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    • 4. 发明授权
    • Reflow soldering method and a reflow soldering furnace
    • 回流焊接方法和回流焊炉
    • US6135344A
    • 2000-10-24
    • US123869
    • 1998-07-28
    • Seiki SakuyamaTaro Matsuoka
    • Seiki SakuyamaTaro Matsuoka
    • B23K1/008B23K1/012F27B9/06F27B9/10F27B9/24F27D7/04H05K3/34B23K31/02B23K1/00B23K5/00D06E75/24F27B14/00
    • F27B9/243B23K1/012F27B9/10B23K2201/40F27B9/066F27D7/04H05K3/3494
    • A reflow soldering furnace in which a printed board and a plurality of electronic parts mounted thereon are subjected to reflow soldering. The furnace comprises a reflow soldering furnace body including a plurality of heating zones defined by furnace walls, a hot-gas applier, and a radiant-heat applier. The hot-gas applier includes a heat source and a fan for blowing a hot gas of a temperature lower than a target temperature for each zone against a printed board. The radiant-heat applier includes a heater for applying radiant heat of a temperature higher than the target temperature to the printed board. The printed board and electronic parts thereon are heated to the target temperature, the melting point of solder, by means of the radiant heat from the heater. Among these electronic parts, small-sized ones with a relatively small heat capacity are restrained from overheating by the low-temperature hot gas from the hot-gas applier.
    • 将印刷基板和安装在其上的多个电子部件进行回流焊接的回流焊炉。 该炉包括回流焊炉体,其包括由炉壁限定的多个加热区,热气施加器和辐射加热器。 热气体施加器包括热源和用于将每个区域的温度低于目标温度的热气体相对于印刷板吹送的风扇。 辐射加热器包括用于将高于目标温度的温度的辐射热施加到印刷板的加热器。 借助于来自加热器的辐射热将印刷电路板和其上的电子部件加热到目标温度,焊料的熔点。 在这些电子部件中,通过来自热气体加热器的低温热气,能够抑制热容量相对较小的小型化部件的过热。
    • 6. 发明授权
    • Reflow soldering method
    • 回流焊接方法
    • US06345757B1
    • 2002-02-12
    • US09615089
    • 2000-07-12
    • Seiki SakuyamaTaro Matsuoka
    • Seiki SakuyamaTaro Matsuoka
    • B23K100
    • F27B9/243B23K1/012B23K2101/40F27B9/066F27B9/10F27D7/04H05K3/3494
    • A reflow soldering furnace in which a printed board and a plurality of electronic parts mounted thereon are subjected to reflow soldering. The furnace comprises a reflow soldering furnace body including a plurality of heating zones defined by furnace walls, a hot-gas applier, and a radiant-heat applier. The hot-gas applier includes a heat source and a fan for blowing a hot gas of a temperature lower than a target temperature for each zone against a printed board. The radiant-heat applier includes a heater for applying radiant heat of a temperature higher than the target temperature to the printed board. The printed board and electronic parts thereon are heated to the target temperature, the melting point of solder, by means of the radiant heat from the heater. Among these electronic parts, small-sized ones with a relatively small heat capacity are restrained from overheating by the low-temperature hot gas from the hot-gas applier.
    • 将印刷基板和安装在其上的多个电子部件进行回流焊接的回流焊炉。 该炉包括回流焊炉体,其包括由炉壁限定的多个加热区,热气施加器和辐射加热器。 热气体施加器包括热源和用于将每个区域的温度低于目标温度的热气体相对于印刷板吹送的风扇。 辐射加热器包括用于将高于目标温度的温度的辐射热施加到印刷板的加热器。 借助于来自加热器的辐射热将印刷电路板和其上的电子部件加热到目标温度,焊料的熔点。 在这些电子部件中,通过来自热气体加热器的低温热气,能够抑制热容量相对较小的小型化部件的过热。