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1. 发明授权

US07509727B2 Method of making a transformer 有权
标题翻译：制造变压器的方法
公开(公告)号：US07509727B2
公开(公告)日：2009-03-31
申请号：US11838911
申请日：2007-08-15
申请人： Steven R. Snyder
发明人： Steven R. Snyder
IPC分类号： H01F7/06
CPC分类号： H05K3/4611 , H01F41/042 , H01F41/046 , H01F2017/002 , H01F2027/2809 , H05K1/0306 , H05K1/16 , H05K3/4629 , H05K2203/308 , Y10T29/49002 , Y10T29/4902 , Y10T29/49069 , Y10T29/49071 , Y10T29/49073 , Y10T29/49078 , Y10T29/49165 , Y10T29/49218
摘要： A transformer and method of making includes first half primary and secondary windings as metallic circuits that are etched on a metallic cladding of a first liquid crystal polymer (LCP) sheet. Secondary windings are positioned in spaced relation to the primary windings. A second LCP sheet is applied over the first LCP sheet. Second half primary and secondary windings are etched as metallic circuits on a metallic cladding of a second LCP sheet. Respective first and second half primary windings are interconnected to each other and the first and second half secondary windings are connected to each other by conductive vias.
摘要翻译：变压器和制造方法包括作为在第一液晶聚合物（LCP）片材的金属包层上被蚀刻的金属电路的第一半原子和次级绕组。次级绕组与初级绕组间隔开定位。第二个LCP表应用在第一个LCP表上。在第二个LCP片材的金属包层上刻蚀第二个半导体和次级绕组作为金属电路。相应的第一和第二半初级绕组彼此互连，并且第一和第二半次级绕组通过导电通孔彼此连接。

2. 发明授权

US07449987B2 Transformer and associated method of making 失效
标题翻译：变压器及相关制作方法
公开(公告)号：US07449987B2
公开(公告)日：2008-11-11
申请号：US11428947
申请日：2006-07-06
申请人： Steven R. Snyder
发明人： Steven R. Snyder
IPC分类号： H01F5/00
CPC分类号： H01F41/041 , H01F27/2804 , H01F30/04 , Y10T29/4902 , Y10T29/49073
摘要： A transformer and method of making same is disclosed. A substantially planar configured, first half primary winding and first half secondary winding are formed over a substantially planar base. The first half primary and secondary windings are overlaid with a ferrite layer. A substantially planar configured, second half primary winding and second half secondary winding are formed over the ferrite layer in stacked relation to the respective first half primary winding and secondary windings. The respective first and second half primary windings and respective first and second half secondary windings are interconnected together.
摘要翻译：公开了一种变压器及其制造方法。基本上平面的构造的第一半原始绕组和第一半次级绕组形成在基本平坦的基底上。前半个初级和次级绕组覆盖有铁素体层。基本上平面的构造的第二半初级绕组和第二半次级绕组以与各自的第一半原始绕组和次级绕组堆叠的关系形成在铁氧体层的上方。相应的第一和第二半初级绕组以及相应的第一和第二半次级绕组互连在一起。

3. 发明授权

US07391293B2 Transformer and associated method of making using liquid crystal polymer (LCP) material 有权
标题翻译：变压器及相关使用液晶聚合物（LCP）材料的制造方法
公开(公告)号：US07391293B2
公开(公告)日：2008-06-24
申请号：US11838921
申请日：2007-08-15
申请人： Steven R. Snyder
发明人： Steven R. Snyder
IPC分类号： H01F5/00
CPC分类号： H05K3/4611 , H01F41/042 , H01F41/046 , H01F2017/002 , H01F2027/2809 , H05K1/0306 , H05K1/16 , H05K3/4629 , H05K2203/308 , Y10T29/49002 , Y10T29/4902 , Y10T29/49069 , Y10T29/49071 , Y10T29/49073 , Y10T29/49078 , Y10T29/49165 , Y10T29/49218
摘要： A transformer and method of making includes first half primary and secondary windings as metallic circuits that are etched on a metallic cladding of a first liquid crystal polymer (LCP) sheet. Secondary windings are positioned in spaced relation to the primary windings. A second LCP sheet is applied over the first LCP sheet. Second half primary and secondary windings are etched as metallic circuits on a metallic cladding of a second LCP sheet. Respective first and second half primary windings are interconnected to each other and the first and second half secondary windings are connected to each other by conductive vias.
摘要翻译：变压器和制造方法包括作为在第一液晶聚合物（LCP）片材的金属包层上被蚀刻的金属电路的第一半原子和次级绕组。次级绕组与初级绕组间隔开定位。第二个LCP表应用在第一个LCP表上。在第二个LCP片材的金属包层上刻蚀第二个半导体和次级绕组作为金属电路。相应的第一和第二半初级绕组彼此互连，并且第一和第二半次级绕组通过导电通孔彼此连接。

4. 发明申请

US20080007608A1 BALL GRID ARRAY (BGA) CONNECTION SYSTEM AND RELATED METHOD AND BALL SOCKET 失效
标题翻译：球形阵列（BGA）连接系统及相关方法和球窝
公开(公告)号：US20080007608A1
公开(公告)日：2008-01-10
申请号：US11428902
申请日：2006-07-06
申请人： Steven C. Smith , Steven R. Snyder
发明人： Steven C. Smith , Steven R. Snyder
IPC分类号： B41J2/385
CPC分类号： H05K3/32 , H05K3/4015 , H05K2201/1031 , H05K2201/10333 , H05K2201/10734 , H05K2201/10962 , Y02P70/611
摘要： A ball grid array (BGA) connection system includes an integrated circuit (IC) package that includes a plurality of conductive balls forming a ball grid array (BGA) arranged in a matrix pattern. A printed circuit board (PCB) includes a plurality of ball sockets arranged in a corresponding matrix pattern. Each ball socket includes a base having one side that engages the PCB and an opposing side configured for seating a conductive ball of the BGA. A plurality of prongs are secured to and extend from the base and configured to receive and hold a conductive ball into contact with the base.
摘要翻译：球栅阵列（BGA）连接系统包括集成电路（IC）封装，其包括形成以矩阵图案布置的球栅阵列（BGA）的多个导电球。印刷电路板（PCB）包括以相应的矩阵图形排列的多个球窝。每个球窝包括具有接合PCB的一侧的基座和被配置用于安置BGA的导电球的相对侧。多个插脚被固定到基座并从基座延伸并且被构造成接纳和保持导电球与基座接触。

5. 发明申请

US20120181073A1 ELECTRONIC DEVICE HAVING LIQUID CRYSTAL POLYMER SOLDER MASK AND OUTER SEALING LAYERS, AND ASSOCIATED METHODS 有权
标题翻译：具有液晶聚合物焊接面罩和外部密封层的电子设备及相关方法
公开(公告)号：US20120181073A1
公开(公告)日：2012-07-19
申请号：US13007072
申请日：2011-01-14
申请人： Louis Joseph RENDEK, JR. , Casey Philip Rodriguez , Steven R. Snyder
发明人： Louis Joseph RENDEK, JR. , Casey Philip Rodriguez , Steven R. Snyder
IPC分类号： H05K1/03 , H05K3/00
CPC分类号： H05K1/186 , H01L2224/16227 , H01L2224/73253 , H01L2924/15153 , H01L2924/15313 , H01L2924/19105 , H05K3/3436 , H05K3/3452 , H05K3/4602 , H05K2201/0141 , H05K2201/10674 , H05K2203/063 , Y10T29/49155
摘要： An electronic device includes a substrate with a circuit layer thereon that has a solder pad. There is a liquid crystal polymer (LCP) solder mask on the substrate that has an aperture aligned with the solder pad. There is a fused seam between the substrate and the LCP solder mask. Solder is in the aperture, and a circuit component is electrically coupled to the solder pad via the solder. A first dielectric layer stack having a first plurality of dielectric layers is on the LCP solder mask and has an aperture aligned with the solder pad. There is a first LCP outer sealing layer on the first dielectric layer stack, and a second dielectric layer stack having a second plurality of dielectric layers on the substrate on a side thereof opposite the LCP solder mask. Further, there is a second LCP outer sealing layer on the second dielectric layer stack.
摘要翻译：电子器件包括其上具有电路层的衬底，其具有焊盘。在基板上有一个液晶聚合物（LCP）焊接掩模，其具有与焊盘对准的孔。在基板和LCP焊接掩模之间存在熔接。焊料在孔中，并且电路部件通过焊料电耦合到焊盘。具有第一多个电介质层的第一介电层堆叠在LCP焊接掩模上，并且具有与焊盘对准的孔。在第一介电层堆叠上存在第一LCP外密封层，以及第二介电层堆叠，其在与LCP焊接掩模相对的一侧上的衬底上具有第二多个电介质层。此外，在第二介质层堆叠上存在第二LCP外密封层。

6. 发明授权

US07340825B2 Method of making a transformer 有权
标题翻译：制造变压器的方法
公开(公告)号：US07340825B2
公开(公告)日：2008-03-11
申请号：US11428963
申请日：2006-07-06
申请人： Steven R. Snyder
发明人： Steven R. Snyder
IPC分类号： H01F7/06
CPC分类号： H05K3/4611 , H01F41/042 , H01F41/046 , H01F2017/002 , H01F2027/2809 , H05K1/0306 , H05K1/16 , H05K3/4629 , H05K2203/308 , Y10T29/49002 , Y10T29/4902 , Y10T29/49069 , Y10T29/49071 , Y10T29/49073 , Y10T29/49078 , Y10T29/49165 , Y10T29/49218
摘要： A transformer and method of making includes first half primary and secondary windings as metallic circuits that are etched on a metallic cladding of a first liquid crystal polymer (LCP) sheet. Secondary windings are positioned in spaced relation to the primary windings. A second LCP sheet is applied over the first LCP sheet. Second half primary and secondary windings are etched as metallic circuits on a metallic cladding of a second LCP sheet. Respective first and second half primary windings are interconnected to each other and the first and second half secondary windings are connected to each other by conductive vias.
摘要翻译：变压器和制造方法包括作为在第一液晶聚合物（LCP）片材的金属包层上被蚀刻的金属电路的第一半原子和次级绕组。次级绕组与初级绕组间隔开定位。第二个LCP表应用在第一个LCP表上。在第二个LCP片材的金属包层上刻蚀第二个半导体和次级绕组作为金属电路。相应的第一和第二半初级绕组彼此互连，并且第一和第二半次级绕组通过导电通孔彼此连接。

7. 发明授权

US07695287B2 Ball grid array (BGA) connection system and related method and ball socket 失效
标题翻译：球栅阵列（BGA）连接系统及相关方法及球窝
公开(公告)号：US07695287B2
公开(公告)日：2010-04-13
申请号：US11428902
申请日：2006-07-06
申请人： Steven C. Smith , Steven R. Snyder
发明人： Steven C. Smith , Steven R. Snyder
IPC分类号： H01R9/09
CPC分类号： H05K3/32 , H05K3/4015 , H05K2201/1031 , H05K2201/10333 , H05K2201/10734 , H05K2201/10962 , Y02P70/611
摘要： A ball grid array (BGA) connection system includes an integrated circuit (IC) package that includes a plurality of conductive balls forming a ball grid array (BGA) arranged in a matrix pattern. A printed circuit board (PCB) includes a plurality of ball sockets arranged in a corresponding matrix pattern. Each ball socket includes a base having one side that engages the PCB and an opposing side configured for seating a conductive ball of the BGA. A plurality of prongs are secured to and extend from the base and configured to receive and hold a conductive ball into contact with the base.
摘要翻译：球栅阵列（BGA）连接系统包括集成电路（IC）封装，其包括形成以矩阵图案布置的球栅阵列（BGA）的多个导电球。印刷电路板（PCB）包括以相应的矩阵图形排列的多个球窝。每个球窝包括具有接合PCB的一侧的基座和被配置用于安置BGA的导电球的相对侧。多个插脚被固定到基座并从基座延伸并且被构造成接纳和保持导电球与基座接触。

8. 发明授权

US07285000B2 Electro-fluidic interconnect attachment 失效
标题翻译：电流互连附件
公开(公告)号：US07285000B2
公开(公告)日：2007-10-23
申请号：US11202530
申请日：2005-08-12
申请人： Michael Pleskach , Paul Koeneman , Carol Gamlen , Steven R. Snyder
发明人： Michael Pleskach , Paul Koeneman , Carol Gamlen , Steven R. Snyder
IPC分类号： H01R4/60
CPC分类号： F16L25/01 , F16L49/02 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/49147 , Y10T29/49155 , Y10T29/49208
摘要： An electro-fluidic interconnection. The interconnection includes a body (200) formed of a ceramic material. The body (200) is provided with an aperture (206) having a profile suitable for receiving an interconnecting conduit (400). The interconnecting conduit (400) can be formed of the same type of ceramic material as the body (200). The conduit (400) is defined by an outer shell (403) with a hollow bore (402) for transporting a fluid. A mating portion (404) of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion (404) of the conduit (400) can be compression fitted within the aperture (206). Conductive traces (406, 208) on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.
摘要翻译：电流互连。互连包括由陶瓷材料形成的主体（200）。主体（200）设置有具有适于接收互连导管（400）的轮廓的孔（206）。互连导管（400）可以由与本体（200）相同类型的陶瓷材料形成。导管（400）由具有用于输送流体的中空孔（402）的外壳（403）限定。导管的配合部分（404）具有与孔的轮廓匹配的外部轮廓。此外，导管（400）的配合部分（404）可以压缩配合在孔（206）内。导管和主体上的导电迹线（406,208）可以电连接以完成电流互连。

9. 发明授权

US08472207B2 Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods 有权
标题翻译：具有液晶聚合物焊接掩模和外密封层的电子器件及相关方法
公开(公告)号：US08472207B2
公开(公告)日：2013-06-25
申请号：US13007072
申请日：2011-01-14
申请人： Louis Joseph Rendek, Jr. , Casey Philip Rodriguez , Steven R. Snyder
发明人： Louis Joseph Rendek, Jr. , Casey Philip Rodriguez , Steven R. Snyder
IPC分类号： H05K1/18
CPC分类号： H05K1/186 , H01L2224/16227 , H01L2224/73253 , H01L2924/15153 , H01L2924/15313 , H01L2924/19105 , H05K3/3436 , H05K3/3452 , H05K3/4602 , H05K2201/0141 , H05K2201/10674 , H05K2203/063 , Y10T29/49155
摘要： An electronic device includes a substrate with a circuit layer thereon that has a solder pad. There is a liquid crystal polymer (LCP) solder mask on the substrate that has an aperture aligned with the solder pad. There is a fused seam between the substrate and the LCP solder mask. Solder is in the aperture, and a circuit component is electrically coupled to the solder pad via the solder. A first dielectric layer stack having a first plurality of dielectric layers is on the LCP solder mask and has an aperture aligned with the solder pad. There is a first LCP outer sealing layer on the first dielectric layer stack, and a second dielectric layer stack having a second plurality of dielectric layers on the substrate on a side thereof opposite the LCP solder mask. Further, there is a second LCP outer sealing layer on the second dielectric layer stack.
摘要翻译：电子器件包括其上具有电路层的衬底，其具有焊盘。在基板上有一个液晶聚合物（LCP）焊接掩模，其具有与焊盘对准的孔。在基板和LCP焊接掩模之间存在熔接。焊料在孔中，并且电路部件通过焊料电耦合到焊盘。具有第一多个电介质层的第一介电层堆叠在LCP焊接掩模上，并且具有与焊盘对准的孔。在第一介电层堆叠上存在第一LCP外密封层，以及第二介电层堆叠，其在与LCP焊接掩模相对的一侧上的衬底上具有第二多个电介质层。此外，在第二介质层堆叠上存在第二LCP外密封层。

10. 发明申请

US20080141529A1 Electro-Fluidic Interconnect Attachment 失效
标题翻译：电流互连附件
公开(公告)号：US20080141529A1
公开(公告)日：2008-06-19
申请号：US11834797
申请日：2007-08-07
申请人： Michael Pleskach , Paul Koeneman , Carol Gamlen , Steven R. Snyder
发明人： Michael Pleskach , Paul Koeneman , Carol Gamlen , Steven R. Snyder
IPC分类号： H01R43/16
CPC分类号： F16L25/01 , F16L49/02 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/49147 , Y10T29/49155 , Y10T29/49208
摘要： An electro-fluidic interconnection. The interconnection includes a body (200) formed of a ceramic material. The body (200) is provided with an aperture (206) having a profile suitable for receiving an interconnecting conduit (400). The interconnecting conduit (400) can be formed of the same type of ceramic material as the body (200). The conduit (400) is defined by an outer shell (403) with a hollow bore (402) for transporting a fluid. A mating portion (404) of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion (404) of the conduit (400) can be compression fitted within the aperture (206). Conductive traces (406, 208) on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.
摘要翻译：电流互连。互连包括由陶瓷材料形成的主体（200）。主体（200）设置有具有适于接收互连导管（400）的轮廓的孔（206）。互连导管（400）可以由与本体（200）相同类型的陶瓷材料形成。导管（400）由具有用于输送流体的中空孔（402）的外壳（403）限定。导管的配合部分（404）具有与孔的轮廓匹配的外部轮廓。此外，导管（400）的配合部分（404）可以压缩配合在孔（206）内。导管和主体上的导电迹线（406,208）可以电连接以完成电流互连。

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