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1. 发明申请

US20120148860A1 FLAT Ni PARTICLE, LAMINATED CERAMIC ELECTRONIC COMPONENT USING FLAT Ni PARTICLE, AND PRODUCTION METHOD FLAT Ni PARTICLE 有权
标题翻译：平面Ni颗粒，使用平面Ni颗粒的层压陶瓷电子元件和生产方法平面Ni颗粒
公开(公告)号：US20120148860A1
公开(公告)日：2012-06-14
申请号：US13403136
申请日：2012-02-23
申请人： Takao Hosokawa
发明人： Takao Hosokawa
IPC分类号： B32B3/00 , C25D1/00 , B32B5/16
CPC分类号： C25C5/02 , B22F1/0055 , B22F9/04 , H01G4/0085 , H01G4/30 , H01G9/042 , Y10T428/12014 , Y10T428/256 , Y10T428/2982
摘要： Provided is a flat Ni particle which has a large specific surface area, permitting efficient binder removal when the flat Ni particle is used for internal electrodes of a laminated ceramic electronic component. The flat Ni particle has a thickness t (m), a specific gravity ρ (g/m3), and a radius r (m), and a specific surface area S1 (m2/g), such that the specific surface area S1 is adapted to have a relationship of 1.5×S0
摘要翻译：提供一种具有大比表面积的扁平Ni颗粒，当平面Ni颗粒用于层压陶瓷电子部件的内部电极时，可以有效地除去粘合剂。平坦的Ni颗粒具有厚度t（m），比重＆rgr; （g / m3），半径r（m）和比表面积S1（m2 / g），使得比表面积S1适合于具有1.5×S0

2. 发明申请

US20110205684A1 CAPACITOR AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：电容器及其制造方法
公开(公告)号：US20110205684A1
公开(公告)日：2011-08-25
申请号：US13029206
申请日：2011-02-17
申请人： Shigekatsu YAMAMOTO , Takao HOSOKAWA
发明人： Shigekatsu YAMAMOTO , Takao HOSOKAWA
IPC分类号： H01G4/008 , H01G4/236 , H01G4/005
CPC分类号： H01G4/35 , H01G4/232 , H01G4/30 , Y10T29/435
摘要： A capacitor includes a capacitor body made of a dielectric, a first internal electrode, a second internal electrode, a first signal terminal, a second signal terminal, and a grounding terminal. The first and second signal terminals are connected to the first internal electrode. The grounding terminal is disposed on the outer surface of the capacitor body so as to be connected to the second internal electrode. The grounding terminal is connected to the ground potential. The grounding terminal includes a plating layer which is disposed on the capacitor body and which is connected to the second internal electrode.
摘要翻译：电容器包括由电介质，第一内部电极，第二内部电极，第一信号端子，第二信号端子和接地端子构成的电容器体。第一和第二信号端子连接到第一内部电极。接地端子设置在电容器体的外表面上，以便连接到第二内部电极。接地端子接地电位。接地端子包括设置在电容器本体上并连接到第二内部电极的镀层。

3. 发明授权

US06382956B1 Mold for producing a resin molded article 有权
标题翻译：用于制造树脂模制品的模具
公开(公告)号：US06382956B1
公开(公告)日：2002-05-07
申请号：US09712913
申请日：2000-11-16
申请人： Koichi Warino , Toshiyuki Ito , Masahiro Suzuki , Takao Hosokawa
发明人： Koichi Warino , Toshiyuki Ito , Masahiro Suzuki , Takao Hosokawa
IPC分类号： B29D1100
CPC分类号： B29C45/73 , B29C45/00 , B29D11/00269 , B29D17/005 , B29L2011/005 , B29L2017/005 , Y10S425/81
摘要： A mold for producing a resin molded article. The mold comprises a molding cavity with a member having a recessed surface which defines the shape of the article being molded. Between the molding cavity wall and the member is a thin plate body having a heat capacity such that when a resin having a temperature higher than its transfer starting temperature is introduced into the recessed surface of the member, the resin near the recessed surface is cooled to a temperature lower than its transfer starting temperature, and then the temperature of the resin is increased to a temperature exceeding its transfer starting temperature after the resin fills the recessed surface.
摘要翻译：一种用于制造树脂模塑制品的模具。模具包括具有限定待模制制品的形状的凹陷表面的构件的模制腔。在成型腔壁和构件之间是具有热容量的薄板体，使得当具有高于其转移起始温度的温度的树脂被引入到构件的凹陷表面中时，将凹入表面附近的树脂冷却至温度低于其转移开始温度，然后在树脂填充凹陷表面之后树脂的温度升高到超过其转印开始温度的温度。

4. 发明授权

US06729213B1 Manufacturing method of monolithic electronic components 有权
标题翻译：单片电子元器件的制造方法
公开(公告)号：US06729213B1
公开(公告)日：2004-05-04
申请号：US09527173
申请日：2000-03-17
申请人： Hiroyuki Baba , Takao Hosokawa
发明人： Hiroyuki Baba , Takao Hosokawa
IPC分类号： B26D718
CPC分类号： H05K3/4629 , B26D7/1863 , B26F2210/08 , B28B1/002 , B28B11/168 , H01L21/481 , H05K1/0306 , H05K3/4611 , Y10T83/04 , Y10T83/0453 , Y10T83/2042 , Y10T83/2185
摘要： When the step of transferring a ceramic green sheet held on a chuck head having a holding surface with a plurality of vacuum ports distributed thereon onto a depositing table is repeated to obtain a laminated product, undesired deformation or damage is produced on the ceramic green sheet due to negative pressure applied to the chucking port and an obtained monolithic ceramic electronic component becomes defective by aligning of portions having the deformation or the damage in the depositing direction. In order to solve this problem, when transferring of the ceramic green sheet is repeated in the depositing step, the relative positions of the chuck head and the depositing table are shifted so as to bringing the chucking port into the same position during a first transferring step and a subsequent second transferring step.
摘要翻译：当将保持在具有分配在其上的多个真空口的保持表面的卡盘头上的陶瓷生片转印到沉积台上的步骤被重复以获得层压产品时，在陶瓷生片上产生不期望的变形或损坏施加到夹紧端口的负压，并且所获得的单片陶瓷电子部件通过对准具有在沉积方向上的变形或损坏的部分而变得有缺陷。为了解决这个问题，当在沉积步骤中重复转移陶瓷生片时，夹头和沉积台的相对位置移动，以便在第一转印步骤期间使夹紧口进入相同的位置和随后的第二转移步骤。

5. 再颁专利

USRE38107E1 Method for producing optical disc substrates 失效
标题翻译：光盘基板的制造方法
公开(公告)号：USRE38107E1
公开(公告)日：2003-05-06
申请号：US10120433
申请日：2002-04-12
申请人： Takao Hosokawa , Koichi Warino
发明人： Takao Hosokawa , Koichi Warino
IPC分类号： B29D1100
CPC分类号： B29D17/005 , B29C45/00 , B29C45/263 , B29C45/561 , B29K2033/12 , B29L2011/00 , B29L2017/005
摘要： Provided is a method for producing optical disc substrates having a low degree of birefringence. The method has good mass-producibility, in which the pattern transferability on the substrates produced is good. In producing optical disc substrates having a diameter of from 80 to 120 mm and a thickness of from 0.5 to 0.7 mm, through injection molding or injection-compression molding, a resin for the substrates is injected and charged into the cavity of a mold at a resin filling rate of not lower than 65 cm3/sec, said resin filling rate being obtained by dividing the cavity volume (cm3) of the mold, into which the resin is charged, by the time (sec) taken from the start of resin injection through the tip of the nozzle of the injection-molding machine to the arrival of the resin at the deepest end of the cavity of the mold.
摘要翻译：提供一种具有低双折射度的光盘基片的制造方法。该方法具有良好的批量生产性，其中所生产的基底上的图案转移性良好。在制造直径为80〜120mm，厚度为0.5〜0.7mm的光盘基板中，通过注射成型或注射压缩成型，将基板用树脂注入模具的型腔内树脂填充率不低于65立方厘米/秒，所述树脂填充率通过将树脂注入的模具的空腔体积（cm3）除以从树脂注射开始起的时间（秒）而获得通过注射成型机的喷嘴的尖端将树脂到达模具的腔的最深端。

6. 发明授权

US06361676B1 Technique for manufacturing electronic parts 有权
标题翻译：电子零件制造技术
公开(公告)号：US06361676B1
公开(公告)日：2002-03-26
申请号：US09434163
申请日：1999-11-04
申请人： Shigeyuki Horie , Takao Hosokawa
发明人： Shigeyuki Horie , Takao Hosokawa
IPC分类号： C25D1716
CPC分类号： C25D17/16 , C25D17/20
摘要： A technique for manufacturing electronic parts uses barrel plating to plate films on external electrodes of the electronic parts with small thickness variation of the plated films. The technique comprises disposing a plurality of non-spherical conductive elements in a plating barrel, disposing a plurality of electronic parts in the plating barrel, and rotating the plating barrel to form the plated films on the external electrodes of the electronic parts.
摘要翻译：制造电子部件的技术使用滚镀技术在电子部件的外部电极上对薄膜的厚度变化小。该技术包括在电镀槽中设置多个非球形导电元件，将多个电子部件放置在电镀槽中，并使电镀滚筒旋转以在电子部件的外部电极上形成镀膜。

7. 发明授权

US06171527B2 Process for producing resin molded article and mold used in the process 失效
标题翻译：用于生产树脂模制品和模具的方法
公开(公告)号：US06171527B2
公开(公告)日：2001-01-09
申请号：US09048893
申请日：1998-03-27
申请人： Koichi Warino , Toshiyuki Ito , Masahiro Suzuki , Takao Hosokawa
发明人： Koichi Warino , Toshiyuki Ito , Masahiro Suzuki , Takao Hosokawa
IPC分类号： B29D1100
CPC分类号： B29C45/73 , B29C45/00 , B29D11/00269 , B29D17/005 , B29L2011/005 , B29L2017/005 , Y10S425/81
摘要： A molded resin article is prepared by introducing a thermoplastic resin having a temperature greater than a transfer starting temperature into the cavity of a mold, which is retained at a temperature less than the transfer starting temperature, and injection-molding the thermoplastic resin in the mold in which the heat capacity of a surface on the cavity side is set such that the temperature of the thermoplastic resin near the surface of the mold, which resin is cooled in said mold to a temperature less than the transfer starting temperature, is increased again to a temperature exceeding the transfer starting temperature after the cavity is filled with the thermoplastic resin.
摘要翻译：通过将温度大于转印开始温度的热塑性树脂引入模具的空腔中，将其保持在低于转印开始温度的温度下，并将热塑性树脂注射到模具中来制备模塑树脂制品其中空腔侧的表面的热容量被设定为使得在所述模具中冷却所述模具的所述模具表面附近的热塑性树脂的温度再次降低到低于所述转移开始温度的温度，再次增加到在空腔充满热塑性树脂之后的温度超过转印起始温度。

8. 发明授权

US5356512A Method of stacking ceramic green sheets 失效
标题翻译：堆叠陶瓷生片的方法
公开(公告)号：US5356512A
公开(公告)日：1994-10-18
申请号：US988222
申请日：1992-12-09
申请人： Takao Hosokawa
发明人： Takao Hosokawa
IPC分类号： H01G4/12 , B28B11/00 , B32B18/00 , H01G4/30 , H05K3/46 , B32B31/04
CPC分类号： H05K3/4611
摘要： To improve transferability for stacking ceramic green sheets through a transfer technique, a ceramic green sheet formed on a first back film is heated and pressurized by rolls so as to be transferred to a second back film. Thereafter, the transferred ceramic green sheet is compression bonded through a contact surface defined by a surface exposed by separation of the first back film to at least one other ceramic green sheet which has been already stacked.
摘要翻译：为了提高通过转印技术堆叠陶瓷生片的转印性，将形成在第一背面薄膜上的陶瓷生片通过辊加热并加压，从而转印到第二背面薄膜。此后，转移的陶瓷生片通过由通过分离第一后膜暴露的表面限定的接触表面压贴到已经堆叠的至少一个其它陶瓷生片中。

9. 发明授权

US06475317B1 Method for manufacturing electronic component of laminated ceramics 有权
标题翻译：层压陶瓷电子元件的制造方法
公开(公告)号：US06475317B1
公开(公告)日：2002-11-05
申请号：US09510918
申请日：2000-02-22
申请人： Hiroyuki Baba , Koji Kato , Yasunobu Yoneda , Takao Hosokawa
发明人： Hiroyuki Baba , Koji Kato , Yasunobu Yoneda , Takao Hosokawa
IPC分类号： C03B2900
CPC分类号： H05K1/0306 , B32B18/00 , C04B2237/04 , C04B2237/32 , C04B2237/595 , C04B2237/708 , H01G4/30 , H05K3/4611 , H05K3/4629
摘要： The present invention provides a method for manufacturing an electronic component of laminated ceramics such as a laminated ceramic capacitor in which, when a ceramic paste is applied on a ceramic green sheet in order to substantially eliminate steps caused by the thickness of a film of inner circuit elements such as an inner electrode, the ceramic paste is prevented from generating a gap between the paste and the film of inner circuit elements, or the thickness of the ceramic paste is prevented from being increased, by allowing the paste to overflow the film of inner circuit elements, even when the application position has been a little shifted, wherein an inclined face is formed at the periphery of an inner electrode that serves as the film of inner circuit elements, the ceramic paste being applied so as to overlap the periphery of the inner electrode, and wherein the used ceramic paste contains about 40% by weight to 85% by weight of solvents in order to facilitate smooth leveling of the applied ceramic paste.
摘要翻译：本发明提供一种层叠陶瓷电容器的电子部件的制造方法，其中，当将陶瓷浆料涂敷在陶瓷生片上时，基本上消除由内部电路膜的厚度引起的步骤内部电极等元件，陶瓷膏不会产生糊状物与内部电路元件的膜之间的间隙，或者通过使糊状物溢出内部的膜，可以防止陶瓷膏的厚度增加电路元件，即使施加位置稍微偏移，其中在用作内部电路元件的膜的内部电极的周围形成有倾斜面，所述陶瓷膏被施加以与所述电路元件的外围重叠内部电极，并且其中所使用的陶瓷浆料包含约40重量％至85重量％的溶剂，以便于平滑流平o f应用陶瓷膏。

10. 发明授权

US6007652A Method of preparing metal thin film having excellent transferability 失效
标题翻译：制备转印性优异的金属薄膜的方法
公开(公告)号：US6007652A
公开(公告)日：1999-12-28
申请号：US26208
申请日：1993-03-02
申请人： Takao Hosokawa , Yoshiaki Kohno
发明人： Takao Hosokawa , Yoshiaki Kohno
IPC分类号： H01G4/005 , H05K3/20
CPC分类号： H01G4/005 , H05K3/20 , H05K3/205 , H05K2201/0317 , H05K2203/0156
摘要： A metal thin film having excellent transferability onto a ceramic sheet is provided in order to facilitate formation of an internal electrode for a multilayer ceramic capacitor, for example, by a technique of transferring a metal thin film. A first metal layer (2) of nickel or copper or another metal is formed on a film (1) by vapor deposition, and then a second metal layer (3) of nickel or copper or another metal is formed on the first metal layer (2) by wet plating such as electroplating or electroless plating, thereby providing a metal thin film constituted by the first and second metal layers (2 and 3) having excellent transferability.
摘要翻译：提供了具有优异的陶瓷片转印性的金属薄膜，以便于例如通过转印金属薄膜的技术形成多层陶瓷电容器的内部电极。通过气相沉积在膜（1）上形成镍或铜或其他金属的第一金属层（2），然后在第一金属层上形成镍或铜或其他金属的第二金属层（3） 2）通过电镀或化学镀等湿法镀覆，由此提供由具有优异转印性的第一和第二金属层（2和3）构成的金属薄膜。

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