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1. 发明授权

US08058716B2 Integrated circuit devices with stacked package interposers 有权
标题翻译：具有堆叠封装内插器的集成电路器件
公开(公告)号：US08058716B2
公开(公告)日：2011-11-15
申请号：US12625384
申请日：2009-11-24
申请人： Chew Beng Chye , Tan Kian Shing Michael , Tan Hock Chuan , Neo Chee Peng
发明人： Chew Beng Chye , Tan Kian Shing Michael , Tan Hock Chuan , Neo Chee Peng
IPC分类号： H01L23/02
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/4951 , H01L23/49537 , H01L23/49572 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/06136 , H01L2224/48091 , H01L2224/4824 , H01L2224/49109 , H01L2224/49171 , H01L2224/49433 , H01L2224/73215 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2225/06572 , H01L2225/06586 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An IC device includes a die and a first package interposer stacked over a second package interposer. The IC device includes a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer and a second conductive connection from a second bond pad of the die directly to a bond pad of the second interposer. Another IC device includes a second die stacked over a separate first die and a first package interposer stacked over a separate second package interposer. The first die is stacked over the first interposer. A first conductive connection exists from a bond pad of the first die directly to a bond pad of the first interposer and a second conductive connection exists from a bond pad of the second die directly to a bond pad of the second interposer.
摘要翻译： IC器件包括一个管芯和一个堆叠在第二封装插件上的第一封装插件。 IC器件包括从管芯的第一接合焊盘直接连接到第一插入件的接合焊盘的第一导电连接和从管芯的第二接合焊盘直接连接到第二插入件的接合焊盘的第二导电连接。另一个IC器件包括堆叠在单独的第一管芯上的第二管芯和堆叠在单独的第二封装插入器上的第一封装插入器。第一个模具堆叠在第一插入器上。第一导电连接从第一管芯的接合焊盘直接连接到第一插入件的接合焊盘，并且第二导电连接从第二管芯的焊盘直接存在于第二插入件的接合焊盘。

2. 发明申请

US20100065955A1 Integrated Circuit Devices with Stacked Package Interposers 有权
标题翻译：具有堆叠封装插件的集成电路器件
公开(公告)号：US20100065955A1
公开(公告)日：2010-03-18
申请号：US12625384
申请日：2009-11-24
申请人： Chew Beng Chye , Tan Kian Shing Michael , Tan Hock Chuan , Neo Chee Peng
发明人： Chew Beng Chye , Tan Kian Shing Michael , Tan Hock Chuan , Neo Chee Peng
IPC分类号： H01L23/498 , H01L25/11
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/4951 , H01L23/49537 , H01L23/49572 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/06136 , H01L2224/48091 , H01L2224/4824 , H01L2224/49109 , H01L2224/49171 , H01L2224/49433 , H01L2224/73215 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2225/06572 , H01L2225/06586 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An IC device includes a die and a first package interposer stacked over a second package interposer. The IC device includes a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer and a second conductive connection from a second bond pad of the die directly to a bond pad of the second interposer. Another IC device includes a second die stacked over a separate first die and a first package interposer stacked over a separate second package interposer. The first die is stacked over the first interposer. A first conductive connection exists from a bond pad of the first die directly to a bond pad of the first interposer and a second conductive connection exists from a bond pad of the second die directly to a bond pad of the second interposer.
摘要翻译： IC器件包括一个管芯和一个堆叠在第二封装插件上的第一封装插件。 IC器件包括从管芯的第一接合焊盘直接连接到第一插入件的接合焊盘的第一导电连接和从管芯的第二接合焊盘直接连接到第二插入件的接合焊盘的第二导电连接。另一个IC器件包括堆叠在单独的第一管芯上的第二管芯和堆叠在单独的第二封装插入器上的第一封装插入器。第一个模具堆叠在第一插入器上。第一导电连接从第一管芯的接合焊盘直接连接到第一插入件的接合焊盘，并且第二导电连接从第二管芯的焊盘直接存在于第二插入件的接合焊盘。

3. 发明申请

US20070246840A1 Integrated circuit devices with stacked package interposers 有权
标题翻译：具有堆叠封装内插器的集成电路器件
公开(公告)号：US20070246840A1
公开(公告)日：2007-10-25
申请号：US11446004
申请日：2006-06-01
申请人： Chew Beng Chye , Tan Kian Shing Michael , Tan Hock Chuan , Neo Chee Peng
发明人： Chew Beng Chye , Tan Kian Shing Michael , Tan Hock Chuan , Neo Chee Peng
IPC分类号： H01L23/52
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/4951 , H01L23/49537 , H01L23/49572 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/06136 , H01L2224/48091 , H01L2224/4824 , H01L2224/49109 , H01L2224/49171 , H01L2224/49433 , H01L2224/73215 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2225/06572 , H01L2225/06586 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An IC device includes a die and a first package interposer stacked over a second package interposer. The IC device includes a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer and a second conductive connection from a second bond pad of the die directly to a bond pad of the second interposer. Another IC device includes a second die stacked over a separate first die and a first package interposer stacked over a separate second package interposer. The first die is stacked over the first interposer. A first conductive connection exists from a bond pad of the first die directly to a bond pad of the first interposer and a second conductive connection exists from a bond pad of the second die directly to a bond pad of the second interposer.
摘要翻译： IC器件包括一个管芯和一个堆叠在第二封装插件上的第一封装插件。 IC器件包括从管芯的第一接合焊盘直接连接到第一插入件的接合焊盘的第一导电连接和从管芯的第二接合焊盘直接连接到第二插入件的接合焊盘的第二导电连接。另一个IC器件包括堆叠在单独的第一管芯上的第二管芯和堆叠在单独的第二封装插入器上的第一封装插入器。第一个模具堆叠在第一插入器上。第一导电连接从第一管芯的接合焊盘直接连接到第一插入件的接合焊盘，并且第二导电连接从第二管芯的焊盘直接存在于第二插入件的接合焊盘。

4. 发明授权

US07622798B2 Integrated circuit devices with stacked package interposers 有权
标题翻译：具有堆叠封装内插器的集成电路器件
公开(公告)号：US07622798B2
公开(公告)日：2009-11-24
申请号：US11446004
申请日：2006-06-01
申请人： Chew Beng Chye , Tan Kian Shing Michael , Tan Hock Chuan , Neo Chee Peng
发明人： Chew Beng Chye , Tan Kian Shing Michael , Tan Hock Chuan , Neo Chee Peng
IPC分类号： H01L23/02
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/4951 , H01L23/49537 , H01L23/49572 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/06136 , H01L2224/48091 , H01L2224/4824 , H01L2224/49109 , H01L2224/49171 , H01L2224/49433 , H01L2224/73215 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2225/06572 , H01L2225/06586 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An IC device includes a die and a first package interposer stacked over a second package interposer. The IC device includes a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer and a second conductive connection from a second bond pad of the die directly to a bond pad of the second interposer. Another IC device includes a second die stacked over a separate first die and a first package interposer stacked over a separate second package interposer. The first die is stacked over the first interposer. A first conductive connection exists from a bond pad of the first die directly to a bond pad of the first interposer and a second conductive connection exists from a bond pad of the second die directly to a bond pad of the second interposer.
摘要翻译： IC器件包括一个管芯和一个堆叠在第二封装插件上的第一封装插件。 IC器件包括从管芯的第一接合焊盘直接连接到第一插入件的接合焊盘的第一导电连接和从管芯的第二接合焊盘直接连接到第二插入件的接合焊盘的第二导电连接。另一个IC器件包括堆叠在单独的第一管芯上的第二管芯和堆叠在单独的第二封装插入器上的第一封装插入器。第一个模具堆叠在第一插入器上。第一导电连接从第一管芯的接合焊盘直接连接到第一插入件的接合焊盘，并且第二导电连接从第二管芯的焊盘直接存在于第二插入件的接合焊盘。

5. 发明申请

US20080308221A1 Method And System For Removing Tape From Substrates 审中-公开
标题翻译：从基板去除胶带的方法和系统
公开(公告)号：US20080308221A1
公开(公告)日：2008-12-18
申请号：US11779450
申请日：2007-07-18
申请人： Tan Kian Shing Michael , Neo Chee Peng , Tan Chee Yong
发明人： Tan Kian Shing Michael , Neo Chee Peng , Tan Chee Yong
IPC分类号： B32B38/10 , G05G15/04
CPC分类号： B29C63/0013 , H01L21/67132
摘要： A method for removing tape from a substrate includes the step of detecting an actual distance between a peel head and the tape on the substrate, and a location of an edge of the substrate. The method also includes the steps of moving the peel head in a first direction by an amount equal to the distance to press the peel tape onto the tape on the substrate, moving the peel head in a second direction to the edge of the substrate, and then moving the peel head in an opposite second direction to peel the tape from the substrate. The detecting step can be performed using a sensor such as a capacitance probe sensor or an optical sensor. Alternately, rather than detecting the distance, a pressure sensing system can be used to press the peel head against the tape, and to maintain a predetermined pressure range during the peeling process. A system for performing the method includes sensors configured to detect the distance and the edge of the substrate, and a control system configured to control the movement of the peel head responsive to signals from the sensors. A pressure sensing system includes a compression spring and a load cell for sensing pressure, and a stepper motor configured to control movement of the peel head responsive to pressure signals.
摘要翻译：从衬底去除带的方法包括检测剥离头与基片上的带之间的实际距离以及衬底边缘的位置的步骤。该方法还包括以下步骤：将剥离头沿第一方向移动等于将剥离带压在基材上的带上的距离，将剥离头沿第二方向移动到基板的边缘;以及然后在相反的第二方向上移动剥离头，以从基材上剥离带子。可以使用诸如电容探针传感器或光学传感器的传感器来执行检测步骤。或者，不是检测距离，可以使用压力感测系统将剥离头压靠在带上，并且在剥离过程中保持预定的压力范围。用于执行该方法的系统包括被配置为检测基板的距离和边缘的传感器，以及被配置为响应于来自传感器的信号来控制剥离头的移动的控制系统。压力感测系统包括压缩弹簧和用于感测压力的测力传感器，以及步进电机，其构造成响应于压力信号来控制剥离头的运动。

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