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1. 发明授权

US09313900B2 Method for manufacturing a double-sided printed circuit board 有权
标题翻译：双面印刷电路板的制造方法
公开(公告)号：US09313900B2
公开(公告)日：2016-04-12
申请号：US13638716
申请日：2010-04-02
申请人： Kwang Choon Chung , Young-Koo Han , Myung-Bong Yoo , Nam-Boo Cho , Young-Ho Han , Kyong-Min Lee , Kwang-Baek Yoon , Hee-Yong Ahn , Su-Han Kim
发明人： Kwang Choon Chung , Young-Koo Han , Myung-Bong Yoo , Nam-Boo Cho , Young-Ho Han , Kyong-Min Lee , Kwang-Baek Yoon , Hee-Yong Ahn , Su-Han Kim
IPC分类号： H05K3/40 , H05K3/42 , H05K3/24 , H05K3/00 , H05K3/06 , H05K3/10 , H05K3/12
CPC分类号： H05K3/427 , H05K3/0094 , H05K3/06 , H05K3/105 , H05K3/12 , H05K3/246 , H05K2203/121 , Y10T29/49155
摘要： Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.
摘要翻译：公开了一种通过印刷导电浆料制造具有电路图案的双面印刷电路板（PCB）的方法。根据本发明的方法，可以形成精确且高导电性的电路图案，并且可以减少原材料和简化工艺。此外，由于导电膏的印刷，即使导电层弯曲或暴露于热或物理冲击，也可以防止短路。

2. 发明申请

US20130056250A1 Method for Manufacturing a Double-Sided Printed Circuit Board 有权
标题翻译：制造双面印刷电路板的方法
公开(公告)号：US20130056250A1
公开(公告)日：2013-03-07
申请号：US13638716
申请日：2010-04-02
申请人： Kwang Choon Chung , Young-Koo Han , Myung-Bong Yoo , Nam-Boo Cho , Young-Ho Han , Kyong-Min Lee , Kwang-Baek Yoon , Hee-Yong Ahn , Su-Han Kim
发明人： Kwang Choon Chung , Young-Koo Han , Myung-Bong Yoo , Nam-Boo Cho , Young-Ho Han , Kyong-Min Lee , Kwang-Baek Yoon , Hee-Yong Ahn , Su-Han Kim
IPC分类号： H05K1/03 , H05K1/11 , H05K3/10 , H05K1/09
CPC分类号： H05K3/427 , H05K3/0094 , H05K3/06 , H05K3/105 , H05K3/12 , H05K3/246 , H05K2203/121 , Y10T29/49155
摘要： Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.
摘要翻译：公开了一种通过印刷导电浆料制造具有电路图案的双面印刷电路板（PCB）的方法。根据本发明的方法，可以形成精确且高导电性的电路图案，并且可以减少原材料和简化工艺。此外，由于导电膏的印刷，即使当导电层弯曲或暴露于热或物理冲击时也可以防止短路。

3. 发明授权

US08282860B2 Process for preparation of silver nanoparticles, and the compositions of silver ink containing the same 有权
标题翻译：制备银纳米颗粒的方法，以及含有它们的银墨的组合物
公开(公告)号：US08282860B2
公开(公告)日：2012-10-09
申请号：US12376893
申请日：2007-08-02
申请人： Kwang-Choon Chung , Hyun-Nam Cho , Byung Hun Kim , Su Han Kim , Myung Bong Yoo , Nam Boo Cho , Yi Sup Han
发明人： Kwang-Choon Chung , Hyun-Nam Cho , Byung Hun Kim , Su Han Kim , Myung Bong Yoo , Nam Boo Cho , Yi Sup Han
IPC分类号： H01B1/00
CPC分类号： C09D11/322 , B22F9/24 , B22F2998/00 , B82Y30/00 , C09D11/52 , B22F1/0018 , B22F9/30
摘要： The present invention relates to a process for preparation of silver nanoparticles and the compositions of silver ink containing the same. The present invention can prepare the silver nanoparticles with various shapes through a simple preparation process, improve the selectivity of the size of the silver nanoparticles, fire the silver nanoparticles even at a low temperature of 150° C. or less during a short time, provide the ink compositions capable of forming the coating or the fine pattern showing the high conductivity, and provide the ink compositions capable of being applied to the reflective film material, the electromagnetic wave shield, and the antimicrobial agent, etc.
摘要翻译：本发明涉及一种制备银纳米颗粒的方法和含有该纳米颗粒的银墨的组合物。本发明可以通过简单的制备方法制备具有各种形状的银纳米颗粒，提高银纳米颗粒尺寸的选择性，即使在短时间内在150℃或更低的低温下也能使银纳米颗粒发火，提供能够形成涂层的油墨组合物或显示高导电性的精细图案，并且提供能够应用于反射膜材料，电磁波屏蔽和抗微生物剂等的油墨组合物。

4. 发明申请

US20130038401A1 RADAR SYSTEM INCLUDING BALUN 审中-公开
标题翻译：雷达系统包括巴伦
公开(公告)号：US20130038401A1
公开(公告)日：2013-02-14
申请号：US13569615
申请日：2012-08-08
申请人： Su Han KIM , Hyung Suk Ham
发明人： Su Han KIM , Hyung Suk Ham
IPC分类号： H03H7/42
CPC分类号： H01P5/10
摘要： A balun includes a first port connected with a port connection part, a second port connected with the port connection part at a point separated by λ0/4 from a connection point of the first port and the port connection part, and a third port connected with the port connection part at a point separated by λ0/2 from a connection point of the second port and the port connection part. A maximum width of the second port and the third port are larger than a width at a region connected with the port connection part and larger than a width at a distal end, respectively. And a maximum distance between the second port and the third port is larger than a distance between the connection points with the port connection part and larger than a distance between the distal ends.
摘要翻译：平衡 - 不平衡转换器包括与端口连接部连接的第一端口，与端口连接部分连接的端口连接部分与第一端口和端口连接部分的连接点分开的距离为λ0/ 4的第二端口，以及与端口连接部分连接的第三端口在与第二端口的连接点和端口连接部分分开λ0/ 2的点处的端口连接部分。第二端口和第三端口的最大宽度分别大于与端口连接部分连接的区域处的宽度，并且大于远端的宽度。并且第二端口和第三端口之间的最大距离大于与端口连接部分的连接点之间的距离，并且大于远端之间的距离。

5. 发明授权

US09107317B2 Method for fabricating blackened conductive patterns 有权
标题翻译：黑色导电图案的制造方法
公开(公告)号：US09107317B2
公开(公告)日：2015-08-11
申请号：US12747331
申请日：2008-12-10
申请人： Kwang Choon Chung , Ji Hoon Yoo , Byung Hun Kim , Su Han Kim
发明人： Kwang Choon Chung , Ji Hoon Yoo , Byung Hun Kim , Su Han Kim
IPC分类号： B05D3/06 , B05D5/12 , B05D5/06 , H05K3/12 , H05K3/00 , C23C18/18 , C23C18/20 , C23C18/16 , H05K1/09 , H05K3/10 , H05K3/24
CPC分类号： H05K3/1258 , C23C18/165 , C23C18/1868 , C23C18/204 , H05K1/092 , H05K1/097 , H05K3/0026 , H05K3/107 , H05K3/245 , H05K2201/0112 , H05K2201/0376 , H05K2201/09036 , H05K2203/0568 , H05K2203/072 , H05K2203/0723 , H05K2203/1126
摘要： The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate.
摘要翻译：本发明涉及一种制造黑化导电图案的方法，其包括（i）在非导电基底上形成抗蚀剂层; （ii）使用激光束在抗蚀剂层中形成精细图案凹槽; （iii）在精细图案槽中形成含有导电材料和变黑材料的混合层; 和（iv）去除残留在非导电基底上的抗蚀剂层。

6. 发明申请

US20100189901A1 PROCESS FOR PREPARATION OF SILVER NANOPARTICLES, AND THE COMPOSITIONS OF SILVER INK CONTAINING THE SAME 有权
标题翻译：制备银纳米粒子的方法以及含有它们的银料的组合物
公开(公告)号：US20100189901A1
公开(公告)日：2010-07-29
申请号：US12376893
申请日：2007-08-02
申请人： Kwang-Choon Chung , Hyun-Nam Cho , Byung Hun Kim , Su Han Kim , Myung Bong Yoo , Nam Boo Cho , Yi Sup Han
发明人： Kwang-Choon Chung , Hyun-Nam Cho , Byung Hun Kim , Su Han Kim , Myung Bong Yoo , Nam Boo Cho , Yi Sup Han
IPC分类号： B05D5/00 , C07F1/10 , C09D11/00 , C08K5/205 , C08K5/16 , B05D3/02 , B05D3/06
CPC分类号： C09D11/322 , B22F9/24 , B22F2998/00 , B82Y30/00 , C09D11/52 , B22F1/0018 , B22F9/30
摘要： The present invention relates to a process for preparation of silver complex compound and the compositions of silver ink containing the same. The present invention includes a) preparing silver complex compound with special structure by reacting silver compound with at least one or two mixtures selected from ammonium carbamate compound, ammonium carbonate compound or ammonium bicarbonate compound and b) preparing silver nano particles by reacting the silver complex compound with reducer or reducing or pyrolyzing the silver complex compound by applying heat thereto. The preparing method according to the present invention can prepare the silver nano practical with various shapes through a simple preparation process, improve the selectivity of the size of the silver complex compound, fire the silver complex compound even when it is fired at a low temperature of 150° C. or less during a short time, provide the ink compositions capable of forming the coating or the fine pattern showing the high conductivity while facilitating the thickness control of the coating, and provide the ink compositions capable of being applied to the reflective film material, the electromagnetic wave shield, and the antimicrobial agent, etc.
摘要翻译：本发明涉及一种银络合物的制备方法和含有它们的银墨的组合物。本发明包括：a）通过使银化合物与选自氨基甲酸铵化合物，碳酸铵化合物或碳酸氢铵化合物的至少一种或两种混合物反应制备具有特殊结构的银络合物，和b）通过使银络合物通过对其进行加热而还原或还原或热解银络合物。根据本发明的制备方法可以通过简单的制备方法制备各种形状的银纳米颗粒，提高银络合物的尺寸选择性，即使在低温下在短时间内为150℃以下，提供能够形成涂层的油墨组合物或显示高导电性的精细图案，同时有利于涂层的厚度控制，并提供能够应用于反射膜的油墨组合物材料，电磁波屏蔽和抗菌剂等

7. 发明申请

US20110003086A1 Method for Fabricating Blackened Conductive Patterns 有权
标题翻译：制造黑色导电图案的方法
公开(公告)号：US20110003086A1
公开(公告)日：2011-01-06
申请号：US12747331
申请日：2008-12-10
申请人： Kwang Choon Chung , Ji Hoon Yoo , Byung Hun Kim , Su Han Kim
发明人： Kwang Choon Chung , Ji Hoon Yoo , Byung Hun Kim , Su Han Kim
IPC分类号： B05D3/06
CPC分类号： H05K3/1258 , C23C18/165 , C23C18/1868 , C23C18/204 , H05K1/092 , H05K1/097 , H05K3/0026 , H05K3/107 , H05K3/245 , H05K2201/0112 , H05K2201/0376 , H05K2201/09036 , H05K2203/0568 , H05K2203/072 , H05K2203/0723 , H05K2203/1126
摘要： The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate.
摘要翻译：本发明涉及一种制造黑化导电图案的方法，其包括（i）在非导电基底上形成抗蚀剂层; （ii）使用激光束在抗蚀剂层中形成精细图案凹槽; （iii）在精细图案槽中形成含有导电材料和变黑材料的混合层; 和（iv）去除残留在非导电基底上的抗蚀剂层。

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