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    • 10. 发明授权
    • Apparatus and a method for removing solder from an object
    • 用于从物体去除焊料的装置和方法
    • US06435401B1
    • 2002-08-20
    • US09618456
    • 2000-07-18
    • Takeshi MiitsuKaoru KatayamaYasuhiro Yamamoto
    • Takeshi MiitsuKaoru KatayamaYasuhiro Yamamoto
    • B23K1018
    • H01L21/67259B23K1/018H01L21/681
    • A solder-removing apparatus includes a heating portion for heating the object having the solder adhered thereto, a measuring portion for measuring the distance from the measuring portion to the object, a solder-drawing portion for drawing the molten solder on the object by suction, an X-Y moving portion for moving the object in an X-direction or a Y-direction, a Z moving portion for moving the object relative to the solder-drawing portion in a Z-direction, and a control portion for controlling the X-Y moving portion and the Z moving portion. During the time when the molten solder on the object is drawn by the solder-drawing portion, the control portion causes the X-Y moving portion to move the object, and also causes the Z moving portion to move the object relative to the solder-drawing portion in accordance with the distance, measured by the measuring portion, so that the distance between the solder-drawing portion and the object can be kept constant.
    • 焊料除去装置包括用于加热粘附有焊料的物体的加热部分,用于测量从测量部分到物体的距离的测量部分,用于通过抽吸将熔融焊料吸附在物体上的焊接部分, 用于在X方向或Y方向上移动物体的XY移动部分,用于沿Z方向相对于焊料牵引部移动物体的Z移动部分,以及用于控制XY移动部分的控制部分 和Z移动部分。 在物体上的熔融焊料被焊锡部分牵引的时间期间,控制部分使XY移动部分移动物体,并且还使Z移动部分相对于焊接部分移动物体 根据由测量部分测量的距离,使得焊接部分与物体之间的距离可以保持恒定。