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    • 5. 发明授权
    • Trench-gate semiconductor device
    • 沟槽栅半导体器件
    • US08901638B2
    • 2014-12-02
    • US13055742
    • 2009-07-27
    • Steven Thomas PeakePhil Rutter
    • Steven Thomas PeakePhil Rutter
    • H01L29/66
    • H01L29/7813H01L29/0878H01L29/1095H01L29/407H01L29/42368H01L29/7397
    • A trench-gate semiconductor device is disclosed, in which the player (10,6) which forms the body region (in a n-channel device) extends adjacent the trench (4) deeper into the device, to lie adjacent a lower trench electrode (3b, 3c). Since the p-layer extension (6) forms part of the channel, it must be very low doped, in order not to increase unduly the channel resistance in the on-state. The replacement of some of the out-diffusion resistance in the drift region by the (smaller) channel resistance results in a lower over-all Rdson. In the off-state, the p-layer forms, together with the underlying n-drift layer, a non-abrupt function, so that the depletion region in the off-state extends closer to the top surface (2) than for a conventional RSO trench-MOS, being split between the p- and n-layers, rather than all being in the n-drift region. The invention does not require a RESURF device structure, so has wide process windows, since the dopant levels and layer thicknesses do not have to be controlled to provide charge balancing.
    • 公开了一种沟槽栅半导体器件,其中形成身体区域(在n沟道器件中)的游戏者(10,6)在沟槽(4)附近延伸到设备中更深处以邻近下沟槽电极 (3b,3c)。 由于p层延伸部(6)形成沟道的一部分,所以必须是非常低的掺杂,以便不导致导通状态下的沟道电阻过度增加。 通过(较小的)通道电阻来替代漂移区域中的一些外扩散电阻导致较低的全部Rdson。 在关闭状态下,p层与下面的n漂移层一起形成非突然的功能,使得截止状态下的耗尽区域比常规的更靠近顶表面(2)延伸。 RSO沟槽MOS,分为p层和n层之间,而不是全部在n漂移区域中。 本发明不需要RESURF器件结构,因此具有宽的工艺窗口,因为不必控制掺杂剂水平和层厚度以提供电荷平衡。
    • 7. 发明申请
    • TRENCH-GATE SEMICONDUCTOR DEVICE
    • TRENCH-GATE半导体器件
    • US20110121384A1
    • 2011-05-26
    • US13055742
    • 2009-07-27
    • Steven Thomas PeakePhil Rutter
    • Steven Thomas PeakePhil Rutter
    • H01L29/78
    • H01L29/7813H01L29/0878H01L29/1095H01L29/407H01L29/42368H01L29/7397
    • A trench-gate semiconductor device is disclosed, in which the p-layer (10,6) which forms the body region (in a n-channel device) extends adjacent the trench (4) deeper into the device, to lie adjacent a lower trench electrode (3b, 3c). Since the p-layer extension (6) forms part of the channel, it must be very low doped, in order not to increase unduly the channel resistance in the on-state. The re-placement of some of the out-diffusion resistance in the drift region by the (smaller) channel resistance results in a lower over-all Rdson. In the off-state, the p-layer forms, together with the underlying n-drift layer, a non-abrupt function, so that the depletion region in the off-state extends closer to the top surface (2) than for a conventional RSO trench-MOS, being split between the p- and n-layers, rather than all being in the n-drift region. The invention does not require a RESURF device structure, so has wide process windows, since the dopant levels and layer thicknesses do not have to be controlled to provide charge balancing.
    • 公开了一种沟槽栅半导体器件,其中形成体区(在n沟道器件中)的p层(10,6)在沟槽(4)附近延伸到器件中更靠近下部 沟槽电极(3b,3c)。 由于p层延伸部(6)形成沟道的一部分,所以必须是非常低的掺杂,以便不导致导通状态下的沟道电阻过度增加。 通过(较小)沟道电阻重新放置漂移区域中的一些外扩散电阻导致较低的全部Rdson。 在关闭状态下,p层与下面的n漂移层一起形成非突然的功能,使得截止状态下的耗尽区域比常规的更靠近顶表面(2)延伸。 RSO沟槽MOS,分为p层和n层之间,而不是全部在n漂移区域中。 本发明不需要RESURF器件结构,因此具有宽的工艺窗口,因为不必控制掺杂剂水平和层厚度以提供电荷平衡。