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1. 发明授权

US07026548B2 Moisture-resistant electronic device package and methods of assembly 有权
标题翻译：防潮电子器件封装及组装方法
公开(公告)号：US07026548B2
公开(公告)日：2006-04-11
申请号：US11180493
申请日：2005-07-13
申请人： Todd O. Bolken , Cary J. Baerlocher , Steven W. Heppler , Chad A. Cobbley
发明人： Todd O. Bolken , Cary J. Baerlocher , Steven W. Heppler , Chad A. Cobbley
IPC分类号： H01L23/28
CPC分类号： H01L23/28 , B33Y80/00 , H01L21/4803 , H01L21/481 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/48 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L27/14683 , H01L2224/0401 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/00011 , H01L2224/45099 , H01L2924/00
摘要： Various embodiments for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
摘要翻译：公开了用于防潮图像传感器封装结构和组装方法的各种实施例。本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的外壳结构和透明盖。壳体结构可以覆盖基本上所有的插入器芯片表面。在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。壳体结构还可以覆盖基本上所有的插入件附接表面。图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。

2. 发明授权

US06399464B1 Packaging die preparation 失效
标题翻译：包装模具制备
公开(公告)号：US06399464B1
公开(公告)日：2002-06-04
申请号：US09723708
申请日：2000-11-28
申请人： Tom A. Muntifering , Steven W. Heppler , Michael B. Ball
发明人： Tom A. Muntifering , Steven W. Heppler , Michael B. Ball
IPC分类号： H01L2131
CPC分类号： H01L21/6835 , H01L21/304 , H01L21/3043 , H01L21/6836 , H01L2221/68327 , H01L2221/6834
摘要： The present invention relates to a process for preparing a wafer for chip packaging that minimizes stress and torque on wafer components during back grinding. The wafer has fabricated thereon a plurality of dies in a die side thereof opposite a back side thereof. A protective coating is spun on the die side to protect the dies. The wafer is separated into a plurality of connected pieces by scratching or cutting a recess into streets or scribe lines in the die side. The connected pieces of the wafer are secured to a surface with the back side thereof exposed. Material is removed from the back side of the wafer by chemical, mechanical, or chemical-mechanical methods until each piece is separated or disconnected from the other pieces. The protective coating is removed. The pieces can be situated upon a flexible surface that is stretched to increase the separation between pieces. Each die in the die side of each piece is then packaged into a die package.
摘要翻译：本发明涉及一种制备用于芯片封装的晶片的方法，其使背面研磨期间的晶片组件上的应力和扭矩最小化。晶片已在其上制造多个模具，模具侧面与其后侧相对。在模具侧上旋转保护涂层以保护模具。通过将凹槽划伤或切割成模具侧的街道或划线，将晶片分离成多个连接件。晶片的连接片固定在其背面露出的表面上。通过化学，机械或化学机械方法从晶片的背面去除材料，直到每个片断与其他片断分离或断开。去除保护涂层。这些件可以位于被拉伸的柔性表面上以增加件之间的间隔。然后将每个模具侧的每个模具封装成模具包装。

3. 发明授权

US5248075A IC pin forming machine with integrated IC testing capability 失效
标题翻译： IC引脚成型机具有集成的IC测试能力
公开(公告)号：US5248075A
公开(公告)日：1993-09-28
申请号：US989253
申请日：1992-12-11
申请人： Jerry A. Young , Steven L. Mitchell , Steven W. Heppler
发明人： Jerry A. Young , Steven L. Mitchell , Steven W. Heppler
IPC分类号： H05K7/10 , H05K13/04
CPC分类号： H05K13/0473 , H05K7/1061 , Y10T29/49121 , Y10T29/53022
摘要： The present invention relates to integrated circuits (ICs) fabrication and testing. Particularly, there is an IC pin/lead trimming and forming machine that is adapted to electrically test ICs for electrical defects. Uniquely, the IC testing can occur at any pin forming station after the IC pins or leads have been electrically isolated from each other and from other ICs on a lead frame. This arrangement will allow for testing of the individual ICs much sooner than has hereinbefore existed after undertaking the encapsulation process.
摘要翻译：本发明涉及集成电路（IC）制造和测试。特别地，有一个IC引脚/引线修整和成型机，适用于电气测试电气缺陷的IC。独特的是，在IC引脚或引线彼此电隔离和引线框架上的其他IC之后，IC测试可能发生在任何引脚形成站。这种布置将允许在进行封装处理之后比在之前存在的时间更早地测试各个IC。

4. 发明授权

US08508034B2 Electronic devices 有权
标题翻译：电子设备
公开(公告)号：US08508034B2
公开(公告)日：2013-08-13
申请号：US13362644
申请日：2012-01-31
申请人： Todd O. Bolken , Cary J. Baerlocher , Steven W. Heppler , Chad A. Cobbley
发明人： Todd O. Bolken , Cary J. Baerlocher , Steven W. Heppler , Chad A. Cobbley
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L23/28 , B33Y80/00 , H01L21/4803 , H01L21/481 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/48 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L27/14683 , H01L2224/0401 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/00011 , H01L2224/45099 , H01L2924/00
摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
摘要翻译：公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的外壳结构和透明盖。壳体结构可以覆盖基本上所有的插入器芯片表面。在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。壳体结构还可以覆盖基本上所有的插入件附接表面。图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。

5. 发明授权

US07274095B2 Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers 有权
标题翻译：具有用于接收半导体器件的插座和包括这种插入件的组件和封装的插入器
公开(公告)号：US07274095B2
公开(公告)日：2007-09-25
申请号：US10863447
申请日：2004-06-08
申请人： Setho Sing Fee , Lim Thiam Chye , Steven W. Heppler , Leng Nam Yin , Keith Tan , Patrick Guay , Edmund Lua Koon Tian , Yap Kah Eng , Eric Tan Swee Seng
发明人： Setho Sing Fee , Lim Thiam Chye , Steven W. Heppler , Leng Nam Yin , Keith Tan , Patrick Guay , Edmund Lua Koon Tian , Yap Kah Eng , Eric Tan Swee Seng
IPC分类号： H01L23/02 , H01L31/0203 , H01L23/538 , H01L23/053
CPC分类号： H01L21/568 , H01L21/4846 , H01L21/6835 , H01L23/24 , H01L23/3128 , H01L23/3675 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/97 , H01L25/0655 , H01L25/105 , H01L2224/05554 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4911 , H01L2224/85001 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/18165 , H01L2924/19107 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.
摘要翻译：一种半导体器件封装插入器，包括基本上从其延伸的插座。还公开了用于将插入件与一个或多个半导体器件组装的方法。膜可以固定到插入件的底表面，以便至少部分地覆盖容器的底端。一个或多个半导体器件位于容器内，位于膜上。插座内的每个半导体器件然后可以电连接到插入器。引入到容器中的密封剂材料至少在容器内的每个半导体器件的外周的部分之间延伸，并且在容器的外围边缘延伸。固化，固化或硬化时，密封剂材料将每个半导体器件保持在容器内，并且保持每个半导体器件相对于插入件的横向位置。还公开了半导体器件封装和多芯片模块。

6. 发明授权

US08115296B2 Electronic device package 有权
标题翻译：电子设备包装
公开(公告)号：US08115296B2
公开(公告)日：2012-02-14
申请号：US12579187
申请日：2009-10-14
申请人： Todd O. Bolken , Cary J. Baerlocher , Steven W. Heppler , Chad A. Cobbley
发明人： Todd O. Bolken , Cary J. Baerlocher , Steven W. Heppler , Chad A. Cobbley
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L23/28 , B33Y80/00 , H01L21/4803 , H01L21/481 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/48 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L27/14683 , H01L2224/0401 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/00011 , H01L2224/45099 , H01L2924/00
摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
摘要翻译：公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的外壳结构和透明盖。壳体结构可以覆盖基本上所有的插入器芯片表面。在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。壳体结构还可以覆盖基本上所有的插入件附接表面。图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。

7. 发明申请

US20100264532A1 ELECTRONIC DEVICE PACKAGE 有权
标题翻译：电子设备包装
公开(公告)号：US20100264532A1
公开(公告)日：2010-10-21
申请号：US12579187
申请日：2009-10-14
申请人： Todd O. Bolken , Cary J. Baerlocher , Steven W. Heppler , Chad A. Cobbley
发明人： Todd O. Bolken , Cary J. Baerlocher , Steven W. Heppler , Chad A. Cobbley
IPC分类号： H01L23/10
CPC分类号： H01L23/28 , B33Y80/00 , H01L21/4803 , H01L21/481 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/48 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L27/14683 , H01L2224/0401 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/00011 , H01L2224/45099 , H01L2924/00
摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
摘要翻译：公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的壳体结构和透明盖。壳体结构可以覆盖基本上所有的插入器芯片表面。在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。壳体结构还可以覆盖基本上所有的插入件附接表面。图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。

8. 发明授权

US6162703A Packaging die preparation 失效
公开(公告)号：US6162703A
公开(公告)日：2000-12-19
申请号：US26999
申请日：1998-02-23
申请人： Tom A. Muntifering , Steven W. Heppler , Michael B. Ball
发明人： Tom A. Muntifering , Steven W. Heppler , Michael B. Ball
IPC分类号： H01L21/301 , H01L21/304 , H01L21/68
CPC分类号： H01L21/6835 , H01L21/304 , H01L21/3043 , H01L21/6836 , H01L2221/68327 , H01L2221/6834
摘要： The present invention relates to a process for preparing a wafer for chip packaging that minimizes stress and torque on wafer components during back grinding. The wafer has fabricated thereon a plurality of dies in a die side thereof opposite a back side thereof. A protective coating is spun on the die side to protect the dies. The wafer is separated into a plurality of connected pieces by scratching or cutting a recess into streets or scribe lines in the die side. The connected pieces of the wafer are secured to a surface with the back side thereof exposed. Material is removed from the back side of the wafer by chemical, mechanical, or chemical-mechanical methods until each piece is separated or disconnected from the other pieces. The protective coating is removed. The pieces can be situated upon a flexible surface that is stretched to increase the separation between pieces. Each die in the die side of each piece is then packaged into a die package.

9. 发明申请

US20120126386A1 ELECTRONIC DEVICES 有权
标题翻译：电子设备
公开(公告)号：US20120126386A1
公开(公告)日：2012-05-24
申请号：US13362644
申请日：2012-01-31
申请人： Todd O. Bolken , Cary J. Baerlocher , Steven W. Heppler , Chad A. Cobbley
发明人： Todd O. Bolken , Cary J. Baerlocher , Steven W. Heppler , Chad A. Cobbley
IPC分类号： H01L23/10
CPC分类号： H01L23/28 , B33Y80/00 , H01L21/4803 , H01L21/481 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/48 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L27/14683 , H01L2224/0401 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/00011 , H01L2224/45099 , H01L2924/00
摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
摘要翻译：公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的外壳结构和透明盖。壳体结构可以覆盖基本上所有的插入器芯片表面。在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。壳体结构还可以覆盖基本上所有的插入件附接表面。图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。

10. 发明授权

US07528007B2 Methods for assembling semiconductor devices and interposers 有权
标题翻译：组装半导体器件和插入件的方法
公开(公告)号：US07528007B2
公开(公告)日：2009-05-05
申请号：US11411287
申请日：2006-04-25
申请人： Setho Sing Fee , Lim Thiam Chye , Steven W. Heppler , Leng Nam Yin , Keith Tan , Patrick Guay , Edmund Lua Koon Tian , Yap Kah Eng , Eric Tan Swee Seng
发明人： Setho Sing Fee , Lim Thiam Chye , Steven W. Heppler , Leng Nam Yin , Keith Tan , Patrick Guay , Edmund Lua Koon Tian , Yap Kah Eng , Eric Tan Swee Seng
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： H01L21/568 , H01L21/4846 , H01L21/6835 , H01L23/24 , H01L23/3128 , H01L23/3675 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/97 , H01L25/0655 , H01L25/105 , H01L2224/05554 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4911 , H01L2224/85001 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/18165 , H01L2924/19107 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for assembling one or more semiconductor devices with an interposer includes positioning the one or more semiconductor devices within a receptacle that extends through the interposer, on a retention element that extends over at least a portion of the receptacle. Material may be introduced between at least a portion of an outer periphery of the one or more semiconductor devices and an inner periphery of the interposer to facilitate securing of the one or more semiconductor devices in place relative to the interposer. The retention element may be removed from the semiconductor devices. Once the one or more semiconductor devices are in place, they may be electrically connected to the interposer.
摘要翻译：一种用于将一个或多个半导体器件与插入件组装的方法包括将一个或多个半导体器件定位在延伸穿过插入件的插座内，在保持元件上，该保持元件在容器的至少一部分上延伸。可以在一个或多个半导体器件的外周的至少一部分与插入器的内周之间引入材料，以便于相对于插入件将一个或多个半导体器件固定在适当位置。保留元件可以从半导体器件移除。一旦一个或多个半导体器件就位，它们可以电连接到插入器。

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