壁限定的多个加热区，热气施加器和辐射加热器。热气体施加器包括热源和用于将每个区域的温度低于目标温度的热气体相对于印刷板吹送的风扇。辐射加热器包括用于将高于目标温度的温度的辐射热施加到印刷板的加热器。借助于来自加热器的辐射热将印刷电路板和其上的电子部件加热到目标温度，焊料的熔点。在这些电子部件中，通过来自热气体加热器的低温热气，能够抑制热容量相对较小的小型化部件的过热。

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