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1. 发明授权

US07303943B2 Method of manufacturing electric device 失效
标题翻译：电器制造方法
公开(公告)号：US07303943B2
公开(公告)日：2007-12-04
申请号：US10960168
申请日：2004-10-07
申请人： Tsutomu Matsuhira , Hideaki Adachi , Keiichiro Hayashi , Tadahiro Nishigawa , Nobukazu Koizumi
发明人： Tsutomu Matsuhira , Hideaki Adachi , Keiichiro Hayashi , Tadahiro Nishigawa , Nobukazu Koizumi
IPC分类号： H01L21/00
CPC分类号： H05K3/0011 , H01L21/4846 , H01L23/4985 , H01L24/81 , H01L2224/13111 , H01L2224/13144 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/81203 , H01L2224/81801 , H01L2224/81805 , H01L2224/81825 , H01L2224/83102 , H01L2224/92125 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K1/0393 , H05K2203/1194 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： In a method of manufacturing an electric device, moisture in a film substrate is reduced by heating the film substrate at a temperature in the range of 80° C. to 100° C. Thereafter, an IC is mounted on the film substrate.
摘要翻译：在制造电气装置的方法中，通过在80℃至100℃的温度下加热薄膜基板来降低薄膜基板中的湿度。此后，将IC安装在薄膜基板上。

2. 发明授权

US5363580A Switching mechanism of an ejector in gun 失效
标题翻译：喷枪在枪中的切换机制
公开(公告)号：US5363580A
公开(公告)日：1994-11-15
申请号：US82871
申请日：1993-06-29
申请人： Tadahiro Nishigawa
发明人： Tadahiro Nishigawa
IPC分类号： F41A15/00 , F41A15/06
CPC分类号： F41A15/06
摘要： An object of the present invention is to provide a switching mechanism of an ejector which is simple to operate and in which projecting portions on a gun are minimized. A hammer is pivoted to return to the original position when a breech is opened after a gun is fired, whereby a projection of the hammer abuts against a head of a trip rod. Thus, the trip rod is shifted longitudinally and the ejector mechanism is operated. A spiral guide which is engaged with the trip rod is formed on a selector button adjacent to the trip rod, and a groove for rotation is formed on an end surface of the selector button. When the selector button is rotated, the trip rod is shifted in the direction which intersects with its longitudinal direction, thereby switching between a state in which the projection abuts against the head and another state in which they are not abutted against each other.
摘要翻译：本发明的目的是提供一种喷射器的切换机构，该切换机构操作简单，其中喷枪上的突出部分最小化。在枪被击发后，当枪膛打开时，锤被枢转以返回到原始位置，由此锤的突起抵靠跳闸杆的头部。因此，跳闸杆纵向移动并且喷射器机构被操作。与脱扣杆接合的螺旋引导件形成在与脱扣杆相邻的选择器按钮上，并且在选择按钮的端面上形成用于旋转的槽。当选择按钮旋转时，跳闸杆沿与其纵向方向相交的方向移动，从而在突起抵靠头部的状态和不彼此抵接的状态之间切换。

3. 发明申请

US20060079026A1 Method of the film substrate, a method of the semiconductor device using the same, a method of the display device using the same, and a method of the electric device using the same 失效
标题翻译：薄膜基板的方法，使用该薄膜基板的半导体装置的方法，使用该方法的显示装置的方法以及使用该方法的电气装置的方法
公开(公告)号：US20060079026A1
公开(公告)日：2006-04-13
申请号：US10960168
申请日：2004-10-07
申请人： Tsutomu Matsuhira , Hideaki Adachi , Keiichiro Hayashi , Tadahiro Nishigawa , Nobukazu Koizumi
发明人： Tsutomu Matsuhira , Hideaki Adachi , Keiichiro Hayashi , Tadahiro Nishigawa , Nobukazu Koizumi
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： H05K3/0011 , H01L21/4846 , H01L23/4985 , H01L24/81 , H01L2224/13111 , H01L2224/13144 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/81203 , H01L2224/81801 , H01L2224/81805 , H01L2224/81825 , H01L2224/83102 , H01L2224/92125 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K1/0393 , H05K2203/1194 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： A method of manufacture is provided in which position deviations during mounting are eliminated, and in which fine connections on the order of a 30 μm pitch can be stabilized. A low cost device can thus be realized by cost reductions that accompany smaller ICs. Mounting is performed in a state where moisture in a polyimide film of a film substrate has been substantially dried, or mounting is performed after conditioning under a fixed environment. Further, patterning of the film substrate is performed after similar drying processing or conditioning.
摘要翻译：提供了一种制造方法，其中消除了安装期间的位置偏差，并且可以稳定30μm级间距的精细连接。因此，可以通过伴随较小IC的成本降低来实现低成本设备。在膜基材的聚酰亚胺膜中的水分已经基本干燥的状态下进行安装，或者在固定环境下进行调理后进行安装。此外，在类似的干燥处理或调理之后进行膜基材的图案化。

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