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1. 发明申请

US20110187681A1 APPARATUS FOR SCREEN LOCATION CONTROL OF FLEXIBLE DISPLAY 有权
标题翻译：用于屏幕位置控制柔性显示的装置
公开(公告)号：US20110187681A1
公开(公告)日：2011-08-04
申请号：US12852675
申请日：2010-08-09
申请人： Jae Mong KIM , Min Seok PARK , Kwang Hee LEE , Su Young LEE , Yong Seong JEONG , Won Sik CHOI , Jun HUR
发明人： Jae Mong KIM , Min Seok PARK , Kwang Hee LEE , Su Young LEE , Yong Seong JEONG , Won Sik CHOI , Jun HUR
IPC分类号： G09G5/00
CPC分类号： G06F3/0414 , G06F1/1652 , G06F3/0488 , G06F3/147 , G06F2200/1637 , G09G2340/0464 , G09G2354/00 , G09G2380/02
摘要： The apparatus to control an image output position of a flexible display moves a position of an image output area in a screen area when the flexible display is rotated. The apparatus may include: a bending measurement unit to measure a bending degree of the flexible display; a rotation measurement unit to measure a rotation degree and a rotation direction of the flexible display; and a controller to output an image at an image output area, and move a position of the image output area.
摘要翻译：控制柔性显示器的图像输出位置的装置在柔性显示器旋转时移动屏幕区域中的图像输出区域的位置。该装置可以包括：弯曲测量单元，用于测量柔性显示器的弯曲度; 旋转测量单元，用于测量柔性显示器的旋转度和旋转方向; 以及控制器，用于在图像输出区域输出图像，并移动图像输出区域的位置。

2. 发明申请

US20110141318A1 IMAGE SENSOR MODULES, METHODS OF MANUFACTURING THE SAME, AND IMAGE PROCESSING SYSTEMS INCLUDING THE IMAGE SENSOR MODULES 有权
标题翻译：图像传感器模块，其制造方法和包括图像传感器模块的图像处理系统
公开(公告)号：US20110141318A1
公开(公告)日：2011-06-16
申请号：US12955287
申请日：2010-11-29
申请人： Yun Tae Lee , Joon Seo Yim , Je Suk Lee , Jae Yong Park , Jun-Woo Park , Su-Young Lee
发明人： Yun Tae Lee , Joon Seo Yim , Je Suk Lee , Jae Yong Park , Jun-Woo Park , Su-Young Lee
IPC分类号： H04N5/262 , H04N5/228
CPC分类号： H04N5/23296 , H01L27/14618 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/12044 , H04N5/2257 , H04N5/3454 , H04N5/374 , H04N5/378 , H04N9/045 , H01L2924/00014 , H01L2924/00
摘要： An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.
摘要翻译：提供图像传感器模块。图像传感器模块包括印刷电路板（PCB），设置在PCB的第一平面上并电连接到PCB的图像传感器芯片，以及设置在PCB的第一平面上并且电连接到 PCB。图像信号处理芯片的纵横比比图像传感器芯片的纵横比至少大两倍。在图像传感器芯片中实现的金属线的最小特征尺寸比图像信号处理芯片中实施的金属线的最小特征尺寸至少大1.5倍。

3. 发明授权

US10257426B2 Image sensor modules, methods of manufacturing the same, and image processing systems including the image sensor modules 有权
公开(公告)号：US10257426B2
公开(公告)日：2019-04-09
申请号：US14994755
申请日：2016-01-13
申请人： Yun Tae Lee , Joon Seo Yim , Je Suk Lee , Jae Yong Park , Jun-Woo Park , Su-Young Lee
发明人： Yun Tae Lee , Joon Seo Yim , Je Suk Lee , Jae Yong Park , Jun-Woo Park , Su-Young Lee
IPC分类号： H04N5/232 , H01L27/146 , H04N5/225 , H04N5/345 , H04N9/04 , H04N5/374 , H04N5/378 , H04N5/369
摘要： An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.

4. 发明授权

US09519220B2 Method, photolithography method, and method of manufacturing a semiconductor device using a pellicle film 有权
标题翻译：方法，光刻法和使用防护薄膜的半导体器件的制造方法
公开(公告)号：US09519220B2
公开(公告)日：2016-12-13
申请号：US14706980
申请日：2015-05-08
申请人： Su-Young Lee , Tae-Geun Kim , Jong-Gul Doh
发明人： Su-Young Lee , Tae-Geun Kim , Jong-Gul Doh
IPC分类号： H01L21/00 , G03F7/20
CPC分类号： G03F7/2004 , G03F1/62
摘要： A pellicle for an EUV lithography may include a pellicle film, a supporting structure and a handling block. The pellicle film may have a first surface for orienting opposite to a mask, and a second surface opposite to the first surface and for orienting toward the mask. The pellicle film may allow the EUV, which may pass through the mask, to penetrate the pellicle film. The supporting structure may be arranged on the second surface of the pellicle film to support the pellicle film. The handling block may be arranged on the first surface of the pellicle film. The handling block may have an opening configured to expose the pellicle film. Thus, the pellicle may be handled using the thick handling block, not the thin pellicle film, so that the thin pellicle film may not be damaged. The pellicle may protect the mask from byproducts generated in the EUV lithography process so that the mask may not be contaminated.
摘要翻译：用于EUV光刻的防护薄膜组件可以包括防护薄膜，支撑结构和处理块。防护薄膜可以具有用于与掩模相对定向的第一表面和与第一表面相对的用于朝向掩模定向的第二表面。防护薄膜可以允许穿过掩模的EUV穿透防护薄膜。支撑结构可以布置在防护薄膜的第二表面上以支撑防护薄膜。处理块可以布置在防护薄膜的第一表面上。处理块可以具有用于暴露防护薄膜的开口。因此，可以使用厚的处理块而不是薄的防护薄膜来处理防护薄膜，使得薄的防护薄膜不会被损坏。防护薄膜组件可以保护面罩免于在EUV光刻工艺中产生的副产物，使得面罩不被污染。

5. 发明申请

US20160198095A1 IMAGE SENSOR MODULES, METHODS OF MANUFACTURING THE SAME, AND IMAGE PROCESSING SYSTEMS INCLUDING THE IMAGE SENSOR MODULES 审中-公开
标题翻译：图像传感器模块，其制造方法和包括图像传感器模块的图像处理系统
公开(公告)号：US20160198095A1
公开(公告)日：2016-07-07
申请号：US14994755
申请日：2016-01-13
申请人： Yun Tae LEE , Joon Seo YIM , Je Suk LEE , Jae Yong PARK , Jun-Woo PARK , Su-Young LEE
发明人： Yun Tae LEE , Joon Seo YIM , Je Suk LEE , Jae Yong PARK , Jun-Woo PARK , Su-Young LEE
IPC分类号： H04N5/232 , H04N5/374 , H04N5/378 , H04N5/225
CPC分类号： H04N5/23296 , H01L27/14618 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/12044 , H04N5/2257 , H04N5/3454 , H04N5/374 , H04N5/378 , H04N5/379 , H04N9/045 , H01L2924/00014 , H01L2924/00
摘要： An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.
摘要翻译：提供图像传感器模块。图像传感器模块包括印刷电路板（PCB），设置在PCB的第一平面上并电连接到PCB的图像传感器芯片，以及设置在PCB的第一平面上并且电连接到 PCB。图像信号处理芯片的纵横比比图像传感器芯片的纵横比至少大两倍。在图像传感器芯片中实现的金属线的最小特征尺寸比图像信号处理芯片中实施的金属线的最小特征尺寸至少大1.5倍。

6. 发明申请

US20110035936A1 SEMICONDUCTOR CHIP ATTACHING APPARATUS AND METHOD 有权
标题翻译：半导体芯片连接装置和方法
公开(公告)号：US20110035936A1
公开(公告)日：2011-02-17
申请号：US12772561
申请日：2010-05-03
申请人： Su-Young Lee
发明人： Su-Young Lee
IPC分类号： B23P19/00
CPC分类号： H01L24/75 , H01L2924/14 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191 , H01L2924/00
摘要： Provided are a semiconductor chip attaching apparatus and a semiconductor chip attaching method. The semiconductor chip attaching apparatus includes a collet body comprising a pick-up pad and a pad support and a collet plate on the collet body, the collet plate having a central portion. A lower surface of the edge portion contacts an upper surface of the pad support. An edge portion of the lower surface is spaced apart from the upper surface of the pad support. The apparatus further includes a first pipe extending through the collet plate and the collet body. The collet plate includes a second pipe in the edge portion.
摘要翻译：提供半导体芯片附着装置和半导体芯片附接方法。半导体芯片安装装置包括夹头本体，该夹头本体包括拾取垫和垫支撑件以及夹头主体上的夹头板，该夹头板具有中心部分。边缘部分的下表面接触垫支撑件的上表面。下表面的边缘部分与垫支撑件的上表面间隔开。该装置还包括延伸穿过夹头板和夹头体的第一管。夹头板包括边缘部分中的第二管。

7. 发明授权

US08307543B2 Semiconductor chip attaching apparatus 有权
标题翻译：半导体芯片连接装置
公开(公告)号：US08307543B2
公开(公告)日：2012-11-13
申请号：US12772561
申请日：2010-05-03
申请人： Su-Young Lee
发明人： Su-Young Lee
IPC分类号： B23P19/00
CPC分类号： H01L24/75 , H01L2924/14 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191 , H01L2924/00
摘要： Provided are a semiconductor chip attaching apparatus and a semiconductor chip attaching method. The semiconductor chip attaching apparatus includes a collet body comprising a pick-up pad and a pad support and a collet plate on the collet body, the collet plate having a central portion. A lower surface of the edge portion contacts an upper surface of the pad support. An edge portion of the lower surface is spaced apart from the upper surface of the pad support. The apparatus further includes a first pipe extending through the collet plate and the collet body. The collet plate includes a second pipe in the edge portion.
摘要翻译：提供半导体芯片附着装置和半导体芯片附接方法。半导体芯片安装装置包括夹头本体，该夹头本体包括拾取垫和垫支撑件以及夹头主体上的夹头板，该夹头板具有中心部分。边缘部分的下表面接触垫支撑件的上表面。下表面的边缘部分与垫支撑件的上表面间隔开。该装置还包括延伸穿过夹头板和夹头体的第一管。夹头板包括边缘部分中的第二管。

8. 发明申请

US20090039648A1 WATER SUPPLY HOSE CONNECTOR FOR WASHING MACHINE 审中-公开
标题翻译：洗衣机用水软管接头
公开(公告)号：US20090039648A1
公开(公告)日：2009-02-12
申请号：US12187825
申请日：2008-08-07
申请人： Su-Young LEE
发明人： Su-Young LEE
IPC分类号： F16L41/00
CPC分类号： D06F39/088 , F16L37/48 , Y02B40/56
摘要： A water supply hose connector for a washing machine comprises: a body portion having a screw thread on an inner surface thereof so as to be directly coupled to a tap having a screw thread; a hose connection portion formed below the body portion, and connected to a water supply hose that supplies water to a washing machine; a flange portion formed between the body portion and the hose connection portion, and outwardly protruding than the body portion; and a sealing member mounted in the body portion. Accordingly, bolts, etc. need not be used to connect the water supply hose connector to the tap, and efforts to concentrically form the water supply hose connector with the tap are not required. Accordingly, not only a user, but also an engineer can conveniently install the water supply hose connector for a washing machine.
摘要翻译：一种用于洗衣机的供水软管连接器包括：主体部分，其内表面上具有螺纹，以便直接联接到具有螺纹的龙头; 软管连接部分，形成在主体部分下方，并连接到向洗衣机供水的供水软管; 形成在主体部分和软管连接部分之间并且比主体部分向外突出的凸缘部分; 以及安装在主体部分中的密封构件。因此，不需要使用螺栓等来将供水软管连接器连接到水龙头，并且不需要用水龙头同心地形成供水软管连接器。因此，不仅用户，而且工程师也可以方便地安装用于洗衣机的供水软管连接器。

9. 发明申请

US20160048079A1 METHOD, PHOTOLITHOGRAPHY METHOD, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING A PELLICLE FILM 有权
标题翻译：方法，光刻方法和使用薄膜形成半导体器件的方法
公开(公告)号：US20160048079A1
公开(公告)日：2016-02-18
申请号：US14706980
申请日：2015-05-08
申请人： Su-Young LEE , Tae-Geun KIM , Jong-Gul DOH
发明人： Su-Young LEE , Tae-Geun KIM , Jong-Gul DOH
IPC分类号： G03F7/20 , H01L21/78
CPC分类号： G03F7/2004 , G03F1/62
摘要： A pellicle for an EUV lithography may include a pellicle film, a supporting structure and a handling block. The pellicle film may have a first surface for orienting opposite to a mask, and a second surface opposite to the first surface and for orienting toward the mask. The pellicle film may allow the EUV, which may pass through the mask, to penetrate the pellicle film. The supporting structure may be arranged on the second surface of the pellicle film to support the pellicle film. The handling block may be arranged on the first surface of the pellicle film. The handling block may have an opening configured to expose the pellicle film. Thus, the pellicle may be handled using the thick handling block, not the thin pellicle film, so that the thin pellicle film may not be damaged. The pellicle may protect the mask from byproducts generated in the EUV lithography process so that the mask may not be contaminated.
摘要翻译：用于EUV光刻的防护薄膜组件可以包括防护薄膜，支撑结构和处理块。防护薄膜可以具有用于与掩模相对定向的第一表面和与第一表面相对的用于朝向掩模定向的第二表面。防护薄膜可以允许穿过掩模的EUV穿透防护薄膜。支撑结构可以布置在防护薄膜的第二表面上以支撑防护薄膜。处理块可以布置在防护薄膜的第一表面上。处理块可以具有用于暴露防护薄膜的开口。因此，可以使用厚的处理块而不是薄的防护薄膜来处理防护薄膜，使得薄的防护薄膜不会被损坏。防护薄膜组件可以保护面罩免于在EUV光刻工艺中产生的副产物，使得面罩不被污染。

10. 发明授权

US09257467B2 Image sensor modules, methods of manufacturing the same, and image processing systems including the image sensor modules 有权
标题翻译：图像传感器模块，其制造方法以及包括图像传感器模块的图像处理系统
公开(公告)号：US09257467B2
公开(公告)日：2016-02-09
申请号：US12955287
申请日：2010-11-29
申请人： Yun Tae Lee , Joon Seo Yim , Je Suk Lee , Jae Yong Park , Jun-Woo Park , Su-Young Lee
发明人： Yun Tae Lee , Joon Seo Yim , Je Suk Lee , Jae Yong Park , Jun-Woo Park , Su-Young Lee
IPC分类号： H01L27/146 , H04N5/225 , H04N5/345 , H04N9/04
CPC分类号： H04N5/23296 , H01L27/14618 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/12044 , H04N5/2257 , H04N5/3454 , H04N5/374 , H04N5/378 , H04N9/045 , H01L2924/00014 , H01L2924/00
摘要： An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.
摘要翻译：提供图像传感器模块。图像传感器模块包括印刷电路板（PCB），设置在PCB的第一平面上并电连接到PCB的图像传感器芯片，以及设置在PCB的第一平面上并且电连接到 PCB。图像信号处理芯片的纵横比比图像传感器芯片的纵横比至少大两倍。在图像传感器芯片中实现的金属线的最小特征尺寸比图像信号处理芯片中实施的金属线的最小特征尺寸至少大1.5倍。

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