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1. 发明授权

US4197170A Radiation sources and process 失效
标题翻译：辐射源和过程
公开(公告)号：US4197170A
公开(公告)日：1980-04-08
申请号：US916401
申请日：1978-06-16
申请人： Harold A. Malson , Harold B. Honious , Stanley E. Moyer , Edward F. Janzow
发明人： Harold A. Malson , Harold B. Honious , Stanley E. Moyer , Edward F. Janzow
IPC分类号： C25D7/00 , C25D3/54 , C25D3/56 , G21G4/00 , C09K3/00
CPC分类号： G21G4/00 , C25D3/54 , C25D3/56
摘要： The invention relates to radiation sources comprising a substrate having an electrically-conductive non-radioactive metal surface, a layer of a metal radioactive isotope of the Scandium group, which in addition to scandium, yttrium, lanthanum and actinium, includes all the lanthanide and actinide series of elements, with the actinide series usually being preferred because of the nature of the radioactive isotopes therein, particularly americium-241, curium-244, plutonium-238, californium-252 and promethium-147, and a non-radioactive bonding metal codeposited on the surface by electroplating the isotope and bonding metal from an electrolytic solution, the isotope being present in the layer in minor amount as compared to the bonding metal, and with or without a non-radioactive protective metal coating covering the isotype and bonding metal on the surface, the coating being sufficiently thin to permit radiation to pass through the coating. The invention also relates to a process for providing radiation sources comprising codepositing a layer of the metal radioactive isotope with a non-radioactive bonding metal from an electrolytic solution in which the isotope is present in minor molar amount as compared to the bonding metal such that the codeposited layer contains a minor molar amount of the isotope compared to the bonding metal by electroplating on an electrically-conductive non-radioactive metal surface of a cathode substrate, and with or without depositing a non-radioactive protective metal coating over the isotope and bonding metal on The surface, the coating being sufficiently thin to permit radiation to pass through the coating.
摘要翻译：本发明涉及辐射源，其包括具有导电非放射性金属表面的基底，钪基的金属放射性同位素层，除了钪，钇，镧和锕之外，还包括所有镧系元素和锕系元素由于其中放射性同位素的性质，特别是ium -241，ium -244，钚-238，ium-252和ium-147，锕系系列通常是优选的，并且非放射性键合金属共沉积在表面上通过电解同位素并从电解溶液中接合金属，与接合金属相比，同位素以少量存在于该层中，并且具有或不具有覆盖同种型和结合金属的非放射性保护金属涂层表面，涂层足够薄以允许辐射通过涂层。本发明还涉及一种用于提供辐射源的方法，该方法包括将金属放射性同位素层与来自电解液的非放射性键合金属共沉积，其中与接合金属相比，同位素以少量摩尔量存在，使得通过电镀在阴极基底的导电非放射性金属表面上，并且在或不与非同位素和结合金属上沉积非放射性保护金属涂层，与共轭金属相比，共沉积层含有少量的同位素在表面上，涂层足够薄以允许辐射通过涂层。

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