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    • 5. 发明申请
    • LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREOF
    • 发光二极管及其制造方法
    • US20110121349A1
    • 2011-05-26
    • US12781803
    • 2010-05-17
    • Szu-Yuan WengYu-Huan Liu
    • Szu-Yuan WengYu-Huan Liu
    • H01L33/00H01L31/00
    • H01L33/62H01L2924/0002H01L2924/00
    • A light-emitting diode (LED) and manufacturing method thereof are disclosed. The LED includes a transparent substrate, a plurality of transparent conductive layers, a plurality of metal circuits, and a LED chip. The LED chip is suitable for emitting a light and a portion of the light emits toward the transparent substrate. The manufacturing method of LED includes the following steps. First, a transparent conductive layer is formed on the transparent substrate. Next, a conductive pattern is fromed by etching transparent conductive layer. The intersection metal circuit is formed by disposing the metal on a portion of the transparent conductive layer. Finally, the LED chip is disposed on the metal circuit so tat the LED chip is electrically connected to the metal circuit.
    • 公开了一种发光二极管(LED)及其制造方法。 LED包括透明基板,多个透明导电层,多个金属电路和LED芯片。 LED芯片适用于发光,一部分光朝向透明基板发射。 LED的制造方法包括以下步骤。 首先,在透明基板上形成透明导电层。 接下来,通过蚀刻透明导电层开始导电图案。 交叉金属电路通过将金属设置在透明导电层的一部分上而形成。 最后,将LED芯片设置在金属电路上,使得LED芯片电连接到金属电路。