专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06447868B1 Optical molding material, and optical disk substrate and production method thereof 失效
标题翻译：光学成型材料，光盘基板及其制造方法
公开(公告)号：US06447868B1
公开(公告)日：2002-09-10
申请号：US09617810
申请日：2000-07-17
申请人： Masayuki Sekiguchi , Toshihiro Ohtsuki , Takatoshi Ishigaki , Tatsuya Hirono
发明人： Masayuki Sekiguchi , Toshihiro Ohtsuki , Takatoshi Ishigaki , Tatsuya Hirono
IPC分类号： B32B302
CPC分类号： G11B7/2538 , G11B7/2534 , G11B7/2542 , G11B7/2548 , G11B7/2585 , G11B7/2595 , G11B2007/24304 , G11B2007/2571 , G11B2007/25713 , Y10T428/21
摘要： Provided is an optical molding material comprising a cyclic polyolefin resin having a glass transition temperature (Tg) of 120° C. to 170° C., wherein the melt viscosity of the resin at 260° C. is 5,000 to 50,000 poises as measured at a shear rate of 10 sec−1 and 200 to 1,000 poises at a shear rate of 10,000 sec−1, and the melt viscosity of the resin at 320° C. is 500 to 5,000 poises at a shear rate of 10 sec−1 and 100 to 800 poises at a shear rate of 10,000 sec−1. An optical molding material comprising a cyclic polyolefin resin, an optical molded product and an optical disk substrate, wherein a variation range of retardation of the resin is within ±10% of the retardation at 590 nm when the wavelength is changed from 400 nm to 830 nm, are provided. The material is molded into, for example, the optical disk substrate. A method for producing an optical disk substrate comprises injection-molding a thermoplastic resin comprising a cyclic polyolefin resin under conditions of a resin temperature of (Tg+100)° C. to 400° C., a mold temperature of (Tg−100)° C. to (Tg−5)° C., a shear rate of 4×104 to 1×106 sec−1 and average residence time of the resin in a molding machine of 5 to 200 seconds. The cyclic polyolefin resin is preferably composed of a norbornene derivative.
摘要翻译：提供了一种光学成型材料，其包含玻璃化转变温度（Tg）为120℃至170℃的环状聚烯烃树脂，其中在260℃下树脂的熔体粘度为5000至50,000泊，在10,000秒-1的剪切速率下的剪切速率为10秒-1和200至1,000泊，而在320℃下的树脂的熔体粘度在10秒-1的剪切速率下为500至5000泊， 100至800泊，剪切速率为10,000秒-1。一种包含环状聚烯烃树脂，光学模制产品和光盘基片的光学模塑材料，其中当波长从400nm变化到830时，树脂延迟的变化范围在590nm处的延迟的±10％以内 nm。将该材料成型为例如光盘基板。制造光盘基板的方法包括在（Tg + 100）℃至400℃的树脂温度，（Tg-100）℃的模具温度条件下，将包含环状聚烯烃树脂的热塑性树脂注塑成型， ℃至（Tg-5）℃，剪切速率为4×10 4至1×10 6秒-1，树脂在成型机中的平均停留时间为5至200秒。环状聚烯烃树脂优选由降冰片烯衍生物构成。

IPRDB

热门服务

关于我们

友情链接

联系方式