专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 外观设计

USD463064S1 Cigarette lighter 失效
公开(公告)号：USD463064S1
公开(公告)日：2002-09-17
申请号：US29150701
申请日：2001-11-27
申请人： Sung-Hak Hong
设计人： Sung-Hak Hong

2. 发明授权

US06297543B1 Chip scale package 失效
标题翻译：芯片级封装
公开(公告)号：US06297543B1
公开(公告)日：2001-10-02
申请号：US09455669
申请日：1999-12-07
申请人： Sung Hak Hong , Jong Tae Moon , Chang Jun Park , Yoon Hwa Choi
发明人： Sung Hak Hong , Jong Tae Moon , Chang Jun Park , Yoon Hwa Choi
IPC分类号： H01L23495
CPC分类号： H01L23/3114 , H01L24/45 , H01L24/48 , H01L2224/32014 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/00 , H01L2224/05599
摘要： The present invention discloses a chip scale package. According to this invention, a lead frame 130 is bonded with an adhesive 140 to a bottom face of a semiconductor chip 110. An inner lead 131 of the lead frame 130 is connected to a pad 111 of the semiconductor chip with a metal wire 120, and thickness of the inner lead 131 is equal to an original thickness of the lead frame 130. An outer lead 132 of the lead frame 130 is formed by partially etching a bottom face of the lead frame 130. The entire resultant is encapsulated with a molding compound 100 such that the outer lead 132 is exposed therefrom, especially there is formed a downward protruding portion 101 at the molding compound 100 in the lower inner lead portion 131. This protruding portion raises the margin controlling the bonding height during the wire-bonding process such that the metal wire 120 is not exposed from the molding compound 100. Furthermore, the outer leads 134 at both sides where no solder balls are mounted on, are exposed from the molding compound 100. The outer leads 132 at both sides being exposed from the molding compound 100 act for dissipating outwardly heat that is transmitted from the semiconductor chip 110 to the lead frame 130. A solder ball 150 is mounted at the inside of the outer lead 132 exposed from the molding compound 100.
摘要翻译：本发明公开了一种芯片级封装。根据本发明，引线框架130用粘合剂140粘合到半导体芯片110的底面。引线框架130的内引线131通过金属线120连接到半导体芯片的焊盘111，并且内引线131的厚度等于引线框架130的原始厚度。引线框架130的外引线132通过部分蚀刻引线框架130的底面而形成。整个结合物被封装成型化合物100，使得外引线132暴露于其中，特别是在下内引线部分131中的模塑料100处形成向下突出部分101.该突出部分在引线接合过程中增加控制接合高度的边缘使得金属线120不会从模塑料100暴露出来。此外，没有焊球的两侧的外引线134从模塑料100露出。外部的I 从模制化合物100露出的两侧的阴极132用于散发从半导体芯片110传递到引线框架130的向外的热。焊球150安装在从模塑料暴露的外引线132的内部 100。

3. 发明申请

US20130147250A1 WALK-IN APPARATUS FOR VEHICLE SEAT 有权
标题翻译：车用座便器
公开(公告)号：US20130147250A1
公开(公告)日：2013-06-13
申请号：US13527045
申请日：2012-06-19
申请人： Eun Sue KIM , Hyeong Jun KIM , Sung Hak HONG
发明人： Eun Sue KIM , Hyeong Jun KIM , Sung Hak HONG
IPC分类号： B60N2/06 , B60N2/20
CPC分类号： B60N2/12
摘要： A walk-in apparatus for vehicle seats can be constructed of parts required to realize the walk-in operation, thus reducing the production cost and the weight of the apparatus. Moreover, apparatus can reduce the volume of the entire apparatus so that it can be easily applied even to a small-sized seat, for example, that of a small vehicle.
摘要翻译：用于车辆座椅的步入式装置可以由实现步入操作所需的部件构成，从而降低了装置的制造成本和重量。此外，装置可以减小整个装置的体积，使得其可以容易地应用于小型座椅，例如小型车辆的座椅。

4. 发明申请

US20100127545A1 Double Folding Seat for Vehicle 有权
标题翻译：车辆双折叠座椅
公开(公告)号：US20100127545A1
公开(公告)日：2010-05-27
申请号：US12548190
申请日：2009-08-26
申请人： Chan Ho JEONG , Young Dong Kim , Sung Hak Hong
发明人： Chan Ho JEONG , Young Dong Kim , Sung Hak Hong
IPC分类号： B60N2/10
CPC分类号： B60N2/10 , B60N2/01516 , B60N2/206
摘要： A double folding seat for a vehicle may include a stationary bracket, coupled to the seatback frame and to the cushion frame, wherein the recliner bracket is coupled to the one end of the stationary bracket, a link unit elastically installed on the stationary bracket and configured to be selectively coupled to the recliner bracket and transmit a rotating force of the recliner bracket to a latch cam installed to the cushion frame, a stopper fixedly installed on the leg assembly which is connected to a vehicle body, a hinge member rotatably mounted on the cushion frame and rotated by the stopper, and an actuating wire connecting the hinge member and the link unit and displacing the link unit by a rotation force of the hinge member to a position where the link unit cooperates with the recliner bracket when the cushion frame moves backwards to the final position thereof.
摘要翻译：一种用于车辆的双折叠座椅可以包括固定托架，其联接到座椅靠背框架和缓冲框架，其中，躺椅支架联接到固定支架的一端，弹性地安装在固定支架上并构成的连杆单元选择性地联接到倾斜器支架并将倾斜器支架的旋转力传递到安装到缓冲框架上的闩锁凸轮;固定地安装在腿部组件上的止动件，其连接到车身;铰链构件，可旋转地安装在缓冲框架并通过止动件旋转;以及致动线，其连接铰链构件和连杆单元，并且通过铰链构件的旋转力将连杆单元移动到当缓冲框架移动时连杆单元与倾斜架支架配合的位置向后到其最终位置。

5. 外观设计

USD469920S1 Combination cigar lighter and cutter 失效
公开(公告)号：USD469920S1
公开(公告)日：2003-02-04
申请号：US29163019
申请日：2002-06-25
申请人： Sung-Hak Hong
设计人： Sung-Hak Hong

6. 发明授权

US09108536B2 Walk-in apparatus for vehicle seat 有权
标题翻译：汽车座椅的步入式装置
公开(公告)号：US09108536B2
公开(公告)日：2015-08-18
申请号：US13527045
申请日：2012-06-19
申请人： Eun Sue Kim , Hyeong Jun Kim , Sung Hak Hong
发明人： Eun Sue Kim , Hyeong Jun Kim , Sung Hak Hong
IPC分类号： B60N2/02 , B60N2/12
CPC分类号： B60N2/12
摘要： A walk-in apparatus for vehicle seats can be constructed of parts required to realize the walk-in operation, thus reducing the production cost and the weight of the apparatus. Moreover, apparatus can reduce the volume of the entire apparatus so that it can be easily applied even to a small-sized seat, for example, that of a small vehicle.
摘要翻译：用于车辆座椅的步入式装置可以由实现步入操作所需的部件构成，从而降低了装置的制造成本和重量。此外，装置可以减小整个装置的体积，使得其可以容易地应用于小型座椅，例如小型车辆的座椅。

7. 发明授权

US07891720B2 Double folding seat for vehicle 有权
标题翻译：车载双折叠座椅
公开(公告)号：US07891720B2
公开(公告)日：2011-02-22
申请号：US12548190
申请日：2009-08-26
申请人： Chan Ho Jeong , Young Dong Kim , Sung Hak Hong
发明人： Chan Ho Jeong , Young Dong Kim , Sung Hak Hong
IPC分类号： B60N2/12
CPC分类号： B60N2/10 , B60N2/01516 , B60N2/206
摘要： A double folding seat for a vehicle may include a stationary bracket, coupled to the seatback frame and to the cushion frame, wherein the recliner bracket is coupled to the one end of the stationary bracket, a link unit elastically installed on the stationary bracket and configured to be selectively coupled to the recliner bracket and transmit a rotating force of the recliner bracket to a latch cam installed to the cushion frame, a stopper fixedly installed on the leg assembly which is connected to a vehicle body, a hinge member rotatably mounted on the cushion frame and rotated by the stopper, and an actuating wire connecting the hinge member and the link unit and displacing the link unit by a rotation force of the hinge member to a position where the link unit cooperates with the recliner bracket when the cushion frame moves backwards to the final position thereof.
摘要翻译：一种用于车辆的双折叠座椅可以包括固定托架，其联接到座椅靠背框架和缓冲框架，其中，躺椅支架联接到固定支架的一端，弹性地安装在固定支架上并构成的连杆单元选择性地联接到倾斜器支架并将倾斜器支架的旋转力传递到安装到缓冲框架上的闩锁凸轮;固定地安装在腿部组件上的止动件，其连接到车身;铰链构件，可旋转地安装在缓冲框架并通过止动件旋转;以及致动线，其连接铰链构件和连杆单元，并且通过铰链构件的旋转力将连杆单元移动到当缓冲框架移动时连杆单元与倾斜架支架配合的位置向后到其最终位置。

8. 发明授权

US06522020B2 Wafer-level package 有权
标题翻译：晶圆级封装
公开(公告)号：US06522020B2
公开(公告)日：2003-02-18
申请号：US09735640
申请日：2000-12-14
申请人： Sung Hak Hong
发明人： Sung Hak Hong
IPC分类号： H01L2348
CPC分类号： H01L23/4951 , H01L23/3107 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/4911 , H01L2224/73215 , H01L2924/00014 , H01L2924/00 , H01L2224/05599
摘要： Disclosed is a wafer-level package. The disclosed wafer-level package includes a semiconductor chip provided at a top surface thereof with a plurality of bond pads, a substrate bonded to the top surface of the semiconductor chip and provided with recess portions at each of opposite edge portions thereof not facing the bond pads while being provided with metal lines each extending to a portion of the substrate, arranged adjacent to an associated one of the bond pads, to a bottom surface of an associated one of the recess portions, metal wires electrically connecting the bond pads to the metal lines, respectively, a lead frame having inner leads each firmly fitted in an associated one of the recess portions of the substrate and electrically connected to an associated one of the metal lines by a solder, and outer leads formed to have a step structure, and an encapsulation material completely encapsulating the top surface of the semiconductor chip including the substrate and the metal wires while allowing only the outer leads of the lead frame to be exposed.
摘要翻译：公开了一种晶圆级封装。所公开的晶片级封装包括在其顶表面处设置有多个接合焊盘的半导体芯片，基板接合到半导体芯片的顶表面，并且在其每个相对边缘部分处设置有凹槽部分，其不面向键衬垫，同时设置有金属线，每条金属线延伸到邻近相关联的一个接合焊盘的衬底的一部分到相关联的一个凹部的底表面，金属线将接合焊盘电连接到金属线分别具有引线框架，引线框架具有各自牢固地嵌合在基板的相关联的一个凹部中的内部引线，并且通过焊料与相关联的一个金属线电连接，并且外部引线形成为具有台阶结构，以及封装材料完全封装包括基板和金属线的半导体芯片的顶表面，同时只允许外引线的引线框架被暴露。

9. 外观设计

USD468481S1 Cigarette lighter 失效
公开(公告)号：USD468481S1
公开(公告)日：2003-01-07
申请号：US29158257
申请日：2002-04-01
申请人： Sung-Hak Hong
设计人： Sung-Hak Hong

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式