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    • 1. 发明授权
    • Mobile device and data connection method thereof
    • 移动设备及其数据连接方法
    • US08842590B2
    • 2014-09-23
    • US12506374
    • 2009-07-21
    • Shan-Wei PingChih-Yang KuoSz-Shian LiSzu-Han WuYu-Ti Su
    • Shan-Wei PingChih-Yang KuoSz-Shian LiSzu-Han WuYu-Ti Su
    • G08C17/00G06F1/00G06F1/32G06F9/50
    • G06F1/3203G06F1/3209G06F1/3293G06F9/5094Y02D10/122Y02D10/22
    • A mobile device with a port map maintaining a list of open ports for incoming data packets is provided. A first processor receives and demodulates inbound signals into data packets. A second processor processes at least one application bound to at least one open port. The second processor enters a sleep mode to reduce power consumption if no data packet is sent from the first processor to the second processor. When the first processor receives an inbound request signal, the first processor demodulates the inbound request signal into a first data packet targeted to a destination port, and looks up the port map to determine whether the destination port is listed in the port map. If the destination port is not listed in the port map, the first processor transmits a response signal to the sender of the inbound request signal or omits the inbound request signal without waking up the second processor.
    • 提供一种具有端口映射的移动设备,其维护用于输入数据分组的开放端口的列表。 第一处理器将入站信号接收并解调成数据包。 第二处理器处理绑定到至少一个开放端口的至少一个应用程序。 如果没有数据分组从第一处理器发送到第二处理器,则第二处理器进入休眠模式以降低功耗。 当第一处理器接收入站请求信号时,第一处理器将入站请求信号解调为目标端口的第一数据分组,并查找端口映射以确定端口映射中是否列出了目的端口。 如果端口映射中没有列出目的地端口,则第一处理器向入站请求信号的发送方发送响应信号,或者省略入站请求信号而不唤醒第二处理器。
    • 5. 发明授权
    • Method for bonding two plates
    • 两块板的接合方法
    • US07908884B2
    • 2011-03-22
    • US12010405
    • 2008-01-24
    • Chien-Kuo LiuTung-Yuan YungKin-Fu LinSzu-Han Wu
    • Chien-Kuo LiuTung-Yuan YungKin-Fu LinSzu-Han Wu
    • C03C27/00C03C27/06C03C27/10
    • C03C8/24C03C27/044C03C27/06
    • Three bonding materials are provided on a first plate. The first bonding material is located between the second and third bonding materials. The first bonding material is thicker than the other bonding materials. A second plate is provided on the first bonding material. All of the plates and the bonding materials are heated to the softening point of the first bonding material. A load is exerted on the first bonding material to reduce the thickness of the first bonding material to that of the second and third bonding materials and transfer the load to the second and third bonding materials from the first bonding material. The temperature is raised to and kept at the crystallization point of the first bonding material. The temperature is raised to the wetting point of the second and third bonding materials.
    • 在第一板上设置三种接合材料。 第一接合材料位于第二和第三接合材料之间。 第一接合材料比其它接合材料厚。 在第一接合材料上设置第二板。 将所有的板和接合材料加热到第一粘合材料的软化点。 负载施加在第一接合材料上,以将第一接合材料的厚度减小到第二和第三接合材料的厚度,并将载荷从第一接合材料转移到第二和第三接合材料。 将温度升高并保持在第一接合材料的结晶点。 温度升至第二和第三粘合材料的润湿点。