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1. 发明授权

US08795786B2 Transparent conductive substrate 有权
标题翻译：透明导电基板
公开(公告)号：US08795786B2
公开(公告)日：2014-08-05
申请号：US13696879
申请日：2011-05-11
申请人： Syozou Kawazoe , Kenji Hashimoto
发明人： Syozou Kawazoe , Kenji Hashimoto
IPC分类号： H01L33/42
CPC分类号： C23C14/086 , C23C14/226
摘要： Disclosed are a transparent conductive substrate comprising a transparent conductive thin film layer and a transparent metal oxide layer disposed in this order on one or both surfaces of a substrate, the transparent metal oxide layer having numerous fine pores penetrating from the front surface to the rear surface thereof, and the pore diameters of the pores at the surface that is opposite to the surface that is in contact with the transparent conductive thin film layer being larger than those at the surface that is in contact with the transparent conductive thin film layer; and a method for producing the transparent conductive substrate, comprising forming the transparent metal oxide layer on the surface of the transparent conductive thin film layer or transparent conductive thin film layers by oblique deposition.
摘要翻译：公开了一种透明导电基板，其包括在基板的一个或两个表面上依次设置的透明导电薄膜层和透明金属氧化物层，所述透明金属氧化物层具有从前表面到后表面贯穿的许多细孔并且与与透明导电薄膜层接触的表面相反的表面处的孔的孔径大于与透明导电薄膜层接触的表面处的孔的孔径; 以及透明导电性基板的制造方法，其特征在于，在所述透明导电性薄膜层或透明导电性薄膜层的表面上形成透明金属氧化物层。

2. 发明申请

US20110291968A1 TRANSPARENT ELECTRICALLY CONDUCTIVE SUBSTRATE 审中-公开
标题翻译：透明电导电基板
公开(公告)号：US20110291968A1
公开(公告)日：2011-12-01
申请号：US13115440
申请日：2011-05-25
申请人： Syozou Kawazoe , Hidetomo Nishigaki , Takahiko Moriuchi
发明人： Syozou Kawazoe , Hidetomo Nishigaki , Takahiko Moriuchi
IPC分类号： H01L31/0224 , G06F3/041 , H05K13/00 , H05K1/00 , H05B3/02
CPC分类号： G06F3/045 , H01L31/022466 , H01L31/1884 , Y02E10/50 , Y10T29/49155
摘要： The present invention provides a transparent electrically conductive substrate having excellent adhesive strength between a transparent electrically conducting film such as ITO and a metal electrode and between a plastic sheet or film substrate and the transparent electrically conducting film, wherein the transparent plastic film substrate, the transparent electrically conducting film, and the metal electrode are formed in this order.The transparent electrically conductive substrate is provided with a transparent electrically conducting film formed on one or both surfaces of the transparent plastic substrate, and a metal electrode on each transparent electrically conducting film, wherein the transparent electrically conductive substrate has a delamination strength of 0.5 kg/cm or higher between the plastic substrate and each layer.
摘要翻译：本发明提供一种透明导电性基板，其具有透明导电膜如ITO和金属电极之间以及塑料片或薄膜基片与透明导电膜之间的粘合强度，其中透明塑料薄膜基材，透明导电膜，并且金属电极按此顺序形成。透明导电性基板具有在透明塑料基板的一面或两面上形成的透明导电膜和透明导电性膜上的金属电极，其中透明导电性基板的剥离强度为0.5kg / cm以上。

3. 发明申请

US20130056050A1 TRANSPARENT CONDUCTIVE SUBSTRATE 有权
标题翻译：透明导电基板
公开(公告)号：US20130056050A1
公开(公告)日：2013-03-07
申请号：US13696879
申请日：2011-05-11
申请人： Syozou Kawazoe , Kenji Hashimoto
发明人： Syozou Kawazoe , Kenji Hashimoto
IPC分类号： H05K1/09 , H05K1/11 , H01L31/0224 , B05D5/12 , H05B3/20
CPC分类号： C23C14/086 , C23C14/226
摘要： Disclosed are a transparent conductive substrate comprising a transparent conductive thin film layer and a transparent metal oxide layer disposed in this order on one or both surfaces of a substrate, the transparent metal oxide layer having numerous fine pores penetrating from the front surface to the rear surface thereof, and the pore diameters of the pores at the surface that is opposite to the surface that is in contact with the transparent conductive thin film layer being larger than those at the surface that is in contact with the transparent conductive thin film layer; and a method for producing the transparent conductive substrate, comprising forming the transparent metal oxide layer on the surface of the transparent conductive thin film layer or transparent conductive thin film layers by oblique deposition.
摘要翻译：公开了一种透明导电基板，其包括在基板的一个或两个表面上依次设置的透明导电薄膜层和透明金属氧化物层，所述透明金属氧化物层具有从前表面到后表面贯穿的许多细孔并且与与透明导电薄膜层接触的表面相反的表面处的孔的孔径大于与透明导电薄膜层接触的表面处的孔的孔径; 以及透明导电性基板的制造方法，其特征在于，在所述透明导电性薄膜层或透明导电性薄膜层的表面上形成透明金属氧化物层。

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